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公开(公告)号:US4001065A
公开(公告)日:1977-01-04
申请号:US568935
申请日:1975-04-17
IPC分类号: C08K5/00 , B29C53/58 , B29C53/84 , B29C61/00 , B29C61/06 , B29C63/08 , B29C63/40 , C08L23/08 , H01B3/42 , H01B3/44 , H01B7/02 , H01B13/08 , B29C27/20
CPC分类号: H01B13/08 , B29C53/845 , B29C61/003 , B29C61/06 , B29C63/08 , B29C63/40 , C08L23/0853 , H01B3/425 , H01B3/441 , H01B7/0241 , B29C53/58 , B29K2023/00 , B29L2007/007 , C08L2205/02 , C08L2205/03 , C08L23/0869 , Y10S264/71 , Y10T156/1031
摘要: A process of wrapping a substrate to insulate or protect it, wherein a tape comprising a cross-linked copolymer derived from an ethylenically unsaturated hydrocarbon and a carboxylic acid ester having ethylenic unsaturation is wrapped around the substrate, and subsequently shrunk. Although the tape is cross-linked, it nevertheless fuses sufficiently to bond to itself to form an integral structure. The substrate can if desired be removed, the tape serving as the inner layer to a hose.
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公开(公告)号:US3983070A
公开(公告)日:1976-09-28
申请号:US354128
申请日:1973-04-24
申请人: Richard John Penneck
发明人: Richard John Penneck
CPC分类号: H01B3/46 , C07F7/0834 , C08K3/34 , C08K9/06 , C08L83/04 , C09J123/0853 , H01B3/30 , C08L2205/03 , C08L67/04
摘要: This invention relates to adhesives which are particularly useful in bonding polymeric materials used in the encapsulation and termination of insulated electrical conductors. The adhesive comprises a polar copolymer of an .alpha.-olefin, said copolymer preferably having an acid number in the range of from 4 to 40 and containing pendant ester, amide, ketonic, anhydride or carboxylic acid groups and an inorganic silicon-containing compound which has been chemically treated with an organosilicon compound.
摘要翻译: 本发明涉及在绝缘电导体的封装和终止中使用的聚合物材料中特别有用的粘合剂。 粘合剂包括α-烯烃的极性共聚物,所述共聚物优选具有4-40的酸值,并且含有侧酯,酰胺,酮,酸酐或羧酸基和无机含硅化合物,它们具有 用有机硅化合物进行化学处理。
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公开(公告)号:US4001128A
公开(公告)日:1977-01-04
申请号:US274110
申请日:1972-07-21
申请人: Richard John Penneck
发明人: Richard John Penneck
CPC分类号: H01B3/10 , H01B3/30 , Y10S174/01
摘要: A filler system for polymers is disclosed which provides high voltage insulation which is resistant to tracking. The filler system utilizes a combination of alumina trihydrate and a chemically treated silica filler. The silica-treated filler results from the exposure of an inorganic silicon-containing filler having a specific surface area of at least 40 square meters per gram to one or more silanes. Preferred silanes are substituted silanes having the formula R.sub.n Si X.sub.4.sub.-n where n is 1, 2 or 3, R is an organic radical bonded to the silicon atom by a Si--C bond and X is a radical bound to the silicon atom via an atom other than a carbon atom.
摘要翻译: 公开了一种用于聚合物的填充体系,其提供了抗跟踪的高电压绝缘。 填料系统利用三水合氧化铝和化学处理的二氧化硅填料的组合。 二氧化硅处理的填料是由比表面积至少为40平方米/克的无机含硅填料暴露于一种或多种硅烷。 优选的硅烷是具有式R n Si X 4-n的取代硅烷,其中n是1,2或3,R是通过Si-C键与硅原子键合的有机基团,X是通过经由 除碳原子以外的原子。
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公开(公告)号:US3969308A
公开(公告)日:1976-07-13
申请号:US540447
申请日:1975-01-13
申请人: Richard John Penneck
发明人: Richard John Penneck
IPC分类号: C07F7/08 , C08K3/34 , C08K9/06 , C08L23/02 , C08L23/06 , C08L23/08 , C08L23/16 , C08L23/34 , C08L27/16 , C08L33/08 , C08L83/04 , C08L83/14 , C09J123/08 , H01B3/30 , H01B3/46
CPC分类号: H01B3/46 , C07F7/0834 , C08K3/34 , C08K9/06 , C08L23/06 , C08L23/0869 , C08L23/16 , C08L23/34 , C08L27/16 , C08L33/08 , C08L83/00 , C08L83/04 , C08L83/14 , H01B3/30 , C08G77/20 , C08G77/44 , C08G77/56 , C08G77/70 , C08L2205/03 , Y10S174/01
摘要: A novel composition is disclosed which contains a silicone polymer, a non-silicone polymer other than polytetrafluoroethylene and a chemically treated filler. The non-silicone polymer may be an elastomer or a thermoplastic such as a polyolefin, a copolymer containing an olefin, a halogen-containing polymer or copolymer or a copolymer of fluorine-containing polymers other than polytetrafluoroethylene. The filler is an inorganic silicon-containing compound having a surface area of at least 40 square meters per gram which has been treated with a substituted silane. The treated filler is first blended with the non-silicone polymer and this compound is then mixed with the silicone polymer.
摘要翻译: 公开了一种新型组合物,其包含硅氧烷聚合物,除聚四氟乙烯之外的非硅氧烷聚合物和经化学处理的填料。 非硅氧烷聚合物可以是弹性体或热塑性聚合物,例如聚烯烃,含有烯烃的共聚物,含卤聚合物或共聚物,或聚四氟乙烯以外的含氟聚合物的共聚物。 填料是具有至少40平方米/克的表面积的无机含硅化合物,其已用取代的硅烷处理。 首先将处理过的填料与非硅氧烷聚合物混合,然后将该化合物与硅氧烷聚合物混合。
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