摘要:
The temperature of the sputtering process for forming the Ti film is selected to a temperature within a range of from 200 degree C. to 225 degree C. to provide stable film quality against oxidization (step 11). The irradiation with ultraviolet is conducted before applying the photo resist to reduce positive electric charge (step 12), and nitrogen plasma processing is conducted during the etching of the via hole and after the plasma stripping processing to reduce positive electric charge (steps 13 and 14), and the resistivity of the rinse liquid at the organic stripping is controlled to obtain equal to or lower than 0.3Mnull cm (step 15). Further, the RF-spattered thickness during the RF sputtering process for the barrier metal film is set to 18 nm to 22 nm to remove TiOn film (step 16).
摘要:
A clock and data recovery circuit, for tracking frequency-modulated input data, comprises a phase detector for receiving a data signal and a synchronous clock signal, detecting a phase delay or a phase advance, and outputting an UP1/DOWN1 signal, first and second integrators for integrating the UP1/DOWN1 signal and outputting an UP2/DOWN2 signal and an UP3/DOWN3 signal, respectively, a pattern generator for receiving the UP3/DOWN3 signal from the second integrator to output an UP4/DOWN4 signal, a mixer for receiving the UP2/DOWN2 signal from the first integrator and the UP4/DOWN4 signal from the pattern generator and generating an UP5/DOWN5 signal for output, and a phase interpolator for interpolating the phase of an input clock signal based on the UP5/DOWN5 signal from the mixer, for output are provided. A clock signal output from the interpolator is fed back to the phase detector as the clock.
摘要:
A semiconductor memory device that does not delay read/write access due to a refresh and can be interface compatible with a high-speed SRAM such as a QDR SRAM, comprises a plurality of subarrays each having a plurality of dynamic memory cells; at least one cache memory for the plurality of subarrays; a circuit to check whether data read from the subarray selected by a read address is present in the cache memory or not; and a circuit performing control so that the check result indicates that the data is present in the cache memory, the data is read from the cache memory and refreshing of the subarray is performed concurrently with a read cycle.
摘要:
The intermediate node of the first terminator connected between a pair of signal lines transmitting the first differential signal with one side of the third differential signal as a common voltage and the intermediate node of the second terminator connected between a pair of signal lines transmitting the second differential signal with the other side of the third differential signal as a common voltage are connected by the intermediate connection. Thus, the intermediate node of the first terminator and the intermediate node of the second terminator act as a virtual ground of the third differential signal, enabling the matching of the impedance of the terminators related to the third differential signal and the impedance of the signal lines related to the third differential signal. It is thus able to prevent the reflection of the third differential signal.
摘要:
The semiconductor device of the present invention includes a first interconnection, a via-plug that is connected to the first interconnection, and a second interconnection that is formed as a single unit with the via-plug. The cross-sectional shape of the via-plug is such that the plug sidewall angle, which indicates the angle of the via-plug sidewall with respect to the surface of the first interconnection, is a positive angle; and moreover, at least two points exist between the base and the top of the via-plug on at least one sidewall of the two sidewalls of the cross-sectional shape of the via-plug at which the plug sidewall angle attains a maximum value. Since shapes that would give rise to the occurrence of concentrations of stress are not formed in the via-plug sidewalls, metal is more effectively embedded in the via-hole, and the incidence of voids is prevented.
摘要:
A protection element comprises a ring-shape gate electrode, an Nnull drain region inside the ring-shape gate electrode, an Nnull source region outside, and a shield plate electrode. The ring gate and source regions are connected to ground via a through-hole, and the drain region is connected to an external pad. The shield plate electrode is connected to ground or to a power supply. Element isolation is achieved by the shield plate electrode, without forming a LOCOS or other element isolation oxide layer. By this means, blocking of thermal conduction by an oxide layer can be avoided to improve the heat dissipation and ESD resistance of the protection element.
摘要:
A semiconductor device, a layout device and a layout method in which, if the size of a via interconnecting a first conductor provided in an interconnect layer and a second conductor which is provided in an interconnect layer different from the interconnect layer of the first conductor and which intersects the first conductor by solid crossing, is not less than the line width of the first conductor, and if, in case the center point of the via is arranged on a center axis along the longitudinal direction of the first conductor, the minimum spacing cannot be maintained between the first conductor and the line neighboring to the first conductor, the center of the via, arranged on the first conductor, is placed with an offset of a predetermined value with respect to the longitudinal center axis of the first conductor, so that a spacing not less than the minimum spacing is maintained between the first conductor and the line neighboring to the first conductor and in the via placement region on the first conductor.
摘要:
An active inductance circuit comprising a signal terminal (OUT) and having voltage and current characteristics, as viewed from this terminal, which are identical to those of a circuit comprising an inductance, this active inductance circuit having a structure in which the drain terminal of a first MOS transistor M1 and the gate terminal of a second MOS transistor M2 different in conductivity type from the first MOS transistor are connected to the signal terminal, the gate terminal of the first MOS transistor is connected to the source terminal of the second MOS transistor, a capacitor and a current source are connected to the source terminal of the second transistor, the source terminal of the first MOS transistor and the drain terminal of the second MOS transistor are connected to a power source and other terminals of the capacitor and current source are connected to another power source.
摘要:
A clock controlling circuit and method for eliminating the delay difference in the entire clock propagation line. Circuit scale is reduced as compared to a case of using a PLL or DLL circuit. A timing averaging circuit 10 is fed with clocks from a position on a forward route 111 of a direction-reversed clock propagation path, adapted for being fed with input clocks at its one end, and from a position on a return route 112 corresponding to the position on the forward route 111. The timing difference between these clocks is averaged to output an averaged timing difference.
摘要:
In a driver, a voltage-follower-type operational amplifier receives current input data to generate an output signal. A transient state detecting circuit detects a transient state in the current input data to generate a first pulse signal when the current input data is increased and generate a second pulse signal when the current input data is decreased. A switch circuit substantially increases corresponding load currents flowing through the voltage-follower-type operational amplifier in accordance with the first and second pulse signals.