Current mode differential to single-ended conversion circuit for a
magnetic wheel speed sensor
    2.
    发明授权
    Current mode differential to single-ended conversion circuit for a magnetic wheel speed sensor 失效
    用于磁轮速度传感器的电流模式差分至单端转换电路

    公开(公告)号:US6133728A

    公开(公告)日:2000-10-17

    申请号:US80384

    申请日:1998-05-18

    CPC分类号: G01P3/481 G01P3/488 G01P3/489

    摘要: A variable reluctance sensor interface module having a variable attenuation circuit and a rectifier and differential single-ended conversion circuit for operating in a current mode to attenuate a differential input voltage. The variable attenuation circuit receives an input differential voltage from a magnetic sensor and converts the differential voltage to current. First and second current sourcing circuits, each including a plurality of current sourcing branches, receives the current and provides current attenuation by switching in and out transistor-based current sourcing branches. The rectifier and differential to single-ended conversion circuit converts the variably attenuated currents to a voltage output.

    摘要翻译: 具有可变衰减电路的可变磁阻传感器接口模块和用于在电流模式下操作以衰减差分输入电压的整流器和差分单端转换电路。 可变衰减电路从磁传感器接收输入差分电压,并将差分电压转换为电流。 每个包括多个电流源分支的第一和第二电流源电路接收电流并通过切换入和基于晶体管的电流源分支来提供电流衰减。 整流器和差分到单端转换电路将可变衰减电流转换为电压输出。

    Silicon micromachined motion sensor and method of making
    3.
    发明授权
    Silicon micromachined motion sensor and method of making 失效
    硅微加工运动传感器及其制作方法

    公开(公告)号:US5831162A

    公开(公告)日:1998-11-03

    申请号:US785683

    申请日:1997-01-21

    摘要: A method for making and vacuum packaging a silicon micromachined motion sensor, such as a gyroscope, at the chip level. The method involves micromachining a trench-isolated sensing element in a sensing chip, and then attaching a circuit chip to enclose the sensing element. Solder bumps serve to attach the circuit chip to the sensing chip, form a hermetic seal to enable vacuum-packaging of the sensor, and electrically interconnect the sensing chip with the circuit chip. Conductive runners formed on the enclosed surface of the circuit chip serve to electrically interconnect the sensing element with its associated sensing structures.

    摘要翻译: 一种在芯片级制造和真空包装硅微加工运动传感器(例如陀螺仪)的方法。 该方法涉及在感测芯片中微加工沟槽隔离的感测元件,然后附接电路芯片以包围感测元件。 焊接凸起用于将电路芯片附接到感测芯片,形成气密密封以实现传感器的真空包装,并将感测芯片与电路芯片电互连。 形成在电路芯片的封闭表面上的导电流道用于将感测元件与其相关联的感测结构电互连。

    Integrated transducer amplifier with zener-zap programming
    4.
    发明授权
    Integrated transducer amplifier with zener-zap programming 失效
    具有齐纳瓦编程功能的集成式传感器放大器

    公开(公告)号:US5796298A

    公开(公告)日:1998-08-18

    申请号:US422153

    申请日:1995-04-14

    IPC分类号: G01L9/12 G01P21/00 H01L25/00

    CPC分类号: G01P21/00 G01L9/065

    摘要: In accordance with the teachings of the present invention, a programmable integrated transducer amplifier circuit is provided which receives differential outputs from a transducer, such as a pressure or accelerometer transducer. The programmable integrated transducer amplifier circuit includes binary adjustable circuits that are programmed in response to binary coded signals. The binary adjustable circuits generate binary weighted currents that are employed to adjust the operating characteristics of the amplifier circuit. The binary coded signals are received from a programmable memory array which includes a plurality of memory cells that store binary information. Each of the memory cells are programmed when coupled to a programming signal. Additionally, the memory array has pretest capability for testing outputs of the memory cells prior to permanently programming the respective memory cells. Additionally, the integrated transducer amplifier circuit automatically compensates for variations in the operating temperature of the amplifier circuit. The method of temperature compensation is accomplished by operating the programmable integrated transducer amplifier circuit at a first temperature such that a temperature compensation voltage is "nulled" or is forced to equal zero. Thereafter, the integrated transducer amplifier circuit is operated at other temperatures such that the temperature compensation voltage is generated in a manner representing the difference between the first operating temperatures and the current operating temperature.

    摘要翻译: 根据本发明的教导,提供了可编程集成换能器放大器电路,其接收来自诸如压力传感器或加速度计换能器的换能器的差分输出。 可编程集成传感器放大器电路包括响应于二进制编码信号编程的二进制可调电路。 二进制可调电路产生二进制加权电流,用于调整放大器电路的工作特性。 从包括存储二进制信息的多个存储器单元的可编程存储器阵列接收二进制编码信号。 当耦合到编程信号时,每个存储器单元被编程。 此外,存储器阵列具有用于在对各个存储单元进行永久编程之前测试存储器单元的输出的预测试能力。 此外,集成的换能器放大器电路自动补偿放大器电路的工作温度变化。 温度补偿的方法是通过在第一温度下操作可编程的积分换能器放大器电路来实现的,使得温度补偿电压被“零”或被迫等于零。 此后,集成的换能器放大器电路在其它温度下工作,使得以表示第一工作温度和当前工作温度之间的差异的方式产生温度补偿电压。

    Self-compensating accelerometer
    5.
    发明授权
    Self-compensating accelerometer 失效
    自补偿加速度计

    公开(公告)号:US5698785A

    公开(公告)日:1997-12-16

    申请号:US693564

    申请日:1996-08-07

    IPC分类号: G01P1/00 G01P15/12

    摘要: A motion sensor for sensing motion or acceleration of a body, such as the type used in onboard automotive and aerospace safety control system, navigational system or active suspension control system. The motion sensor includes a support frame, a bridge projecting from the support frame, and a proof mass suspended from the support frame by the bridge so as to enable the proof mass to respond to an input force imposed on the motion sensor. The bridge is provided with a strain sensing element that generates an acceleration signal in response to a deflection of the proof mass. The motion sensor further includes a structural feature capable of compensating for mechanically and thermally induced strains imposed on the motion sensor by generating a compensation signal in response to such strains. Finally, the sensor includes circuitry for detecting the acceleration and compensation signals and canceling the compensation signal from the acceleration signal, so as to produce an output signal that more closely corresponds to the input force on the proof mass than does the acceleration signal.

    摘要翻译: 用于感测身体的运动或加速的运动传感器,例如用于车载汽车和航空安全控制系统的类型,导航系统或主动悬架控制系统。 运动传感器包括支撑框架,从支撑框架突出的桥梁,以及通过桥梁从支撑框架悬挂的检测质量块,以使得证明物质能够响应于施加在运动传感器上的输入力。 该桥设置有应变传感元件,该应变传感元件响应于检验质量块的偏转而产生加速度信号。 运动传感器还包括能够通过响应于这种应变产生补偿信号来补偿施加在运动传感器上的机械和热感应应变的结构特征。 最后,传感器包括用于检测加速度和补偿信号并从加速度信号中消除补偿信号的电路,以产生与加速度信号相比更接近于证明质量上的输入力的输出信号。

    Analog/digital feedback circuitry for minimizing DC offset variations in an analog signal
    6.
    发明授权
    Analog/digital feedback circuitry for minimizing DC offset variations in an analog signal 失效
    模拟/数字反馈电路,用于最小化模拟信号的直流偏移变化

    公开(公告)号:US06426663B1

    公开(公告)日:2002-07-30

    申请号:US08610007

    申请日:1996-03-04

    IPC分类号: H03F102

    CPC分类号: G01P1/006 G01P15/08

    摘要: An analog signal gain circuit includes an input receiving an analog input signal defined by an ac signal component due to a driving force and a dc offset component independent of the driving force and an output providing an analog output signal defined by an amplified representation of the analog input signal and a dc offset component corresponding to a reference signal. A digital/analog feedback circuit includes a comparator having the reference signal as a switching threshold connected to an up/down counter having a number of digital outputs. The outputs of the up/down counter are connected to a D/A converter which converts the digital count to an analog feedback signal. The feedback signal is provided to the input of the analog signal gain circuit to minimize variations in the dc offset signal component of the analog output signal by compensating for the dc offset signal component of the analog input signal. The up/down counter is clocked at a slow rate to thereby provide a long time constant for minimizing the dc offset signal component.

    摘要翻译: 模拟信号增益电路包括接收由与驱动力无关的交流信号分量和独立于驱动力的直流偏移分量的模拟输入信号的输入,以及提供由模拟的放大表示定义的模拟输出信号的输出 输入信号和对应于参考信号的直流偏移分量。 数字/模拟反馈电路包括具有参考信号作为切换阈值的比较器,其连接到具有多个数字输出的上/下计数器。 上/下计数器的输出连接到D / A转换器,它将数字计数转换为模拟反馈信号。 反馈信号被提供给模拟信号增益电路的输入,以通过补偿模拟输入信号的直流偏移信号分量来最小化模拟输出信号的直流偏移信号分量的变化。 上/下计数器以慢速率进行计时,从而提供了一个很长的时间常数,用于最小化直流偏移信号分量。

    Memory cell having programmed margin verification
    7.
    发明授权
    Memory cell having programmed margin verification 失效
    具有编程保证金验证的存储单元

    公开(公告)号:US5796655A

    公开(公告)日:1998-08-18

    申请号:US954152

    申请日:1997-10-20

    CPC分类号: G11C16/3459 G11C16/3454

    摘要: A memory cell having programming voltage margin verification is provided. The memory cell includes a voltage comparator having a differential input with first and second inputs and bias circuitry for generating a differential input voltage. A voltage offset is applied to the second input of the comparator to provide an input offset voltage. A programming voltage is received for programming the memory cell and the memory cell provides an output signal. To verify an unprogrammed state voltage margin of the memory cell, a margin detection circuitry receives a verification check signal and the output is monitored to determine whether the unprogrammed state voltage margin is proper. To verify a proper programmed state voltage margin of the memory cell, current is sensed through the programming input and a determination of a proper programmed state voltage margin is determined as a function of the sensed current.

    摘要翻译: 提供具有编程电压裕度验证的存储单元。 存储单元包括具有差分输入的电压比较器,其具有用于产生差分输入电压的第一和第二输入和偏置电路。 电压偏移被施加到比较器的第二输入端以提供输入偏移电压。 接收编程电压以对存储器单元进行编程,并且存储器单元提供输出信号。 为了验证存储器单元的未编程状态电压裕度,余量检测电路接收验证检查信号,并监视输出以确定未编程的状态电压裕度是否合适。 为了验证存储器单元的适当的编程状态电压裕度,通过编程输入感测电流,并且确定适当的编程状态电压余量作为感测电流的函数。

    Variable attenuation circuit for a differential variable reluctance
sensor using current mode
    8.
    发明授权
    Variable attenuation circuit for a differential variable reluctance sensor using current mode 失效
    使用当前模式的差分可变磁阻传感器的可变衰减电路

    公开(公告)号:US6040692A

    公开(公告)日:2000-03-21

    申请号:US80383

    申请日:1998-05-18

    CPC分类号: G01P3/488

    摘要: A variable reluctance sensor interface module having a variable attenuation circuit and a rectifier and differential to single-ended conversion circuit for operating in a current mode to attenuate a differential input voltage. The variable attenuation circuit receives an input differential voltage from a magnetic sensor and converts the differential voltage to current. First and second current sourcing circuits, each including a plurality of current sourcing branches, receive the current and provides variable current attenuation by switching in and out transistor-based current sourcing branches. The rectifier and differential to single-ended conversion circuit converts the variably attenuated currents to a voltage output.

    摘要翻译: 一种可变磁阻传感器接口模块,具有可变衰减电路和整流器和差分到单端转换电路,用于在电流模式下工作以衰减差分输入电压。 可变衰减电路从磁传感器接收输入差分电压,并将差分电压转换为电流。 每个包括多个电流源分支的第一和第二电流源电路接收电流并通过切换入和基于晶体管的电流源分支来提供可变电流衰减。 整流器和差分到单端转换电路将可变衰减电流转换为电压输出。

    Sensor with silicon strain gage
    10.
    发明授权
    Sensor with silicon strain gage 失效
    硅应变计传感器

    公开(公告)号:US5932809A

    公开(公告)日:1999-08-03

    申请号:US24379

    申请日:1998-02-17

    IPC分类号: G01L9/00 G01L9/04 G01L9/06

    CPC分类号: G01L9/0055

    摘要: A media-compatible sensing structure (210) that employs strain-sensing elements (222) formed in or on a silicon chip (212). The sensor (210) generally includes a metal body (214) having a diaphragm (216) and an edge (226) formed by an abrupt change in the thickness of the metal body (214) in a direction normal to the diaphragm (216). The silicon chip (212) is secured directly to the metal diaphragm (216) and has at least one strain-sensing element (222) aligned with the edge (226) of the body (214) in the direction normal to the diaphragm (216), such that movement of the diaphragm (216) induces strain in the silicon chip (212) that is localized at the strain-sensing element (222). The chip (212) preferably includes a groove (234) in its surface (212) facing the diaphragm (216) and between the strain-sensing element (222) and the metal body (214), such that strain induced in the chip (212) by movement of the diaphragm (216) is further concentrated in the region of the chip (212) containing the strain-sensing element (222). The chip (212) is preferably attached to the metal diaphragm (216) with a bonding material (236). To promote adhesion of the chip (212) to the diaphragm (216), the chip (212) preferably has recesses (240) in its surface facing the diaphragm (216) to create an interlocking effect between the bonding material (236) and the chip (212).

    摘要翻译: 采用形成在硅芯片(212)中或其上的应变感测元件(222)的介质兼容传感结构(210)。 传感器(210)通常包括具有隔膜(216)和通过垂直于隔膜(216)的方向上金属体(214)的厚度突然变化而形成的边缘(226)的金属体(214) 。 硅芯片(212)直接固定在金属隔膜(216)上,并且具有至少一个与主体(214)的边缘(226)对准的应变传感元件(222)沿垂直于隔膜(216)的方向 ),使得隔膜(216)的运动在局限在应变感测元件(222)处的硅芯片(212)中引起应变。 芯片(212)优选地在其表面(212)中面向隔膜(216)和应变感测元件(222)和金属体(214)之间的凹槽(234),使得在芯片 212)的运动进一步集中在包含应变感测元件(222)的芯片(212)的区域中。 芯片(212)优选地通过接合材料(236)附接到金属隔膜(216)。 为了促进芯片(212)与隔膜(216)的粘附,芯片(212)在其面向隔膜(216)的表面中优选地具有凹部(240),以在接合材料(236)和 芯片(212)。