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    Method for using CVD process to encapsulate coil in a magnetic write head
    4.
    发明授权
    Method for using CVD process to encapsulate coil in a magnetic write head 失效
    使用CVD工艺将线圈封装在磁写头中的方法

    公开(公告)号：US07627942B2

    公开(公告)日：2009-12-08

    申请号：US11090457

    申请日：2005-03-25

    申请人： Richard Hsiao ,  Wipul Pemsiri Jayasekara ,  Howard Gordon Zolla

    发明人： Richard Hsiao ,  Wipul Pemsiri Jayasekara ,  Howard Gordon Zolla

    IPC分类号： G11B5/17

    CPC分类号： G11B5/3133 ,  G11B5/17 ,  G11B5/3136 ,  G11B5/3163 ,  Y10T29/49041 ,  Y10T29/4906 ,  Y10T29/49064

    摘要： A method for fabricating a magnetic write head with a coil with a high aspect ratio using a Chemical Vapor Deposition process such as Atomic Layer Deposition (ALD), High Speed ALD, Plasma Enhanced ALD (PEALD), Plasma Enhanced Chemical Vapor Deposition (PECVD) or Low Pressure Chemical Vapor Deposition (LPCVD) to form encapsulating films over the coils without voids is disclosed. Materials which can be used for encapsulation include Al2O3, SiO2, AlN, Ta2O5, HfO2, ZrO2, and YtO3. The use of an ultra-conformal deposition process allows the pitch of the coils to be smaller than it is possible in the prior art. The method also allows materials with a smaller coefficient of thermal expansion than hardbake photoresist to be used with resulting improvements in thermal protrusion characteristics.

    摘要翻译： 使用诸如原子层沉积（ALD），高速ALD，等离子体增强ALD（PEALD），等离子体增强化学气相沉积（PECVD）等化学气相沉积工艺制造具有高纵横比的线圈的磁写头的方法， 或低压化学气相沉积（LPCVD）以在无空隙的线圈上形成封装膜。 可用于封装的材料包括Al2O3，SiO2，AlN，Ta2O5，HfO2，ZrO2和YtO3。 使用超适形沉积工艺允许线圈的间距小于现有技术中可能的间距。 该方法还允许使用具有比硬质光刻胶更小的热膨胀系数的材料，从而提高热突起特性。

    Method to reduce corner shunting during fabrication of CPP read heads
    5.
    发明授权
    Method to reduce corner shunting during fabrication of CPP read heads 有权
    在CPP读取头制造过程中减少拐角分流的方法

    公开(公告)号：US07839607B2

    公开(公告)日：2010-11-23

    申请号：US11890868

    申请日：2007-08-07

    申请人： Robert E. Fontana, Jr. ,  Ying Hong ,  Wipul Pemsiri Jayasekara ,  Howard Gordon Zolla

    发明人： Robert E. Fontana, Jr. ,  Ying Hong ,  Wipul Pemsiri Jayasekara ,  Howard Gordon Zolla

    IPC分类号： G11B5/127

    CPC分类号： B82Y10/00 ,  B82Y25/00 ,  G11B5/3163 ,  G11B5/3932 ,  G11B2005/3996 ,  Y10T428/1171

    摘要： A method is presented for fabricating a CPP read head having a CPP read head sensor and a hard bias layer which includes forming a strip of sensor material in a sensor material region, and depositing strips of fast-milling dielectric material in first and second fast-milling dielectric material regions adjacent to the sensor material region. A protective layer and a layer of masking material are deposited on the strip of sensor material and the strips of fast-milling dielectric material to provide masked areas and exposed areas. A shaping source, such as an ion milling source, is provided which shapes the exposed areas. Hard bias material is then deposited on the regions of sensor material and fast-milling dielectric material to form caps on each of these regions. The caps of hard bias material and the masking material are then removed from each of these regions.

    摘要翻译： 提出了一种用于制造具有CPP读取头传感器和硬偏置层的CPP读取头的方法，该CPP读取头包括在传感器材料区域中形成传感器材料条，以及将快速研磨电介质材料的条带放置在第一和第二快速接头中， 研磨与传感器材料区域相邻的介电材料区域。 保护层和掩蔽材料层沉积在传感器材料条和快速研磨电介质材料条上，以提供掩蔽区域和暴露区域。 提供成形源，例如离子铣削源，其形成暴露的区域。 然后将硬偏置材料沉积在传感器材料和快速研磨电介质材料的区域上，以在这些区域中的每一个上形成盖。 然后从这些区域中的每一个去除硬偏置材料的盖子和掩模材料。

    Method to fabricate side shields for a magnetic sensor
    6.
    发明授权
    Method to fabricate side shields for a magnetic sensor 失效
    制造磁性传感器侧面屏蔽的方法

    公开(公告)号：US07574791B2

    公开(公告)日：2009-08-18

    申请号：US11126508

    申请日：2005-05-10

    申请人： Satoru Araki ,  Robert Stanley Beach ,  Marie-Claire Cyrille ,  Wipul Pemsiri Jayasekara ,  Quang Le ,  Jui-Lung Li ,  David John Seagle ,  Howard Gordon Zolla

    发明人： Satoru Araki ,  Robert Stanley Beach ,  Marie-Claire Cyrille ,  Wipul Pemsiri Jayasekara ,  Quang Le ,  Jui-Lung Li ,  David John Seagle ,  Howard Gordon Zolla

    IPC分类号： G11B5/187

    CPC分类号： G11B5/3909 ,  B82Y10/00 ,  G11B5/112 ,  G11B5/3169 ,  G11B5/3906 ,  Y10T29/49041 ,  Y10T29/49044 ,  Y10T29/49046

    摘要： A method for fabricating magnetic side shields for an MR sensor of a magnetic head. Following the deposition of MR sensor layers, a first DLC layer is deposited. Milling mask layers are then deposited, and outer portions of the milling mask layers are removed such that a remaining central portion of the milling mask layers is formed having straight sidewalls and no undercuts. Outer portions of the sensor layers are then removed such that a relatively thick remaining central portion of the milling mask resides above the remaining sensor layers. A thin electrical insulation layer is deposited, followed by the deposition of magnetic side shields. A second DLC layer is deposited and the remaining mask layers are then removed utilizing a chemical mechanical polishing (CMP) liftoff step. Thereafter, the first DLC layer and the second DLC layer are removed and a second magnetic shield layer is then fabricated thereabove.

    摘要翻译： 一种用于制造用于磁头的MR传感器的磁性侧屏蔽的方法。 在MR传感器层的沉积之后，沉积第一DLC层。 然后沉积铣削掩模层，并且去除铣削掩模层的外部，使得铣削掩模层的剩余中心部分形成为具有直的侧壁并且没有底切。 然后去除传感器层的外部部分，使得铣削掩模的相对较厚的剩余中心部分位于剩余传感器层的上方。 沉积薄的电绝缘层，随后沉积磁性侧屏蔽层。 沉积第二DLC层，然后利用化学机械抛光（CMP）剥离步骤除去剩余的掩模层。 此后，去除第一DLC层和第二DLC层，然后在其上制造第二磁屏蔽层。

    Method to improve ability to perform CMP-assisted liftoff for trackwidth definition
    7.
    发明授权
    Method to improve ability to perform CMP-assisted liftoff for trackwidth definition 失效
    提高执行CMP辅助提升能力的方法，用于跟踪宽度定义

    公开(公告)号：US07270758B2

    公开(公告)日：2007-09-18

    申请号：US11081222

    申请日：2005-03-15

    申请人： Shawn Marie Collier Hernandez ,  Wipul Pemsiri Jayasekara ,  Timothy J. Minvielle ,  Benjamin Lu chen Wang ,  Howard Gordon Zolla

    发明人： Shawn Marie Collier Hernandez ,  Wipul Pemsiri Jayasekara ,  Timothy J. Minvielle ,  Benjamin Lu chen Wang ,  Howard Gordon Zolla

    IPC分类号： B44C1/22

    CPC分类号： G11B5/3932 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/3163 ,  G11B2005/3996 ,  Y10T29/26 ,  Y10T29/49028 ,  Y10T29/49044 ,  Y10T29/49052

    摘要： A method is presented for fabricating a read head having a read head sensor and a hard bias/lead layer which includes depositing a strip of sensor material in a sensor material region, and depositing strips of fast-milling dielectric material in first and second fast-milling dielectric material regions adjacent to the sensor material region. A protective layer and a layer of masking material is deposited on the strip of sensor material and the strips of fast-milling dielectric material to provide masked areas and exposed areas. A shaping source, such as an ion milling source, is provided which shapes the exposed areas. Hard bias/lead material is then deposited on the regions of sensor material and fast-milling dielectric material to form first and second leads and a cap on each of these regions. The cap of hard bias/lead material and the masking material is then removed from each of these regions.

    摘要翻译： 提出了一种用于制造具有读取头传感器和硬偏压/引线层的读取头的方法，该读取头传感器和硬偏置/引线层包括在传感器材料区域中沉积传感器材料条，以及在第一和第二快速接头中沉积快速铣削介电材料的条带， 研磨与传感器材料区域相邻的介电材料区域。 保护层和掩蔽材料层沉积在传感器材料条和快速铣削电介质材料条上，以提供掩蔽区域和暴露区域。 提供成形源，例如离子铣削源，其形成暴露的区域。 然后将硬偏置/引线材料沉积在传感器材料和快速研磨电介质材料的区域上，以在这些区域中的每一个上形成第一和第二引线和盖。 然后从这些区域中的每一个去除硬偏压/铅材料的盖和掩模材料。

    Feature size reduction in thin film magnetic head using low temperature deposition coating of photolithographically-defined trenches
    10.
    发明授权
    Feature size reduction in thin film magnetic head using low temperature deposition coating of photolithographically-defined trenches 有权
    使用光刻限定沟槽的低温沉积涂层的薄膜磁头的特征尺寸减小

    公开(公告)号：US06877213B2

    公开(公告)日：2005-04-12

    申请号：US10041004

    申请日：2002-01-07

    申请人： Howard Gordon Zolla

    发明人： Howard Gordon Zolla

    IPC分类号： G11B5/31 ,  G11B5/33 ,  G11B5/39 ,  G11B5/127 ,  H04R31/00

    CPC分类号： G11B5/3903 ,  G11B5/3116 ,  G11B5/3163 ,  G11B5/332 ,  G11B5/3967 ,  Y10T29/49025 ,  Y10T29/49041 ,  Y10T29/49046

    摘要： A method for reducing feature size in a thin film magnetic write head includes plating a seed layer over a selected base layer, spinning a photoresist layer onto the seed layer, defining a trench in the photoresist layer, depositing an insulative spacer layer to cover the trench side walls using a low temperature chemical vapor deposition process, anisotropically etching to remove spacer layer material from the bottom of the trench and thereby expose the plating seed layer while leaving intact vertical portions of the spacer layer that cover the trench side walls and narrow its width, forming a structure of reduced feature size by electroplating metallic material into the narrowed trench, stripping away the photoresist layer and the spacer layer vertical portions, and milling or sputter etching the plating seed layer to leave a structure of reduced feature size.

    摘要翻译： 一种用于减小薄膜磁写头中的特征尺寸的方法包括在所选择的基层上电镀种子层，将光致抗蚀剂层旋转到种子层上，在光致抗蚀剂层中限定沟槽，沉积绝缘间隔层以覆盖沟槽 侧壁，使用低温化学气相沉积工艺，各向异性蚀刻以从沟槽的底部去除间隔层材料，从而暴露电镀种子层，同时留下覆盖沟槽侧壁的间隔层的完整垂直部分并使其宽度变窄 通过将金属材料电镀到狭窄的沟槽中，剥离光致抗蚀剂层和间隔层垂直部分，并且研磨或溅射蚀刻电镀种子层以留下特征尺寸减小的结构，从而形成尺寸减小的结构。