Method for fabricating a spring structure on a substrate
    1.
    发明授权
    Method for fabricating a spring structure on a substrate 有权
    在基板上制造弹簧结构的方法

    公开(公告)号:US06658728B2

    公开(公告)日:2003-12-09

    申请号:US09917572

    申请日:2001-07-27

    IPC分类号: H05K330

    摘要: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

    摘要翻译: 通过使用单个掩模通过形成弹簧金属和释放材料层来将含有接触垫或金属通孔的弹性结构光刻制造到衬底上的有效方法。 具体地说,使用光致抗蚀剂掩模或电镀金属图案或使用剥离处理技术,释放材料垫与弹簧金属手指自对准。 然后使用释放掩模释放弹簧金属指,同时保持将弹簧金属指的锚固部分固定到基底的释放材料的一部分。 当释放材料是导电的(例如钛)时,该释放材料部分直接位于接触垫或金属通孔上方,并且用作在完成的弹簧结构中的弹簧金属指的导管。 当释放材料不导电时,形成金属带以将弹簧金属手指连接到接触垫/通孔。

    Spring structure with self-aligned release material

    公开(公告)号:US06361331B1

    公开(公告)日:2002-03-26

    申请号:US09923600

    申请日:2001-08-06

    IPC分类号: H01R909

    摘要: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

    Spring structure with self-aligned release material
    3.
    发明授权
    Spring structure with self-aligned release material 有权
    具有自对准脱模材料的弹簧结构

    公开(公告)号:US06290510B1

    公开(公告)日:2001-09-18

    申请号:US09626936

    申请日:2000-07-27

    IPC分类号: H01R909

    摘要: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

    摘要翻译: 通过使用单个掩模通过形成弹簧金属和释放材料层来将含有接触垫或金属通孔的弹性结构光刻制造到衬底上的有效方法。 具体地说,使用光致抗蚀剂掩模或电镀金属图案或使用剥离处理技术,释放材料垫与弹簧金属手指自对准。 然后使用释放掩模释放弹簧金属指,同时保持将弹簧金属指的锚固部分固定到基底的释放材料的一部分。 当释放材料是导电的(例如钛)时,该释放材料部分直接位于接触垫或金属通孔上方,并且用作在完成的弹簧结构中的弹簧金属指的导管。 当释放材料不导电时,形成金属带以将弹簧金属指连接到接触垫或金属通孔,并且还将弹簧金属指状物进一步锚定到基底。

    Game of chance
    7.
    发明授权
    Game of chance 有权
    机会游戏

    公开(公告)号:US07802793B2

    公开(公告)日:2010-09-28

    申请号:US11576374

    申请日:2005-09-30

    IPC分类号: A63F3/06

    摘要: A game of chance playable by two or more players and a method of playing the game, the game of chance comprising a gaming ticket (2) including removable first portions (8) removable by a first player to reveal first indicia and removable second portions (10) removable by a second player to reveal second indicia, wherein the first and second players compete against each other by removing the respective removable first indicia until a winner of the game is determined.

    摘要翻译: 由两个或更多个玩家可玩的游戏和玩游戏的方法,机会游戏包括游戏票(2),游戏票(2)包括可移除的第一部分(8),其可由第一玩家移除以露出第一标记和可移除的第二部分 10)可由第二播放器移除以显示第二标记,其中第一和第二玩家通过移除相应的可移除的第一标记来相互竞争,直到确定游戏的胜者为止。

    Game of Chance
    8.
    发明申请
    Game of Chance 有权
    机会游戏

    公开(公告)号:US20080252003A1

    公开(公告)日:2008-10-16

    申请号:US11576374

    申请日:2005-09-30

    IPC分类号: A63F9/00 A63F9/04

    摘要: A game of chance playable by two or more players and a method of playing the game, the game of chance comprising a gaming ticket (2) including removable first portions (8) removable by a first player to reveal first indicia and removable second portions (10) removable by a second player to reveal second indicia, wherein the first and second players compete against each other by removing the respective removable first indicia until a winner of the game is determined.

    摘要翻译: 由两个或更多个玩家可玩的游戏和玩游戏的方法,机会游戏包括游戏票(2),游戏票(2)包括可移除的第一部分(8),其可由第一玩家移除以显露第一标记和可移除的第二部分 10)可由第二播放器移除以显示第二标记,其中第一和第二玩家通过移除相应的可移除的第一标记来相互竞争,直到确定游戏的胜者为止。