Abstract:
The invention relates to a sealed duct vehicle cab post. A cab frame includes a hollow cab post having an air vent in a sidewall thereof and open first and second ends. A piece of unexpanded foam is attached to a clip. The clip has a base forming a foam piece support to which the piece of unexpanded foam is attached. The clip has a gripping member, and an arm connecting the base to the gripping member. The clip and the foam piece are inserted through the vent and into the post so that the unexpanded foam piece is inside the post and spaced apart from an edge of the vent and between the vent and the first end of the post. The gripping member is coupled to the post so that the gripping member grips, an edge of the vent. The cab frame and/or the post is then heated so that the foam expands and forms a seal within the post between the vent and the first end of the post. The result is a cab post with a sealed lower end wherein conditioned air from a roof mounted HVAC unit will flow from the upper end of the post, through the post to the vent and out of the vent and into the interior of the cab.
Abstract:
An efficient lubrication system for wet plate brake assemblies includes a flow control system that passes lubricant for cooling and lubrication through interdigitated wet brake plates when the plates are engaged. When the plates are disengaged, the wet plate assembly is controlled to limit its displacement by means of a pin and spring such that a gap is provided around the brake plates to provide a preferential path for lubricant, thus minimizing parasitic losses.
Abstract:
Microstructures are fabricated by impinging a radiation beam, such as a laser beam, through a substrate that is transparent to the laser beam, into a negative photoresist layer on the substrate. The negative photoresist layer may be subsequently developed to provide a master for optical and/or mechanical microstructures. Related systems, microstructure products and microstructure masters also are disclosed.
Abstract:
A light management film can be provided by an optically transparent substrate and an array of microlenses that is formed in a first side of the optically transparent substrate. An optically reflective layer is provided on a second side of the substrate that is opposite the first side, where the optically reflective layer includes apertures therein that are self-aligned to the microlenses.
Abstract:
An LCD can include a Compact Collimating Reflector (CCR), is configured to be located downstream in a light path from an LCD light source, where the CCR is configured to reflect light from the LCD light source to provide collimated light downstream from the CCR. A light diffusion film is located downstream from the CCR and is configured to receive the collimated light from the CCR. An LCD panel is located downstream from the CCR.
Abstract:
Microstructures are fabricated by imaging a microstructure master blank that includes a radiation sensitive layer sandwiched between a pair of outer layers, on an imaging platform, to define the microstructures in the radiation sensitive layer. At least one of the outer layers is then removed. The microstructures that were defined in the radiation sensitive layer are developed. The radiation sensitive layer sandwiched between the pair of outer layers may be fabricated as webs, to provide microstructure master blanks.
Abstract:
Microlens sheets include a first array of anamorphic micolenses on a face of a substrate. The microlenses in the first array are defined by a first parametric model along a direction of the first array. A second array of anamorphic micolenses is also provided on the face of the substrate, and interspersed with the first array. The microlenses in the second array are defined by a second parametric model that is different from the first parametric model, along the direction of the first array.
Abstract:
A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator moves relative to the frame in response to the change in temperature to remain substantially stationary relative to the substrate. Other MEMs structures, such as latches that can engage and hold the load in position, can be located outside the frame. Accordingly, in comparison to some conventional structures, temperature compensated microactuators according to the present invention can be made more compact by having the interior region of the frame free of other MEMs structures such as latches.
Abstract:
A microelectromechanical device comprises first and second beam members that have respective first ends connected to anchors, and that are also connected together. The first and second beam members are connected to a dielectric tether by a first tether anchor. The microelectromechanical device further comprises a third beam member that has a first end that is connected to an anchor and that is connected to the dielectric tether by a second tether anchor. At least one of the first and the second beam members are configured to elongate when the first and/or the second beam member is heated to a temperature that is greater than a temperature of the third beam member.
Abstract:
A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.