公开(公告)号：US5252255A

公开(公告)日：1993-10-12

申请号：US521772

申请日：1990-06-11

申请人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

发明人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

IPC分类号： C08K3/08 ,  H01B1/22 ,  H05K9/00 ,  H01B1/00 ,  H01B1/02 ,  H01B1/20

CPC分类号： H05K9/0083 ,  C08K3/08 ,  H01B1/22

摘要： A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

摘要翻译： 通过将铜或镍颗粒混合到基底中，使金属颗粒与指定的显影剂接触并加热金属颗粒和显影剂来形成导电金属填充的基板。 填充的基板是导电的并且可用于诸如EMI屏蔽的各种用途。

公开(公告)号：US4997674A

公开(公告)日：1991-03-05

申请号：US204068

申请日：1988-06-06

申请人： William J. E. Parr ,  Ronald E. Hutton ,  Paul Y. Y. Moy ,  Dieter Frank ,  David A. Strawser

发明人： William J. E. Parr ,  Ronald E. Hutton ,  Paul Y. Y. Moy ,  Dieter Frank ,  David A. Strawser

IPC分类号： B22F7/04 ,  B32B15/08 ,  C23C4/18 ,  C23C24/06 ,  C23C24/08 ,  H01B1/22 ,  H01B13/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/14 ,  H05K3/20 ,  H05K3/24

CPC分类号： C23C24/085 ,  C23C24/087 ,  C23C4/18 ,  H01B1/22 ,  H05K3/022 ,  H05K3/102 ,  H05K3/14 ,  H05K3/20 ,  H05K3/207 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/0278 ,  H05K2203/122 ,  H05K3/244

摘要： A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.

公开(公告)号：US4961879A

公开(公告)日：1990-10-09

申请号：US204137

申请日：1988-06-08

申请人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

发明人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

IPC分类号： C08K3/02 ,  C08K3/08 ,  C08K5/17 ,  C08L101/00 ,  H01B1/22 ,  H05K9/00

CPC分类号： H05K9/0083 ,  C08K3/08 ,  H01B1/22

摘要： A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

摘要翻译： 通过将铜或镍颗粒混合到基底中，使金属颗粒与指定的显影剂接触并加热金属颗粒和显影剂来形成导电金属填充的基板。 填充的基板是导电的并且可用于诸如EMI屏蔽的各种用途。

公开(公告)号：US5173519A

公开(公告)日：1992-12-22

申请号：US613840

申请日：1991-01-07

申请人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald Hutton

发明人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald Hutton

IPC分类号： C08K3/02 ,  C08K3/08 ,  C08K5/17 ,  C08L101/00 ,  H01B1/22 ,  H05K9/00

CPC分类号： H05K9/0083 ,  C08K3/08 ,  H01B1/22

摘要： A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

公开(公告)号：US5049332A

公开(公告)日：1991-09-17

申请号：US547668

申请日：1990-07-03

申请人： Karolyn E. Ziemer ,  William J. E. Parr

发明人： Karolyn E. Ziemer ,  William J. E. Parr

IPC分类号： B29C70/88 ,  C08K3/08 ,  H01B1/22 ,  H05K9/00

CPC分类号： H05K9/0083 ,  B29C70/882 ,  C08K3/08 ,  H01B1/22 ,  B29K2995/0005 ,  Y10S264/25

摘要： A conductive-metal-filled substrate is formed by intermingling oxide coated, non-conductive copper or nickel particles into a substrate having a softening point of at least 200.degree. C. followed by compression molding at a temperature of at least 200.degree. C. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

摘要翻译： 通过将氧化物涂覆的非导电铜或镍颗粒混合到软化点至少为200℃的基材中，然后在至少200℃的温度下进行压缩成型，形成导电金属填充的基板。 填充的基板是导电的并且可用于诸如EMI屏蔽的各种用途。