公开(公告)号：US20240034047A1

公开(公告)日：2024-02-01

申请号：US18233249

申请日：2023-08-11

Applicant: Metis Design Corporation ,  Massachusetts Institute of Technology

Inventor： Estelle Kalfon-cohen ,  Seth S. Kessler

IPC: B32B37/18 ,  B32B7/12 ,  B32B7/03 ,  B32B5/02 ,  B32B3/20 ,  B32B37/06

CPC classification number: B32B37/18 ,  B32B7/12 ,  B32B7/03 ,  B32B5/02 ,  B32B3/20 ,  B32B37/06 ,  B32B2305/026 ,  B32B2305/22 ,  B32B2262/0261

Abstract: A multiscale composite materials with few or no void defects are described. The composite materials include a network of porous materials. Methods and systems for the fabrication of the composite materials are generally described. According to certain embodiments, composite materials are fabricated without the use of an autoclave or low pressure environments.

公开(公告)号：US20220191978A1

公开(公告)日：2022-06-16

申请号：US17576019

申请日：2022-01-14

Applicant: Metis Design Corporation

Inventor： Seth S. Kessler ,  Gregory A. Thomas ,  Christopher T. Dunn ,  Michael Borgen ,  Brian L. Wardle

IPC: H05B6/10 ,  H05B3/26 ,  H01B1/04 ,  H01C13/00 ,  H01G4/33 ,  H05B1/02 ,  H05B3/14 ,  H05B3/20

Abstract: A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

公开(公告)号：US09480163B2

公开(公告)日：2016-10-25

申请号：US14266745

申请日：2014-04-30

Applicant: The Boeing Company ,  Metis Design Corporation

Inventor： Seth S. Kessler ,  Jeong-Beom Ihn ,  Christopher T. Dunn ,  Jeffrey Lynn Duce ,  Michael G. Borgen

IPC: B23P19/00 ,  H05K1/18 ,  G06F3/05 ,  G08C19/16 ,  H05K1/02

CPC classification number: H05K1/189 ,  G06F3/05 ,  G08C19/16 ,  H05K1/0219 ,  H05K2201/10151 ,  H05K2203/1344 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular system includes a digitizing sensor node. The system further includes a bus including a plurality of conductive elements applied to a substrate. A first conductive element of the bus is coupled to the digitizing sensor node using a direct-write technique.

Abstract translation: 公开了将数字化传感器耦合到结构的系统和方法。 特定系统包括数字化传感器节点。 该系统还包括一个总线，其包括施加到基板上的多个导电元件。 总线的第一导电元件使用直写技术耦合到数字化传感器节点。

公开(公告)号：US11706848B2

公开(公告)日：2023-07-18

申请号：US17576019

申请日：2022-01-14

Applicant: Metis Design Corporation

Inventor： Seth S. Kessler ,  Gregory A. Thomas ,  Christopher T. Dunn ,  Michael Borgen ,  Brian L. Wardle

IPC: H05B6/10 ,  H05B3/26 ,  H01B1/04 ,  H01C13/00 ,  H01G4/33 ,  H05B1/02 ,  H05B3/14 ,  H05B3/20

CPC classification number: H05B6/101 ,  H01B1/04 ,  H01C13/00 ,  H01G4/33 ,  H05B1/0236 ,  H05B3/145 ,  H05B3/20 ,  H05B3/265 ,  H05B3/267 ,  H05B2203/011 ,  H05B2203/013 ,  H05B2203/016 ,  H05B2203/017 ,  H05B2214/02 ,  H05B2214/04

Abstract: A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

公开(公告)号：US20160302264A1

公开(公告)日：2016-10-13

申请号：US14678066

申请日：2015-04-03

Applicant: Metis Design Corporation

Inventor： Seth S. Kessler ,  Gregory A. Thomas ,  Christopher T. Dunn ,  Michael Borgen ,  Brian L. Wardle

IPC: H05B6/10 ,  H01G4/33 ,  H05B1/02 ,  H05B3/14 ,  H05B3/20 ,  H01B1/04 ,  H01C13/00

Abstract: A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

Abstract translation: 一种多功能组件，其具有与所述电阻元件电连通的导电元件的电阻元件，所述导电元件限定所述电阻元件的多个多功能区域中的至少一个，其中所述导电元件被配置为引导电流流过 电阻元件的多个多功能区域中的至少一个以预先选择的方式。

公开(公告)号：US11499621B1

公开(公告)日：2022-11-15

申请号：US17698501

申请日：2022-03-18

Applicant: Metis Design Corporation

Inventor： Seth S. Kessler ,  Michael Borgen ,  Christopher T. Dunn ,  Joshua F. Kessler ,  Sophie T. Berk

IPC: G01M13/00 ,  F16H57/01 ,  G01M13/021 ,  H01L41/113 ,  F16H61/00

Abstract: Systems and methods for in-situ monitoring of gearbox are provided. An example system includes a mounting plate coupled to a component within the gearbox and a transducer array having a plurality of piezoelectric transducers disposed thereon to ultrasonically obtain diagnostic information about one or more components in the gearbox. The plurality of piezoelectric transducers are in contact with a surface of one or more mechanical components within the gearbox. The system includes circuitry, at least a portion of which is mounted inside the gearbox, electrically couplable to the transducer array, the circuitry configured to direct an excitation signal to a selected piezoelectric transducer of the plurality of piezoelectric transducers, and direct a response received from one or more of the plurality of piezoelectric transducers in proximity to the selected piezoelectric transducer toward a processor programmed or configured to determine gearbox diagnostic information therefrom.

公开(公告)号：US20180258920A1

公开(公告)日：2018-09-13

申请号：US15910584

申请日：2018-03-02

Applicant: Metis Design Corporation ,  Embraer S.A.

Inventor： Seth S. Kessler ,  Fabio Santos da Silva ,  Rodrigo Carlana da Silva ,  Cassio Wallner ,  Paulo Anchieta da Silva ,  Estelle Cohen

IPC: F03G7/06 ,  H05B1/02 ,  H05B3/14 ,  H05B3/06

Abstract: Exemplary embodiments are directed to thermally driven actuator systems including a thermally driven element and one or more heating elements coupled to and in thermal contact with the thermally driven element. The thermally driven element can be capable of being selectively reconfigured in shape based on a thermal strain or temperature driven phase change. The one or more heating elements can be configured to selectively and independently apply heat to one or more of a plurality of different regions of the thermally driven element to selectively raise a temperature or temperatures of the selected region or regions of the thermally driven element to selectively reconfigure the shape of the thermally driven element.

公开(公告)号：US20140232552A1

公开(公告)日：2014-08-21

申请号：US14266745

申请日：2014-04-30

Applicant: The Boeing Company ,  Metis Design Corporation

Inventor： Seth S. Kessler ,  Jeong-Beom Ihn ,  Christopher T. Dunn ,  Jeffrey Lynn Duce ,  Michael G. Borgen

IPC: G08C19/16

CPC classification number: H05K1/189 ,  G06F3/05 ,  G08C19/16 ,  H05K1/0219 ,  H05K2201/10151 ,  H05K2203/1344 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular system includes a digitizing sensor node. The system further includes a bus including a plurality of conductive elements applied to a substrate. A first conductive element of the bus is coupled to the digitizing sensor node using a direct-write technique.

Abstract translation: 公开了将数字化传感器耦合到结构的系统和方法。 特定系统包括数字化传感器节点。 该系统还包括一个总线，其包括施加到基板上的多个导电元件。 总线的第一导电元件使用直写技术耦合到数字化传感器节点。

公开(公告)号：US11438973B2

公开(公告)日：2022-09-06

申请号：US14678066

申请日：2015-04-03

Applicant: Metis Design Corporation

Inventor： Seth S. Kessler ,  Gregory A. Thomas ,  Christopher T. Dunn ,  Michael Borgen ,  Brian L. Wardle

IPC: H05B6/10 ,  H05B3/26 ,  H01B1/04 ,  H01C13/00 ,  H01G4/33 ,  H05B1/02 ,  H05B3/14 ,  H05B3/20

Abstract: A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

公开(公告)号：US10411181B2

公开(公告)日：2019-09-10

申请号：US15992937

申请日：2018-05-30

Applicant: Metis Design Corporation

Inventor： Seth S. Kessler ,  Christopher T. Dunn

IPC: H01L41/04 ,  H01L41/047 ,  H01L41/08 ,  H01L41/293

Abstract: Devices and methods described herein provide electrode pair access from a single side of a device by using one or more via holes through the device. The via hole can pass through or near the center of the device. By creating a conductive path through the via hole of the device, devices and methods of the present disclosure advantageously provide access to a pair of electrodes, each of which contacts a different side of a device layer, on a single side of the device while enabling a greater active device area than is possible using conventional techniques. In addition, the central location of the via hole provides favorable mechanical properties by avoiding radial constriction of the device layers in applications such as piezoelectric devices.