公开(公告)号：US20240332144A1

公开(公告)日：2024-10-03

申请号：US18620300

申请日：2024-03-28

申请人： NEXPERIA B.V.

发明人： Hiu Hay Nichole Lam ,  Shun Tik Yeung

IPC分类号： H01L23/495 ,  H01L21/268 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/49575 ,  H01L21/268 ,  H01L21/565 ,  H01L23/4951 ,  H01L24/37 ,  H01L24/45 ,  H01L25/0652 ,  H01L2224/37005 ,  H01L2224/3702 ,  H01L2224/45005 ,  H01L2224/4502 ,  H01L2924/182 ,  H01L2924/351

摘要： The present disclosure relates to techniques for manufacturing a semiconductor package assembly, with a semiconductor die structure mounted to a lead frame having terminals and encapsulated with a molding resin, as well as a semiconductor package assembly obtained with these techniques. An object of the present disclosure is to provide a manufacturing technique that results in a leaded/leadless power/MCD package or power module manufactured with less complex and less time-consuming process steps, and the connecting elements being implemented are of a straightforward design with reduced RDS(on) characteristic.

公开(公告)号：US20240332108A1

公开(公告)日：2024-10-03

申请号：US18620206

申请日：2024-03-28

申请人： NEXPERIA B.V.

发明人： Hamza Hanif Patel ,  Nivasan Yogeswaran ,  Mark Andrzej Gajda

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L29/78

CPC分类号： H01L23/3157 ,  H01L21/56 ,  H01L29/7827

摘要： A method of manufacturing a semiconductor device, such as a power MOSFET, including: forming a metal layer, the metal layer including an edge where the metal layer ends; forming a passivation layer at a layer higher than the metal layer; and forming a passivation slot in the passivation layer, the passivation slot is at least partially positioned over the metal layer, and the passivation slot divides the passivation layer into multiple regions, each region experiences a reduced tensile stress σSiNx as a result of the passivation slot.

公开(公告)号：US20240321607A1

公开(公告)日：2024-09-26

申请号：US18611237

申请日：2024-03-20

申请人： NEXPERIA B.V.

发明人： Tim Ellenbroek ,  Steven Verstoep ,  Niels de Koning

IPC分类号： H01L21/67 ,  H01L21/66 ,  H01L25/075

CPC分类号： H01L21/67144 ,  H01L21/67242 ,  H01L22/20 ,  H01L25/0753

摘要： The disclosure relates to a method for transferring electrical components from a source substrate to empty positions on a target substrate. Further aspects relate to an apparatus for carrying out this method and to a corresponding computer program product. According to an aspect of the disclosure a binning map is constructed of the source substrate by assigning each electrical component to a respective bin among M bins based on one or more parameters of the electrical components. The target substrate is divided into unit cells, and each unit cell includes component positions, each component position being associated with a respective bin. The electrical components are arranged on the target substrate so that, at each component position of each unit cell, an electrical component from the source substrate is arranged that is assigned to the same bin as the bin that is associated with that component position.

公开(公告)号：US20240282680A1

公开(公告)日：2024-08-22

申请号：US18440017

申请日：2024-02-13

申请人： NEXPERIA B.V.

发明人： Antonio B. Dimaano, JR. ,  Ricardo Yandoc ,  Homer Malveda ,  Marlon Fadullo

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2924/13091

摘要： A leadframe for a semiconductor package is provided, including one or more mechanical standoffs for placing a die at a distance from the leadframe defined by a height of the standoffs and for enabling an adhesive layer between the leadframe and the die for bonding the die to the leadframe. The leadframe includes a substantially planar surface and the standoffs protrude from this surface. Surrounding perimeters, if present, of the leadframe are lower than the standoffs. The leadframe and the standoffs are a one-piece of conducting material and form a die paddle.

公开(公告)号：US20240282611A1

公开(公告)日：2024-08-22

申请号：US18583331

申请日：2024-02-21

申请人： NEXPERIA B.V.

发明人： Johannes Hubertus Antonius van de Rijdt, JR. ,  Jasper Wesselingh

IPC分类号： H01L21/68 ,  H01L21/67 ,  H01L23/00

CPC分类号： H01L21/681 ,  H01L21/67144 ,  H01L24/742 ,  H01L24/743 ,  H01L2224/742 ,  H01L2224/743

摘要： Aspects of the present disclosure relate to an electronic component transfer system. Further aspects of the present disclosure relate to a method for transferring an electronic component. The present disclosure particularly relates to electronic component transfer systems in which an optical light source is used for releasing and transferring electronic components. According to an aspect of the present disclosure, a drive unit is used for moving the optical light source and/or light beam output by the optical light source to change a position at which it has released a component from the source substrate to a position at which it will release a next component from the source substrate.

公开(公告)号：US20240178837A1

公开(公告)日：2024-05-30

申请号：US18516318

申请日：2023-11-21

申请人： NEXPERIA B.V.

发明人： Geethanadh Asam ,  Keyur Pandya

IPC分类号： H03K17/687

CPC分类号： H03K17/6872

摘要： A control circuit for an output driver with a slew rate control circuit is disclosed. The control circuit includes a turn-on facilitating module having a control input and configured to be connected to the output driver and to supply a supplementary voltage to the output driver in response to a control voltage at the control input; and a sensing module configured to be connected to the turn-on facilitating module and the output driver and to switch off the turn-on facilitating module in response to an input voltage of the output driver sensed by the sensing module.

公开(公告)号：US11996474B2

公开(公告)日：2024-05-28

申请号：US16704577

申请日：2019-12-05

申请人： NEXPERIA B.V.

发明人： Stefan Berglund ,  Steffen Holland

IPC分类号： H01L29/737 ,  H01L29/47 ,  H01L29/66

CPC分类号： H01L29/7375 ,  H01L29/47 ,  H01L29/66272

摘要： The present disclosure relates to a bipolar transistor semiconductor device including: a substrate layer, a collector epitaxial layer supported by the substrate layer, a base region supported by a portion of the collector epitaxial layer, and an emitter region supported by a portion of the base region. The emitter region includes a polysilicon material.

公开(公告)号：US20240097046A1

公开(公告)日：2024-03-21

申请号：US18467232

申请日：2023-09-14

申请人： NEXPERIA B.V.

发明人： Massimo Cataldo Mazzillo

IPC分类号： H01L29/872 ,  H01L29/06 ,  H01L29/36 ,  H01L29/66

CPC分类号： H01L29/872 ,  H01L29/0623 ,  H01L29/36 ,  H01L29/66143

摘要： An MPS diode and a manufacturing method thereof is provided. The MPS diode includes a semiconductor body with an active area, that includes a drift region of a first conductivity type, and wells of a second type different from the first type, the wells being mutually spaced apart, each well forming a respective PN-junction with the drift region. The MPS diode includes a metal layer assembly arranged on a surface of the semiconductor body and at least one metal layer, the assembly forming Schottky contacts together with the drift region and the respective Ohmic contacts with the wells. The drift region includes a doped region surrounding the wells, the doped region having a higher dopant concentration than a remainder of the drift region. The dopant concentration in the doped region decreases in a first direction from a center of the doped region to an edge of the doped region.

公开(公告)号：US20240006276A1

公开(公告)日：2024-01-04

申请号：US18343845

申请日：2023-06-29

申请人： NEXPERIA B.V.

发明人： Hiu Hay Nichole Lam ,  Shu-ming Yip ,  Chi Ho Leung ,  Shun Tik Yeung

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L23/49541 ,  H01L21/4842 ,  H01L21/565

摘要： The present disclosure relates to manufacturing techniques for manufacturing multiple semiconductor package assemblies on a lead frame, as well as a semiconductor package assembly manufactured using this method. The method reduces the distances or intermediate spacings between singulated semiconductor packages on a lead frame to a width equal to the width of a cutting tool which width is significantly smaller than the distance required in any known modelling encapsulation technique. Therefore, the method according to the disclosure allows to position more semiconductor packages on a lead frame on one process step. Accordingly, as the number of semiconductor packages per lead frame surface is increased, more semiconductor packages can be manufactured and singulated in one process step, which reduces costs and processing time.

公开(公告)号：US20230411175A1

公开(公告)日：2023-12-21

申请号：US18333854

申请日：2023-06-13

申请人： NEXPERIA B.V.

发明人： Wai Wai Lee ,  Ting Wei Chang ,  Jia Yunn Ting ,  Wei Leong Tan

IPC分类号： H01L21/56 ,  H01L21/52 ,  H01L21/48 ,  H01L21/67

CPC分类号： H01L21/565 ,  H01L21/52 ,  H01L21/4835 ,  H01L21/67023 ,  H01L21/67057 ,  H01L2021/60015

摘要： A method for manufacturing a semiconductor package assembly is provided. The assembly includes a semiconductor package and a molding resin case encapsulating the semiconductor package. The complete semiconductor package undergoes a surface roughening treatment, thus improving the overall adhesion with the molding resin (EMC) and reducing the risks of delamination.