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    LIGHT MANAGEMENT FILMS, BACK LIGHT UNITS, AND RELATED STRUCTURES
    1.
    发明申请
    LIGHT MANAGEMENT FILMS, BACK LIGHT UNITS, AND RELATED STRUCTURES 审中-公开
    光管理薄膜，背光单元及相关结构

    公开(公告)号：US20090097229A1

    公开(公告)日：2009-04-16

    申请号：US12249557

    申请日：2008-10-10

    申请人： Robert L. Wood ,  John Wilson

    发明人： Robert L. Wood ,  John Wilson

    IPC分类号： F21V13/04

    CPC分类号： G02B3/0006 ,  G02B6/0053

    摘要： A light management film can be provided by an optically transparent substrate and an array of microlenses that is formed in a first side of the optically transparent substrate. An optically reflective layer is provided on a second side of the substrate that is opposite the first side, where the optically reflective layer includes apertures therein that are self-aligned to the microlenses.

    摘要翻译： 可以通过光学透明基板和形成在光学透明基板的第一面中的微透镜阵列来提供光管理膜。 光学反射层设置在基板的与第一侧相对的第二侧上，其中光学反射层包括与微透镜自对准的孔。

    Light transmissive structures and fabrication methods for controlling far-field light distribution
    2.
    发明授权
    Light transmissive structures and fabrication methods for controlling far-field light distribution 有权
    用于控制远场光分布的透光结构和制造方法

    公开(公告)号：US09086521B2

    公开(公告)日：2015-07-21

    申请号：US14007472

    申请日：2012-03-29

    申请人： Thomas A. Rinehart ,  Robert L. Wood ,  Ken G. Purchase

    发明人： Thomas A. Rinehart ,  Robert L. Wood ,  Ken G. Purchase

    IPC分类号： F21V1/00 ,  G02B5/02 ,  F21V5/00 ,  F21V3/04

    CPC分类号： G02B5/0221 ,  F21V3/049 ,  F21V5/002 ,  G02B5/0278 ,  G02B5/0294

    摘要： Light transmissive structures include a light transmissive substrate that includes optical microstructures. The optical microstructures have a geometric feature that is configured to reduce glare in light transmitted through the light transmissive structure. Moreover, the plurality of optical microstructures also have a geometric feature that is configured to vary randomly and/or pseudorandomly across the light transmissive substrate so as to diffuse light transmitted through the light transmissive structure. Related fabrication methods are also described.

    摘要翻译： 透光结构包括包含光学微结构的透光基底。 光学微结构具有几何特征，其被配置为减少透射通过透光结构的光的眩光。 此外，多个光学微结构还具有被配置为跨透光基板随机和/或伪随机变化以便扩散透过透光结构的光的几何特征。 还描述了相关的制造方法。

    Portable front projection screen assemblies with flexible screens
    5.
    发明授权
    Portable front projection screen assemblies with flexible screens 失效
    带柔性屏幕的便携式前投屏幕组件

    公开(公告)号：US07489444B1

    公开(公告)日：2009-02-10

    申请号：US11961364

    申请日：2007-12-20

    申请人： Douglas Adams ,  Robert L. Wood ,  Edward Fadel ,  Donald Hirsh ,  Sean Hillard

    发明人： Douglas Adams ,  Robert L. Wood ,  Edward Fadel ,  Donald Hirsh ,  Sean Hillard

    IPC分类号： G03B21/60

    CPC分类号： G03B21/60

    摘要： Portable projection screen assemblies include a case comprising a flexible projector screen held on a roller, the screen has a high ARR and a high-gain and can be adapted for use in uncontrolled indoor ambient lighting conditions. The case is configured with releasably matable first and second housing members and a slidably collapsible frame that slides open in a side-to-side orientation and unrolls the projector screen to at least one predetermined viewing configuration and closes together to encase the screen and frame therein. The projector screens may be particularly suitable for use with low-lumen projectors.

    摘要翻译： 便携式投影屏幕组件包括壳体，其包括保持在辊上的柔性投影仪屏幕，屏幕具有高ARR和高增益，并且可适用于不受控制的室内环境照明条件。 该壳体配置有可释放地配合的第一和第二壳体构件和可滑动地折叠的框架，其以侧面对侧方向滑动并将投影仪屏幕展开至少一个预定的观察构造，并且一起关闭以将屏幕和框架包围在其中 。 投影机屏幕可能特别适用于低流明投影机。

    Methods of overplating surfaces of microelectromechanical structure
    7.
    发明授权
    Methods of overplating surfaces of microelectromechanical structure 有权
    微机电结构表面超镀的方法

    公开(公告)号：US06596147B2

    公开(公告)日：2003-07-22

    申请号：US09809538

    申请日：2001-03-15

    申请人： Edward Hill ,  Robert L. Wood ,  Ramaswamy Mahadevan

    发明人： Edward Hill ,  Robert L. Wood ,  Ramaswamy Mahadevan

    IPC分类号： C25D502

    CPC分类号： H02N10/00 ,  B81B3/0024 ,  B81B3/0081 ,  H01H1/0036 ,  H01H2001/0042

    摘要： MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. In an alternative embodiment wherein the active microactuator is suspended within a frame above the substrate, the MEMS structure holds at least a portion of the active microactuator in a fixed position relative to the substrate over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. By actively altering the temperature of the active microactuator, the active microactuator can be controllably moved relative to the temperature compensation microactuator and/or the underlying substrate. Related methods of compensating for the effects of ambient temperature variations are provided. Further, an overplating technique is provided for precisely sizing a gap defined within a MEMS structure.

    摘要翻译： 提供了补偿环境温度变化，工艺变化等的MEMS结构，并且可以用于许多应用中。 这些结构包括适于热致动以响应于其温度的主动改变而移动的主动微型致动器。 活性微致动器可以进一步适于响应于环境温度变化而移动。 这些结构还包括适于响应于环境温度变化而移动的温度补偿元件，例如温度补偿微致动器或框架。 活动微型致动器和温度补偿元件响应于环境温度变化而协同运动。 因此，在活动微型致动器的温度的有效改变的情况下，在宽的环境温度范围内，在有源微致动器和相关联的温度补偿微致动器之间保持预定的空间关系。 在其中将活性微致动器悬挂在衬底上方的框架内的MEMS替代实施例中，MEMS结构将活性微致动器的至少一部分在宽的环境温度范围内保持在相对于衬底的固定位置，而没有主动改变温度 的活性微致动器。 通过主动地改变活性微致动器的温度，可以相对于温度补偿微致动器和/或底层衬底可控地移动活性微致动器。 提供了补偿环境温度变化影响的相关方法。 此外，提供了一种用于精确地确定在MEMS结构内限定的间隙的过平面技术。

    Latchable microelectromechanical structures using non-newtonian fluids, and methods of operating same
    8.
    发明授权
    Latchable microelectromechanical structures using non-newtonian fluids, and methods of operating same 失效

    公开(公告)号：US06522452B2

    公开(公告)日：2003-02-18

    申请号：US09842602

    申请日：2001-04-26

    申请人： Robert L. Wood

    发明人： Robert L. Wood

    IPC分类号： G02B2600

    CPC分类号： G02B26/0841 ,  B81B3/0054 ,  B81B2201/018 ,  H01H2001/0042 ,  H02K99/20

    摘要： Mounting systems for micro-electromechanical system (MEMS) structures are provided including a non-Newtonian fluid having a threshold viscosity that is positioned between a MEMS base member and the MEMS structure so as to position the MEMS structure relative to the base member. A MEMS actuator is coupled to the MEMS structure. The MEMS actuator is positioned to cause movement of the MEMS structure relative to the MEMS base member by generating a force sufficient to exceed the threshold viscosity of the non-Newtonian fluid when the MEMS actuator is actuated. The MEMS structure may be a MEMS mirror positioned for pivotal movement about a bearing member to control tilt of the MEMS mirror.

    Methods of fabricating microneedle arrays using sacrificial molds
    9.
    发明授权
    Methods of fabricating microneedle arrays using sacrificial molds 失效
    使用牺牲模具制造微针阵列的方法

    公开(公告)号：US06511463B1

    公开(公告)日：2003-01-28

    申请号：US09442827

    申请日：1999-11-18

    申请人： Robert L. Wood ,  Henry A. Wynands ,  Karen W. Markus

    发明人： Robert L. Wood ,  Henry A. Wynands ,  Karen W. Markus

    IPC分类号： A61M500

    CPC分类号： B81C99/0085 ,  A61B5/14514 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150984 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  Y10T29/302 ,  Y10T29/49222

    摘要： Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold. The first material preferably is coated on the sacrificial mold by plating. Prior to plating, a plating base preferably is formed on the sacrificial mold including on the substrate and on the array of posts. The inner and outer surfaces of the array of hollow tubes preferably are coated with the second material by overplating the second material on the inner and outer surfaces of the array of hollow tubes.

    摘要翻译： 微针阵列通过提供包括基底和从其突出的柱的阵列（优选固体柱）的牺牲模具来制造。 第一材料涂覆在牺牲模具上，包括在基板上和柱阵列上。 去除牺牲模具以提供从基部突出的中空管阵列。 中空管阵列的内表面和外表面涂覆有第二材料以产生从基底突出的微针阵列。 牺牲模具可以通过制造主模具来制造，该模具包括从其表面延伸到主模具中的通道阵列。 将第三种材料模制到通道中并在母模的表面上，以形成牺牲模具。 然后将牺牲模具与主模具分离。 或者，引线接合可用于将线阵列引线接合到基底以产生牺牲模。 第一种材料优选通过电镀涂覆在牺牲模具上。 在电镀之前，优选在包括在基板和柱阵列上的牺牲模具上形成镀覆基底。 优选地，中空管阵列的内表面和外表面通过在中空管阵列的内表面和外表面上的第二材料的上镀敷而涂覆有第二材料。

    Microelectromechanical actuators including sinuous beam structures
    10.
    发明授权
    Microelectromechanical actuators including sinuous beam structures 失效
    微机电致动器包括弯曲梁结构

    公开(公告)号：US06367252B1

    公开(公告)日：2002-04-09

    申请号：US09610047

    申请日：2000-07-05

    申请人： Edward A. Hill ,  Vijayakumar Rudrappa Dhuler ,  Allen Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

    发明人： Edward A. Hill ,  Vijayakumar Rudrappa Dhuler ,  Allen Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

    IPC分类号： F01B2910

    CPC分类号： B81B3/0051 ,  B81B2201/038 ,  B81B2203/0109 ,  B81B2203/056 ,  H01H1/0036 ,  H01H61/00 ,  H01H2061/006

    摘要： In embodiments of the present invention, a microelectromechanical actuator includes a beam having respective first and second ends attached to a substrate and a body disposed between the first and second ends having a sinuous shape. The body includes a portion operative to engage a object of actuation and apply a force thereto in a direction perpendicular to the beam responsive to at least one of a compressive force and a tensile force on the beam. The sinuous shape may be sinusoidal, e.g., a shape approximating a single period of a cosine curve or a single period of a sine curve. The beam may be thermally actuated or driven by another actuator. In other embodiments, a rotary actuator includes first and second beams, a respective one of which has first and second ends attached to a substrate and a body disposed between the first and second ends. Each body includes first and second oppositely inflected portions. The bodies of the first and second beams intersect one another at points at which the first and second oppositely inflected portions of the first and second bodies meet. The bodies of the first and second beams are operative to engage the object of actuation and rotate the object of actuation around the point of intersection responsive to at least one of compressive force and tensile force on the first and second beams. Related methods are also described.

    摘要翻译： 在本发明的实施例中，微机电致动器包括具有附接到基板的相应的第一端和第二端的梁，以及设置在具有弯曲形状的第一端和第二端之间的主体。 主体包括可操作地接合致动对象的部分，该部分响应于梁上的压缩力和拉力中的至少一个，沿垂直于梁的方向施加力。 弯曲形状可以是正弦的，例如，近似于余弦曲线的单个周期或正弦曲线的单个周期的形状。 梁可以由另一致动器热致动或驱动。 在其他实施例中，旋转致动器包括第一和第二梁，其中相应的一个具有附接到基板的第一和第二端以及设置在第一和第二端之间的主体。 每个主体包括第一和第二相对弯曲的部分。 第一和第二梁的主体在第一和第二主体的第一和第二相对弯曲部分相交的点处彼此相交。 第一和第二梁的主体可操作以接合致动对象，并且响应于第一和第二梁上的压缩力和拉力中的至少一个而使作动点周围的相对点旋转。 还描述了相关方法。