公开(公告)号：US11538699B2

公开(公告)日：2022-12-27

申请号：US16412641

申请日：2019-05-15

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska ,  Justin Wendt

IPC分类号： H01L21/67 ,  G02F1/13357 ,  H01L23/00 ,  H01L33/54 ,  B32B37/00 ,  H01L21/68 ,  H01L21/683 ,  H01L33/00 ,  G02F1/1335

摘要： An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.

公开(公告)号：US11232968B2

公开(公告)日：2022-01-25

申请号：US16147055

申请日：2018-09-28

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska

IPC分类号： B23P19/00 ,  H01L21/683 ,  H01L21/68 ,  H01L21/677

摘要： A direct transfer apparatus includes a dot matrix transfer head, which includes an impact wire housing and a plurality of impact wires disposed within the impact wire housing and extending out of the impact wire housing. A guide head is attached to the impact wire housing. The guide head includes multiple holes configured to arrange the plurality of impact wires in a matrix configuration, the matrix configuration being a matched-pitch configuration.

公开(公告)号：US20210142700A1

公开(公告)日：2021-05-13

申请号：US16305833

申请日：2017-05-30

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska ,  Justin Wendt

IPC分类号： G09F23/00 ,  H05B45/20 ,  H05B45/10 ,  G09F9/302

摘要： An electronic device includes a housing and an array of LEDs deposited on a substrate disposed in the housing. The array of LEDs is disposed to form an indicia via which a logo is displayable.

公开(公告)号：US20210035837A1

公开(公告)日：2021-02-04

申请号：US16530886

申请日：2019-08-02

申请人： Rohinni, LLC

发明人： Andrew Huska

IPC分类号： H01L21/677 ,  H01L21/68 ,  H01L21/683

摘要： An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.

公开(公告)号：US20200251453A1

公开(公告)日：2020-08-06

申请号：US16856970

申请日：2020-04-23

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/683 ,  H01L23/544 ,  H01L23/00 ,  H01L21/48 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L21/67 ,  H01L33/62 ,  G02F1/13357 ,  H01L23/532

摘要： A method includes loading a wafer tape into a first frame, the wafer tape having a first side and a second side, a first semiconductor device die being disposed on the first side of the wafer tape. A substrate is loaded into a second frame, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred. A needle is oriented to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape, and a needle actuator connected to the needle is activated to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

公开(公告)号：US20200234677A1

公开(公告)日：2020-07-23

申请号：US16746715

申请日：2020-01-17

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska

IPC分类号： G09G5/10 ,  G06F1/18

摘要： A display device includes lighting elements and/or circuit arrangements including lighting elements that are configured to, at a predetermined time, receive a boost of stored energy and emit a brightness level greater than the brightness level that is emitted with the use of the lighting elements and/or circuit arrangements when not using the stored energy.

公开(公告)号：US20200168587A1

公开(公告)日：2020-05-28

申请号：US16694665

申请日：2019-11-25

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  G02F1/13357 ,  H01L23/532 ,  H01L21/677 ,  H01L21/67 ,  H01L21/66 ,  H01L33/62 ,  H01L23/00 ,  H01L21/687 ,  H01L21/68 ,  H01L21/48 ,  H01L23/544 ,  H01L21/683

摘要： A system performs a direct transfer of a semiconductor device die from a first substrate to a second substrate. A semiconductor device die is disposed on a first side of the first substrate. The system includes a first conveyance mechanism to convey the first substrate, and a second conveyance mechanism to convey the second substrate with respect to the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also comprises a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.

公开(公告)号：US20200160762A1

公开(公告)日：2020-05-21

申请号：US16678534

申请日：2019-11-08

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska

IPC分类号： G09F13/00 ,  F21V8/00 ,  G06F1/00

摘要： An electronic device comprising a housing having a front and a back; a component embedded within the front or the back of the housing; and an array of light-generating sources (LGSs) deposited on a substrate disposed in the housing, the array of LGSs being disposed adjacent at least a portion of the component of the electronic device.

公开(公告)号：US10410905B1

公开(公告)日：2019-09-10

申请号：US15978094

申请日：2018-05-12

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska

IPC分类号： H01L21/683 ,  H01L21/687

摘要： An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. Two or more needles are disposed adjacent a second side of the wafer tape opposite the first side. A length of the two or more needles extends in a direction toward the wafer tape. A needle actuator actuates the two or more needles into a die transfer position at which at least one needle of the two or more needles presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.

公开(公告)号：US20190237445A1

公开(公告)日：2019-08-01

申请号：US16381982

申请日：2019-04-11

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/683 ,  G02F1/1335 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L33/62 ,  H01L21/67 ,  H01L23/544 ,  H01L21/48 ,  H01L23/532

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.