Abstract:
A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.
Abstract:
A method is provided for programming a nonvolatile memory device including an array of memory cells, where each memory cell including a substrate, a control gate, a charge storage element, a source region and a drain region. The method includes receiving a programming window that identifies a plurality of memory cells in the array. A first group of memory cells to be programmed is identified from the plurality of memory cells in the programming window. The first group of memory cells is programmed and a programming state of the first group of memory cells is verified.
Abstract:
A method for fast chip erase of memory cells in a non-volatile memory array comprises the steps of providing an acceleration voltage greater than the internal pump voltage supplied by a conventional internal voltage supply pump, providing an erase write command, and performing a fast erase operation on the memory cells, comprising the step of coupling the acceleration voltage to the sources of the memory cells in a plurality of sectors simultaneously. In an embodiment, a fast preprogramming operation is performed on the memory cells prior to the step of performing the fast erase operation in the fast chip erase mode. In a further embodiment, a fast weak programming (APDE) operation is performed on the memory cells subsequent to the step of performing the fast erase operation in the fast chip erase mode. In an additional embodiment, the step of performing the fast erase operation further comprises the steps of detecting the acceleration voltage, generating an acceleration voltage indicator signal in response to the detection of the acceleration voltage, and generating a fast chip erase write command in response to the acceleration voltage indicator signal and the erase write command.
Abstract:
A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.
Abstract:
A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.
Abstract:
A bank selector encoder comprises a partition indicator circuit having a plurality of partition boundary indicator terminals, a plurality of inverters arranged in a plurality of columns, with each column of the inverters coupled to a respective one of a plurality of columns of ROM cells in a ROM array and a plurality of bank selector code outputs coupled to respective columns of the inverters. The partition boundary indicator terminals are capable of designating a memory partition boundary to identify an upper memory bank and a lower memory bank. The bank selector encoder is capable of generating an identifying bank selector code for each of a plurality of the predetermined memory partition boundaries. The bank selector encoder outputs code bits of a bank selector code based upon the partition boundary indicator terminals.
Abstract:
A bank selector circuit for a simultaneous operation flash memory device with a flexible bank partition architecture comprises a memory boundary option 18, a bank selector encoder 2 coupled to receive a memory partition indicator signal from the memory boundary option 18, and a bank selector decoder 3 coupled to receive a bank selector code from the bank selector encoder 2. The decoder 3, upon receiving a memory address, outputs a bank selector output signal to point the memory address to either a lower memory bank or an upper memory bank in the simultaneous operation flash memory device, in dependence upon the selected memory partition boundary.
Abstract:
A simultaneous operation non-volatile memory device with a flexible bank partition architecture comprises a memory array 20 including a plurality of memory cells arranged in a plurality of columns and rows, a plurality of bit lines 28 and 30 each coupled to a respective column of the memory cells, each of the bit lines comprising first and second bit line segments separated by a gap designating a memory partition boundary between upper and lower memory banks, and an X-decoder 22 coupled to the respective rows of the memory cells to row decode the memory array in response to receiving upper and lower bank memory addresses. Two pre-decoders 24 and 26 are coupled to the X-decoder 22. Two Y-decoders 32 and 34 are coupled to the bit line segments to provide column decoding for the memory cells in the upper and lower memory banks, respectively.
Abstract:
A method is provided for programming a nonvolatile memory array including an array of memory cells, where each memory cell including a substrate, a control gate, a charge storage element having at least two charge storage areas for storing at least two independent charges, a source region and a drain region. The method includes designating at least one memory cell as a high-speed memory cell and pre-conditioning the high-speed memory cells by placing a first of the at least two charge storage areas into a programmed state, and subsequently enabling the programming on the second area with much higher rate.
Abstract:
A non-volatile memory, such as a Flash memory, is configured to perform a random multi-page read operation. The memory may include a core array of non-volatile memory cells and input lines for receiving an indication of the random multi-page read operation. Further, the memory may include a multi-level volatile memory coupled to the core array that is configured to simultaneously process multiple pages of data from the core array in a pipelined manner. Output lines are coupled to the multi-level volatile memory and output the pages of data from the memory device.