摘要:
An embodiment of the present invention is an transparent thin film transistor which has an substantially transparent substrate, a gate line made of a thin film of a substantially transparent conductive material, a substantially transparent gate insulating film, a substantially transparent semiconductor active layer, a source line made of a thin film of a metal material and a drain electrode made of a thin film of a substantially transparent conductive material. In addition, the source line and the drain electrode are formed apart from each other and sandwich the substantially transparent semiconductor active layer. Moreover, at least any one of the thin film of the gate line and the thin film of the source line is stacked with a thin film of a metal material.
摘要:
One embodiment of the present invention is a thin film transistor having a substrate, a gate electrode formed on the substrate, a gate insulating film, a semiconductor layer formed on the gate insulating film, a protective film formed on the semiconductor layer and the gate insulating film and having first and second opening sections which are separately and directly formed on the semiconductor layer, a source electrode formed on the protective film and electrically connected to the semiconductor layer at the first opening section of the protective film, and a drain electrode formed on the protective film and electrically connected to the semiconductor layer at the second opening section of the protective film.
摘要:
An embodiment of the present invention is an transparent thin film transistor which has an substantially transparent substrate, a gate line made of a thin film of a substantially transparent conductive material, a substantially transparent gate insulating film, a substantially transparent semiconductor active layer, a source line made of a thin film of a metal material and a drain electrode made of a thin film of a substantially transparent conductive material. In addition, the source line and the drain electrode are formed apart from each other and sandwich the substantially transparent semiconductor active layer. Moreover, at least any one of the thin film of the gate line and the thin film of the source line is stacked with a thin film of a metal material.
摘要:
The present invention provides a semiconductor device manufacturing method of a semiconductor device having a contact plug, in which a contact hole formed by a surface portion of a high-concentration N-type diffusion layer formed on a semiconductor silicon substrate surface and an interlayer insulating film is implanted with indium ions at an energy ranging from 30 to 120 keV and an implantation amount ranging from 1.0×1013/cm2 to 5.0×1014/cm2 to grow an indium-containing layer on the surface portion of the high-concentration N-type diffusion layer at the bottom of the contact hole.
摘要翻译:本发明提供一种具有接触插塞的半导体器件的半导体器件制造方法,其中,由半导体硅衬底表面上形成的高浓度N型扩散层的表面部分形成的接触孔和层间绝缘膜 以30至120keV的能量注入铟离子,并且注入量范围为1.0×10 13 / cm 2至5.0×10 14 / > / cm 2以在接触孔的底部的高浓度N型扩散层的表面部分上生长含铟层。
摘要:
A semiconductor device includes cylindrical capacitors each including corresponding cylindrical electrodes. Each cylindrical electrode includes hemispherical silicon grains. The hemispherical silicon grains protruding from an upper region of the cylindrical electrode have a large size, and the hemispherical silicon grains protruding from a lower region of the cylindrical electrode have a small size or the lower region of the cylindrical electrode has no hemispherical silicon grains.
摘要:
Upon a deep-hole capacitor fabrication, a hole is formed in an insulator layer, and then a film of a conductive material is formed on the insulator layer and on the whole inner surface of the hole. The film and the insulator layer are exposed to a chemical-mechanical polishing process to form a lower electrodes of the conductive material. A capacitor dielectric on the lower electrode is formed, and then an upper electrode is formed on the capacitor dielectric.
摘要:
The present invention provides a semiconductor device manufacturing method of a semiconductor device having a contact plug, in which a contact hole formed by a surface portion of a high-concentration N-type diffusion layer formed on a semiconductor silicon substrate surface and an interlayer insulating film is implanted with indium ions at an energy ranging from 30 to 120 keV and an implantation amount ranging from 1.0×1013/cm2 to 5.0×1014/cm2 to grow an indium-containing layer on the surface portion of the high-concentration N-type diffusion layer at the bottom of the contact hole.
摘要翻译:本发明提供一种具有接触插塞的半导体器件的半导体器件制造方法,其中,由半导体硅衬底表面上形成的高浓度N型扩散层的表面部分形成的接触孔和层间绝缘膜 以30至120keV的能量注入铟离子,并且注入量范围为1.0×10 13 / cm 2至5.0×10 14 / > / cm 2以在接触孔的底部的高浓度N型扩散层的表面部分上生长含铟层。
摘要:
A process for preparation of a 2-substituted-1,4-naphthoquinone which comprises oxidizing a 2-substituted naphthalene to obtain reaction products comprising a 2-substituted-1,4-naphthoquinone and a 6-substituted-1,4-naphthoquinone; adding a diene compound to the reaction products and heating the mixture to form a Diels-Alder reaction adduct between the diene compound and the 6-substituted-1,4-naphthoquinone in the reaction products; and separating the 2-substituted-1,4-naphthoquinone from the adduct.
摘要:
When the winding operation is started, the leading edge portion of the sheet is sucked and held by one of a pair of horizontally disposed rollers and the extension of the leading edge portion of the sheet beyond the one roller is controlled by rotation of said one roller. An adhesive with a suitable viscosity is sprayed against a core from the position below the core. The core and said one roller are rotated so that the sheet is clamped between the one roller and the portion of the core which is applied with the adhesive and consequently is bonded to the core. Thereafter the pair of rollers are rotated at a low speed so that the slack of the sheet is eliminated. Next the sheet is wound around the core at a high speed. After the winding operation, an adhesive with a suitable viscosity is sprayed against a roll of paper from below so that the sheet is bonded by the weight of the roll of paper itself. Thereafter the sheet is cut off and the roll of paper is pushed out.
摘要:
An inspection apparatus is provided for inspecting a package having a content wrapped with a translucent packaging sheet, the package having an outline including front and rear edges and two side edges and having a seal where the packaging sheet is sealed formed inside at least one of the front and rear edges. The inspection apparatus includes a lighting disposed on one side of a gap across which the package is to be conveyed from an upstream conveyor mechanism to a downstream conveyor mechanism, a camera disposed on the other side of the gap, and an image processor for processing an image captured by the camera. The image processor is capable of obtaining a strip-shaped partial image including the seal from an entire image of the package, thereby enabling determination of whether a foreign substance is present in the partial image.