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1.发明授权Water-free preparation process for multimodal thermoplastic polymer foam and foam therefrom 失效多峰热塑性聚合物泡沫和泡沫的无水制备工艺公开(公告)号：US06787580B2
公开(公告)日：2004-09-07
申请号：US09966632
申请日：2001-09-28
IPC分类号： C08J900
CPC分类号： C08J9/0061 , C08J9/0023 , C08J2201/03 , C08J2203/06 , C08J2203/14 , C08J2203/142 , C08J2471/00
摘要： Prepare a multimodal thermoplastic polymer foam having a distribution of large and small cells in a substantial absence of water by using a blowing agent stabilizer. Multimodal foams of the present invention have blowing agent stabilizer predominantly located proximate to large cells. The resulting multimodal foams have particular utility as thermal insulating materials.
摘要翻译： 通过使用发泡剂稳定剂，在基本上不存在水的情况下制备具有大小细胞分布的多峰热塑性聚合物泡沫体。 本发明的多模泡沫具有主要位于大细胞附近的发泡剂稳定剂。 所得的多峰泡沫具有特殊的用途作为绝热材料。
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2.发明授权Bisbenzocyclobutene compounds with hydrophobic substituents, a method for making same 失效具有疏水取代基的双苯并环丁烯化合物，其制备方法
公开(公告)号：US5354929A
公开(公告)日：1994-10-11
申请号：US128611
申请日：1993-09-28
申请人： Robert A. Kirchhoff , P. J. Thomas , R. Garth Pews
发明人： Robert A. Kirchhoff , P. J. Thomas , R. Garth Pews
CPC分类号： C07C13/44 , C07C2102/06
摘要： The invention is a bis-BCB compound of the structure: ##STR1## a method for making same and polymers made therefrom. The novel compounds of this invention are useful in preparing polymers that can form thin film coatings for multichip midules (MCMs) and integrated circuits (ICs). These compounds can be isolated as liquids at room temperature, and can form polymers that are hydrophobic and have low dielectrical and dissipative properties.
摘要翻译： 本发明是一种双-BCB化合物，其结构如下：＆lt; IMAGE＆gt;其制备方法和由其制备的聚合物。 本发明的新型化合物可用于制备可形成多芯片（MCM）和集成电路（IC）的薄膜涂层的聚合物。 这些化合物可以在室温下作为液体分离，并且可以形成疏水性且具有低介电性和耗散性的聚合物。
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公开(公告)号：US5276228A
公开(公告)日：1994-01-04
申请号：US007926
申请日：1993-01-25
IPC分类号： C07C13/44
CPC分类号： C07C13/44 , C07C2102/06
摘要： This invention is directed to a class of arylcyclobutene monomers having the general formula: ##STR1## wherein Ar is aromatic, with the proviso that the carbons of the cyclobutene rings are bonded to adjacent carbon atoms on the same aromatic ring of Ar;and R.sup.1 is a divalent alkyl, cycloaliphatic, aromatic, heteroaromatic, or heterocyclic moiety;polymeric compositions containing these monomers; and articles containing said polymeric compositions.
摘要翻译： 本发明涉及一类具有以下通式的芳基环丁烯单体：其中Ar是芳族的，条件是环丁烯环的碳与Ar的相同芳环上的相邻碳原子键合; 并且R 1是二价烷基，脂环族，芳族，杂芳族或杂环部分; 含有这些单体的聚合物组合物; 和含有所述聚合物组合物的制品。
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公开(公告)号：US4795827A
公开(公告)日：1989-01-03
申请号：US109136
申请日：1987-10-16
IPC分类号： C07C205/45 , C07C221/00 , C07C225/22 , C08F8/00 , C08F22/36 , C08F22/40 , C08G61/06 , C08G63/685 , C08G65/40 , C08G69/32 , C08G73/10 , C08L33/24 , C08L35/00 , C08F132/08 , C08F232/08
CPC分类号： C08G61/06
摘要： The invention comprises cyclobutarene ketoaniline monomers and the process for preparing them. The monomers can be used to graft and/or endcap a monomer or polymer having at least 1 amino-reactive functionality. The grafted and/or endcapped monomer or polymer can subsequently be processed to prepare a highly crosslinked network.The preferred monomer has the formula: ##STR1##
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公开(公告)号：US4687823A
公开(公告)日：1987-08-18
申请号：US880778
申请日：1986-07-01
IPC分类号： C07C5/50 , C07C13/44 , C08G61/04 , C08F267/04
摘要： Arylcyclobutene resins are comprised of alkynyl groups bridging at least two arylcyclobutene moieties.
摘要翻译： 芳基环丁烯树脂由桥接至少两个芳基环丁烯部分的炔基组成。
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6.发明授权Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices 有权用于制造气隙半导体器件的牺牲苯并环丁烯共聚物公开(公告)号：US07585785B2
公开(公告)日：2009-09-08
申请号：US10544415
申请日：2004-01-30
IPC分类号： H01L21/31
CPC分类号： H01L21/02118 , C08F212/34 , C08F222/10 , H01L21/312 , H01L21/7682 , H01L23/5222 , H01L23/53295 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12) alkyldiol diacrylate (such as bis[3-(4-benzocyclobutenyl)]1,6 hexanediol diacrylate) and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12)alkyldiol diacrylate and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene.
摘要翻译： 一种通过以下步骤在半导体结构内形成气隙的方法：（a）使用牺牲聚合物占据半导体结构中的空间; （b）加热半导体结构以分解牺牲聚合物，在半导体结构内留下空隙，其中步骤（a）的牺牲聚合物是双[3-（4-苯并环丁烯基）] 1，n（n = 2-12）二丙烯酸烷基二醇酯（例如双[3-（4-苯并环丁烯基）] 1,6-己二醇二丙烯酸酯）和1,3-双2 [4-苯并环丁烯基（乙烯基）]苯。 另外，具有位于导体线之间的牺牲聚合物的半导体结构，其中牺牲聚合物是双[3-（4-苯并环丁烯基）] 1，n（n = 2-12）烷基二醇二丙烯酸酯和1,3 双[4-苯并环丁烯基（乙烯基）]苯。
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公开(公告)号：US5134214A
公开(公告)日：1992-07-28
申请号：US701433
申请日：1991-05-15
IPC分类号： C08F222/40 , C08G73/12 , C08L79/08
CPC分类号： C08L79/085 , C08F222/40 , C08G73/12
摘要： Copolymers comprising, in polymerized form, a 1,1-substituted arylethylene comonomer and at least one polymaleimide comonomer, are prepared using a system that provides a reduced onset of polymerization temperature thereby allowing removal of the copolymer from the mold after a preliminary curing period followed by transfer to an oven, a less expensive piece of equipment, for additional curing; thus making the mold, a more expensive piece of equipment, available for the next polymerization run.
摘要翻译： 以聚合形式包含1,1-取代的芳基乙烯共聚单体和至少一种聚马来酰亚胺共聚单体的共聚物使用提供降低的聚合温度开始的系统制备，从而允许在预硫化时间段之后从模具中除去共聚物 通过转移到烤箱，较便宜的设备，用于额外的固化; 从而使模具成为更昂贵的设备，可用于下一次聚合运行。
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公开(公告)号：US5026892A
公开(公告)日：1991-06-25
申请号：US360665
申请日：1989-06-02
申请人： Robert A. Kirchhoff
发明人： Robert A. Kirchhoff
摘要： The invention is a poly(arylcyclobutene) comprising arylcyclobutene moieties connected by a bridging member, wherein the bridging member comprises an amidoalkyl termintated polysiloxane, and wherein one or more cyclobutene rings are fused to one of the aryl rings.
摘要翻译： 本发明是包含通过桥连构件连接的芳基环丁烯部分的聚（芳基环丁烯），其中所述桥连构件包含酰氨基烷基酯化聚硅氧烷，并且其中一个或多个环丁烯环与一个芳环稠合。
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公开(公告)号：US4826997A
公开(公告)日：1989-05-02
申请号：US893125
申请日：1986-08-04
申请人： Robert A. Kirchhoff
发明人： Robert A. Kirchhoff
IPC分类号： C07C13/44 , C07D207/44 , C07D207/452 , C07F7/08 , C07D207/456
CPC分类号： C07D207/452 , C07C13/44 , C07F7/0809 , C07C2102/06
摘要： The invention is a compound which comprises an unsaturated cyclic imide moiety and an aryl cyclobutene moiety, wherein the cyclobutene moiety is fused to the aryl radical, and wherein the imide nitrogen is connected to the aryl radical by a direct bond or a bridging member. Another aspect of this invention is a polyimide polymeric composition which results from the polymerization of the above-described compounds.
摘要翻译： 本发明是包含不饱和环酰亚胺部分和芳基环丁烯部分的化合物，其中环丁烯部分与芳基稠合，并且其中酰亚胺氮通过直接键或桥连构件连接到芳基上。 本发明的另一方面是由上述化合物的聚合产生的聚酰亚胺聚合物组合物。
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公开(公告)号：US4642329A
公开(公告)日：1987-02-10
申请号：US770913
申请日：1985-08-30
申请人： Robert A. Kirchhoff , Alan Schrock , Jo A. Gilpin
发明人： Robert A. Kirchhoff , Alan Schrock , Jo A. Gilpin
IPC分类号： C08F12/32 , C07C13/44 , C07C63/49 , C07C63/72 , C08F12/00 , C08F32/08 , C08G61/00 , C08G61/02 , C08G61/06 , C08F32/00
摘要： Reactive polymeric compositions are prepared by subjecting arylcyclobutene monomeric compositions to polymerization conditions to provide a partially polymerized composition; and removing the partially polymerized composition from said conditions. The partially polymerized composition can be subsequently subjected to polymerization and curing conditions to provide a cured polymeric composition.
摘要翻译： 通过使芳基环丁烯单体组合物经受聚合条件以提供部分聚合的组合物来制备反应性聚合物组合物; 并从所述条件除去部分聚合的组合物。 随后将部分聚合的组合物进行聚合和固化条件以提供固化的聚合物组合物。
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