Lateral SOI component having a reduced on resistance
    1.
    发明授权
    Lateral SOI component having a reduced on resistance 有权
    具有降低导通电阻的横向SOI元件

    公开(公告)号:US07554157B2

    公开(公告)日:2009-06-30

    申请号:US11527760

    申请日:2006-09-26

    IPC分类号: H01L27/12 H01L29/76

    摘要: An SOI semiconductor component comprises a semiconductor substrate having a basic doping, a dielectric layer arranged on the semiconductor substrate, and a semiconductor layer arranged on the dielectric layer. The semiconductor layer includes a drift zone of a first conduction type, a junction between the drift zone and a further component zone which is configured in such a way that a space charge zone is formed in the drift zone when a reverse voltage is applied to the junction, and a terminal zone adjacent to the drift zone. A first terminal electrode is connected to the further component zone, and a second terminal electrode is connected to the terminal zone. In the semiconductor substrate a first semiconductor zone is doped complementarily with respect to a basic doping of the semiconductor substrate, and the first terminal electrode is connected to the first semiconductor zone. A rectifier element is connected between the first terminal electrode and the first semiconductor zone.

    摘要翻译: SOI半导体部件包括具有基本掺杂的半导体衬底,布置在半导体衬底上的电介质层和布置在电介质层上的半导体层。 半导体层包括第一导电类型的漂移区域,漂移区域和另一组件区域之间的结,该区域构造成使得当反向电压施加到漂移区域时在漂移区域中形成空间电荷区域 结和与漂移区相邻的终端区。 第一端子电极连接到另一组件区域,并且第二端子电极连接到端子区域。 在半导体衬底中,第一半导体区相对于半导体衬底的基本掺杂互补地掺杂,并且第一端电极连接到第一半导体区。 整流元件连接在第一端子电极和第一半导体区域之间。

    Lateral SOI component having a reduced on resistance
    3.
    发明申请
    Lateral SOI component having a reduced on resistance 有权
    具有降低导通电阻的横向SOI元件

    公开(公告)号:US20070080395A1

    公开(公告)日:2007-04-12

    申请号:US11527760

    申请日:2006-09-26

    IPC分类号: H01L29/76

    摘要: An SOI semiconductor component comprises a semiconductor substrate having a basic doping, a dielectric layer arranged on the semiconductor substrate, and a semiconductor layer arranged on the dielectric layer. The semiconductor layer includes a drift zone of a first conduction type, a junction between the drift zone and a further component zone which is configured in such a way that a space charge zone is formed in the drift zone when a reverse voltage is applied to the junction, and a terminal zone adjacent to the drift zone. A first terminal electrode is connected to the further component zone, and a second terminal electrode is connected to the terminal zone. In the semiconductor substrate a first semiconductor zone is doped complementarily with respect to a basic doping of the semiconductor substrate, and the first terminal electrode is connected to the first semiconductor zone. A rectifier element is connected between the first terminal electrode and the first semiconductor zone.

    摘要翻译: SOI半导体部件包括具有基本掺杂的半导体衬底,布置在半导体衬底上的电介质层和布置在电介质层上的半导体层。 半导体层包括第一导电类型的漂移区域,漂移区域和另一组件区域之间的结,该区域构造成使得当反向电压施加到漂移区域时在漂移区域中形成空间电荷区域 结和与漂移区相邻的终端区。 第一端子电极连接到另一组件区域,并且第二端子电极连接到端子区域。 在半导体衬底中,第一半导体区相对于半导体衬底的基本掺杂互补地掺杂,并且第一端电极连接到第一半导体区。 整流元件连接在第一端子电极和第一半导体区域之间。

    Lateral semiconductor device and manufacturing method therefor
    4.
    发明授权
    Lateral semiconductor device and manufacturing method therefor 有权
    侧面半导体器件及其制造方法

    公开(公告)号:US08686505B2

    公开(公告)日:2014-04-01

    申请号:US13560109

    申请日:2012-07-27

    摘要: A method produces a semiconductor device including a semiconductor body, an electrode thereon, and an insulating structure insulating the electrode from the semiconductor body. The semiconductor body includes a first contact region of a first conductivity type, a body region of a second conductivity type, a drift region of the first conductivity type, and a second contact region having a higher maximum doping concentration than the drift region. The insulating structure includes a gate dielectric portion forming a first horizontal interface. with the drift region and has a first maximum vertical extension A field dielectric portion forms with the drift region second and third horizontal interfaces arranged below the main surface. A second maximum vertical extension of the field dielectric portion is larger than the first maximum vertical extension. A third maximum vertical extension of the field dielectric portion is larger than the second maximum vertical extension.

    摘要翻译: 一种方法产生半导体器件,其包括半导体本体,其上的电极以及将电极与半导体本体绝缘的绝缘结构。 半导体本体包括第一导电类型的第一接触区域,第二导电类型的体区域,第一导电类型的漂移区域和具有比漂移区域更高的最大掺杂浓度的第二接触区域。 绝缘结构包括形成第一水平界面的栅介质部分。 具有漂移区域并且具有第一最大垂直延伸部A场介电部分形成,漂移区域布置在主表面下方的第二和第三水平界面。 场介电部分的第二最大垂直延伸大于第一最大垂直延伸。 场电介质部分的第三最大垂直延伸大于第二最大垂直延伸。

    Lateral semiconductor component in thin-film SOI technology
    6.
    发明授权
    Lateral semiconductor component in thin-film SOI technology 有权
    薄膜SOI技术中的侧向半导体元件

    公开(公告)号:US06693327B2

    公开(公告)日:2004-02-17

    申请号:US10074605

    申请日:2002-02-12

    IPC分类号: H01L2701

    摘要: A lateral semiconductor element (10) in thin-film SOI technology comprises an insulator layer (14) which rests on a substrate (12) and is buried under a thin silicon film (16), on top of which the source, or anode, contact (18) and the drain, or cathode, contact (22) are mounted. The anode contact (18) and the cathode contact (22) each lie over separate shield regions (28,30) within substrate (12), with the anode contact (18) being electrically connected with substrate (12).

    摘要翻译: 薄膜SOI技术中的横向半导体元件(10)包括沉积在衬底(12)上并被埋在薄硅膜(16)下面的绝缘体层(14),其上的源极或阳极, 触点(18)和漏极(或阴极)触点(22)被安装。 阳极接触件(18)和阴极接触件(22)各自位于衬底(12)内的分离的屏蔽区域(28,30)上,阳极接触件(18)与衬底(12)电连接。

    Lateral Semiconductor Device and Manufacturing Method Therefor
    7.
    发明申请
    Lateral Semiconductor Device and Manufacturing Method Therefor 有权
    侧向半导体器件及其制造方法

    公开(公告)号:US20140027848A1

    公开(公告)日:2014-01-30

    申请号:US13560109

    申请日:2012-07-27

    IPC分类号: H01L29/78 H01L29/66

    摘要: A method produces a semiconductor device including a semiconductor body, an electrode thereon, and an insulating structure insulating the electrode from the semiconductor body. The semiconductor body includes a first contact region of a first conductivity type, a body region of a second conductivity type, a drift region of the first conductivity type, and a second contact region having a higher maximum doping concentration than the drift region. The insulating structure includes a gate dielectric portion forming a first horizontal interface. with the drift region and has a first maximum vertical extension A field dielectric portion forms with the drift region second and third horizontal interfaces arranged below the main surface. A second maximum vertical extension of the field dielectric portion is larger than the first maximum vertical extension. A third maximum vertical extension of the field dielectric portion is larger than the second maximum vertical extension.

    摘要翻译: 一种方法产生半导体器件,其包括半导体本体,其上的电极以及将电极与半导体本体绝缘的绝缘结构。 半导体本体包括第一导电类型的第一接触区域,第二导电类型的体区域,第一导电类型的漂移区域和具有比漂移区域更高的最大掺杂浓度的第二接触区域。 绝缘结构包括形成第一水平界面的栅介质部分。 具有漂移区域并且具有第一最大垂直延伸部A场介电部分形成,漂移区域布置在主表面下方的第二和第三水平界面。 场介电部分的第二最大垂直延伸大于第一最大垂直延伸。 场电介质部分的第三最大垂直延伸大于第二最大垂直延伸。