公开(公告)号：US20180112322A1

公开(公告)日：2018-04-26

申请号：US15837769

申请日：2017-12-11

Applicant: Oriental Electro Plating Corporation

Inventor： Hiroyoshi TAKAHASHI

IPC: C25D5/12 ,  H01R13/03 ,  C25F5/00 ,  C25F1/00 ,  C25D5/50 ,  C25D5/48 ,  C25D3/12 ,  C25D3/48 ,  C25D3/46 ,  C25D3/40 ,  C25D3/50 ,  C25D3/30

CPC classification number: C25D5/12 ,  C25D3/12 ,  C25D3/30 ,  C25D3/40 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/48 ,  C25D5/505 ,  C25F1/00 ,  C25F5/00 ,  H01R13/03

Abstract: Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

公开(公告)号：US20160348260A1

公开(公告)日：2016-12-01

申请号：US15028051

申请日：2014-04-16

Applicant: ORIENTAL ELECTRO PLATING CORPORATION

Inventor： Hiroyoshi TAKAHASHI

IPC: C25D5/12 ,  C25F1/00 ,  C25F5/00 ,  H01R13/03 ,  C25D3/48 ,  C25D3/50 ,  C25D3/40 ,  C25D3/12 ,  C25D5/50 ,  C25D3/46

CPC classification number: C25D5/12 ,  C25D3/12 ,  C25D3/30 ,  C25D3/40 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/48 ,  C25D5/505 ,  C25F1/00 ,  C25F5/00 ,  H01R13/03

Abstract: Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

Abstract translation: 提供：具有优异的耐磨性，导电性，滑动性能和低摩擦性的电镀材料，其中镀层不会发生脆化; 以及电镀材料的制造方法。 该方法包括：第一步骤，至少部分地从在其至少一部分上具有回流层的金属基材除去回流锡镀层，以及设置在回流层和基材之间的界面处的反应层; 将已经去除了回流锡镀层的区域至少部分地进行镀镍处理的第二步骤; 第三步，至少部分地使镍镀层进行银击镀处理; 以及第四步骤，至少部分地使银触镀层的区域进行镀银处理。

公开(公告)号：US09680246B2

公开(公告)日：2017-06-13

申请号：US15027778

申请日：2014-04-16

Applicant: Oriental Electro Plating Corporation

Inventor： Hiroyoshi Takahashi

IPC: H01R13/03 ,  C25D5/12 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/14 ,  C25D5/34 ,  H01R43/16 ,  C25D5/50

CPC classification number: H01R13/03 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/12 ,  C25D5/14 ,  C25D5/34 ,  C25D5/50 ,  H01R43/16

Abstract: A tin-plated/silver-plated laminate which has excellent abrasion resistance, electrical conductivity and slidability and a low frictional property is provided, which prevents the embrittlement of a plating layer contained therein. A method for producing the laminate involves forming a silver plating layer on a tin plating layer that is formed on the surface of a metallic base material by subjecting an arbitrary region in the surface of a tin plating layer to a nickel plating treatment to form a nickel plating layer; subjecting an arbitrary region in the surface of the nickel plating layer to a silver strike plating treatment; and subjecting at least a part of the surface region of the nickel plating layer, which has been subjected to the silver strike plating treatment, to a silver plating treatment.

公开(公告)号：US10351965B2

公开(公告)日：2019-07-16

申请号：US15028051

申请日：2014-04-16

Applicant: Oriental Electro Plating Corporation

Inventor： Hiroyoshi Takahashi

IPC: C25D5/50 ,  C25D5/12 ,  H01R13/03 ,  C25D3/12 ,  C25D3/40 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/48 ,  C25F1/00 ,  C25F5/00 ,  C25D3/30

Abstract: Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

公开(公告)号：US20160254608A1

公开(公告)日：2016-09-01

申请号：US15027778

申请日：2014-04-16

Applicant: ORIENTAL ELECTRO PLATING CORPORATION

Inventor： Hiroyoshi TAKAHASHI

IPC: H01R13/03 ,  C25D3/46 ,  C25D5/12 ,  H01R43/16 ,  C25D3/48 ,  C25D3/50 ,  C25D3/38 ,  C25D5/14 ,  C25D3/12 ,  C25D5/34

CPC classification number: H01R13/03 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/12 ,  C25D5/14 ,  C25D5/34 ,  C25D5/50 ,  H01R43/16

Abstract: Provided are: a tin-plated/silver-plated laminate, which has excellent abrasion resistance, electrical conductivity and slidability and a low frictional property, and whereby it becomes possible to prevent the embrittlement of a plating layer contained therein; and a method for producing the tin-plated/silver-plated laminate. The present invention is a method for producing a plated laminate by forming a silver plating layer on a tin plating layer that is formed on the surface of a metallic base material, said method being characterized by comprising: a first step of subjecting an arbitrary region in the surface of a tin plating layer to a nickel plating treatment, thereby forming a nickel plating layer; a second step of subjecting an arbitrary region in the surface of the nickel plating layer to a silver strike plating treatment; and a third step of subjecting at least a part of the surface region of the nickel plating layer, which has been subjected to the silver strike plating treatment, to a silver plating treatment.

Abstract translation: 提供：具有优异的耐磨性，导电性和滑动性和低摩擦性的镀锡/镀银层压体，从而可以防止其中包含的镀层的脆化; 以及制造镀锡/镀银层压体的方法。 本发明是一种通过在金属基材的表面上形成的镀锡层上形成银镀层来制造电镀层叠体的方法，其特征在于包括：第一步骤， 镀锡层的表面进行镀镍处理，由此形成镀镍层; 对镀镍层表面的任意区域进行银击镀处理的第二工序; 以及对经过银镀处理的镀镍层的表面区域的至少一部分进行镀银处理的第三工序。