摘要:
The photodiode has a p-type doped region (2) and an n-type doped region (3) in a semiconductor body (1), and a pn junction (4) between the p-type doped region and the n-type doped region. The semiconductor body has a cavity (5) such that the pn junction (4) has a distance (d) of at most 30 μm from the bottom of the cavity (7).
摘要:
Through a main surface (10) of a semiconductor substrate (1) of a first type of conductivity, a doped well of a second type of conductivity is implanted to form a sensor region (3) extending perpendicularly to the main surface. The sensor region can be confined laterally by trenches (5) comprising an electrically insulating trench filling (6). The bottom of the sensor region is insulated by a pn-junction (20). Contacts (4) are applied to the main surface and provided for the application of an operation voltage and the measurement of a Hall voltage.
摘要:
An optoelectronic component that includes a semiconductor device and an optical component is disclosed. The semiconductor device includes at least one radiation-sensitive zone configured to detect electromagnetic radiation. The optical element for focusing is configured to focus the electromagnetic radiation in the at least one radiation-sensitive zone. The optical element includes a diffractive element having structures on the order of magnitude of the wavelength of the electromagnetic radiation.
摘要:
A chip design (1) comprising an external supply connection (VBAT), an internal supply connection (VDD), an integrated circuit (2) that is coupled to the internal supply connection (VDD) for voltage supply, and a fuse (3) that electrically connects the internal supply connection (VBAT) and is arranged within the chip design (1).
摘要:
At least one terminal contact surface (1) is formed on a topmost metal plane (2). Under it, in a secondmost metal plane (3), is a reinforcement region (8), in which the secondmost metal plane (3) is structured within its two-dimensional extent such that a part of the area of the vertical (with respect to the metal plane) projection of the terminal contact surface (1) onto the secondmost metal plane (3) that is occupied by the metal of the secondmost metal plane (3) amounts to at least one third of the area.
摘要:
In order to produce doping regions (DG) in a substrate (S) having different dopings with the aid of a single mask (DM) different mask regions are provided which have elongated mask openings (MO) having different orientations relative to the spatial direction of an oblique implantation. The substrate is rotated between the first and second oblique implantations, wherein during the first oblique implantation maximum and minimum shadings in the different mask regions are opposite one another and the conditions are precisely reversed during the second oblique implantation after the rotation of the substrate.
摘要:
In order to produce doping regions (DG) in a substrate (S) having different dopings with the aid of a single mask (DM) different mask regions are provided which have elongated mask openings (MO) having different orientations relative to the spatial direction of an oblique implantation. The substrate is rotated between the first and second oblique implantations, wherein during the first oblique implantation maximum and minimum shadings in the different mask regions are opposite one another and the conditions are precisely reversed during the second oblique implantation after the rotation of the substrate.
摘要:
A semiconductor body (10) comprises a field-effect transistor (11). The field-effect transistor (11) comprises a drain region (12) of a first conduction type, a source region (13) of the first conduction type, a drift region (16) and a channel region (14) of a second conduction type which is opposite to the first conduction type. The drift region (16) comprises at least two stripes (15, 32) of the first conduction type which extend from the drain region (12) in a direction towards the source region (13). The channel region (14) is arranged between the drift region (16) and the source region (13).
摘要:
At least one terminal contact surface (1) is formed on a topmost metal plane (2). Under it, in a secondmost metal plane (3), is a reinforcement region (8), in which the secondmost metal plane (3) is structured within its two-dimensional extent such that a part of the area of the vertical (with respect to the metal plane) projection of the terminal contact surface (1) onto the secondmost metal plane (3) that is occupied by the metal of the secondmost metal plane (3) amounts to at least one third of the area.
摘要:
A semiconductor body (10) comprises a field-effect transistor (11). The field-effect transistor (11) comprises a drain region (12) of a first conduction type, a source region (13) of the first conduction type, a drift region (16) and a channel region (14) of a second conduction type which is opposite to the first conduction type. The drift region (16) comprises at least two stripes (15, 32) of the first conduction type which extend from the drain region (12) in a direction towards the source region (13). The channel region (14) is arranged between the drift region (16) and the source region (13).