公开(公告)号：US06787580B2

公开(公告)日：2004-09-07

申请号：US09966632

申请日：2001-09-28

Applicant: Yohannes Chonde ,  Daniel Imeokparia ,  John B. Horstman ,  Robert A. Kirchhoff ,  Kyung W. Suh

Inventor： Yohannes Chonde ,  Daniel Imeokparia ,  John B. Horstman ,  Robert A. Kirchhoff ,  Kyung W. Suh

IPC: C08J900

CPC classification number: C08J9/0061 ,  C08J9/0023 ,  C08J2201/03 ,  C08J2203/06 ,  C08J2203/14 ,  C08J2203/142 ,  C08J2471/00

Abstract: Prepare a multimodal thermoplastic polymer foam having a distribution of large and small cells in a substantial absence of water by using a blowing agent stabilizer. Multimodal foams of the present invention have blowing agent stabilizer predominantly located proximate to large cells. The resulting multimodal foams have particular utility as thermal insulating materials.

Abstract translation: 通过使用发泡剂稳定剂，在基本上不存在水的情况下制备具有大小细胞分布的多峰热塑性聚合物泡沫体。 本发明的多模泡沫具有主要位于大细胞附近的发泡剂稳定剂。 所得的多峰泡沫具有特殊的用途作为绝热材料。

公开(公告)号：US5354929A

公开(公告)日：1994-10-11

申请号：US128611

申请日：1993-09-28

Applicant: Robert A. Kirchhoff ,  P. J. Thomas ,  R. Garth Pews

Inventor： Robert A. Kirchhoff ,  P. J. Thomas ,  R. Garth Pews

IPC: C07C13/44 ,  C07C13/00

CPC classification number: C07C13/44 ,  C07C2102/06

Abstract: The invention is a bis-BCB compound of the structure: ##STR1## a method for making same and polymers made therefrom. The novel compounds of this invention are useful in preparing polymers that can form thin film coatings for multichip midules (MCMs) and integrated circuits (ICs). These compounds can be isolated as liquids at room temperature, and can form polymers that are hydrophobic and have low dielectrical and dissipative properties.

Abstract translation: 本发明是一种双-BCB化合物，其结构如下：＆lt; IMAGE＆gt;其制备方法和由其制备的聚合物。 本发明的新型化合物可用于制备可形成多芯片（MCM）和集成电路（IC）的薄膜涂层的聚合物。 这些化合物可以在室温下作为液体分离，并且可以形成疏水性且具有低介电性和耗散性的聚合物。

公开(公告)号：US5276228A

公开(公告)日：1994-01-04

申请号：US007926

申请日：1993-01-25

Applicant: Kenneth J. Bruza ,  Robert A. Kirchhoff

Inventor： Kenneth J. Bruza ,  Robert A. Kirchhoff

IPC: C07C13/44

CPC classification number: C07C13/44 ,  C07C2102/06

Abstract: This invention is directed to a class of arylcyclobutene monomers having the general formula: ##STR1## wherein Ar is aromatic, with the proviso that the carbons of the cyclobutene rings are bonded to adjacent carbon atoms on the same aromatic ring of Ar;and R.sup.1 is a divalent alkyl, cycloaliphatic, aromatic, heteroaromatic, or heterocyclic moiety;polymeric compositions containing these monomers; and articles containing said polymeric compositions.

Abstract translation: 本发明涉及一类具有以下通式的芳基环丁烯单体：其中Ar是芳族的，条件是环丁烯环的碳与Ar的相同芳环上的相邻碳原子键合; 并且R 1是二价烷基，脂环族，芳族，杂芳族或杂环部分; 含有这些单体的聚合物组合物; 和含有所述聚合物组合物的制品。

公开(公告)号：US4795827A

公开(公告)日：1989-01-03

申请号：US109136

申请日：1987-10-16

Applicant: Kenneth J. Bruza ,  Robert A. Kirchhoff

Inventor： Kenneth J. Bruza ,  Robert A. Kirchhoff

IPC: C07C205/45 ,  C07C221/00 ,  C07C225/22 ,  C08F8/00 ,  C08F22/36 ,  C08F22/40 ,  C08G61/06 ,  C08G63/685 ,  C08G65/40 ,  C08G69/32 ,  C08G73/10 ,  C08L33/24 ,  C08L35/00 ,  C08F132/08 ,  C08F232/08

CPC classification number: C08G61/06

Abstract: The invention comprises cyclobutarene ketoaniline monomers and the process for preparing them. The monomers can be used to graft and/or endcap a monomer or polymer having at least 1 amino-reactive functionality. The grafted and/or endcapped monomer or polymer can subsequently be processed to prepare a highly crosslinked network.The preferred monomer has the formula: ##STR1##

公开(公告)号：US4687823A

公开(公告)日：1987-08-18

申请号：US880778

申请日：1986-07-01

Applicant: Robert A. Kirchhoff ,  Stephen F. Hahn

Inventor： Robert A. Kirchhoff ,  Stephen F. Hahn

IPC: C07C5/50 ,  C07C13/44 ,  C08G61/04 ,  C08F267/04

CPC classification number: C08G61/04 ,  C07C13/44 ,  C07C5/50

Abstract: Arylcyclobutene resins are comprised of alkynyl groups bridging at least two arylcyclobutene moieties.

Abstract translation: 芳基环丁烯树脂由桥接至少两个芳基环丁烯部分的炔基组成。

公开(公告)号：US07598114B2

公开(公告)日：2009-10-06

申请号：US10544428

申请日：2004-01-30

Applicant: Youngfu Li ,  Robert A. Kirchhoff ,  Jason Q. Niu ,  Kenneth L. Foster

Inventor： Youngfu Li ,  Robert A. Kirchhoff ,  Jason Q. Niu ,  Kenneth L. Foster

IPC: H01L51/40

CPC classification number: H01L21/02118 ,  H01L21/312 ,  H01L21/7682

Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene.

Abstract translation: 一种通过以下步骤在半导体结构内形成气隙的方法：（a）使用牺牲聚合物占据半导体结构中的空间; 步骤（a）的牺牲聚合物是：（a）5-亚乙基-2-降冰片烯和乙烯基苯并环丁烯的共聚物（或者（b）加热半导体结构以分解在半导体结构内留下空隙的牺牲聚合物，其中步骤 乙烯基苯并环丁烯衍生物）; 或（b）5-亚乙基-2-降冰片烯与5-（3-苯并环丁基）-2-降冰片烯的共聚物; 或（c）5-（3-苯并环丁基）-2-降冰片烯的聚合物。 另外，具有位于导体线之间的牺牲聚合物的半导体结构，其中所述牺牲聚合物是：（a）5-亚乙基-2-降冰片烯和乙烯基苯并环丁烯（或乙烯基苯并环丁烯衍生物）的共聚物; 或（b）5-亚乙基-2-降冰片烯与5-（3-苯并环丁基）-2-降冰片烯的共聚物; 或（c）5-（3-苯并环丁基）-2-降冰片烯的聚合物。

公开(公告)号：US4965329A

公开(公告)日：1990-10-23

申请号：US297804

申请日：1989-01-13

Applicant: Robert A. Kirchhoff

Inventor： Robert A. Kirchhoff

IPC: C07C13/44 ,  C07D207/44 ,  C07D207/452 ,  C07F7/08

CPC classification number: C07D207/452 ,  C07C13/44 ,  C07F7/0809 ,  C07C2102/06

Abstract: The invention is a compound which comprises an unsaturated cyclic imide moiety and an aryl cyclobutene moiety, wherein the cyclobutene moiety is fused to the aryl radical, and wherein the imide nitrogen is connected to the aryl radical by a direct bond or a bridging member. Another aspect of this invention is a polyimide polymeric composition which results from the polymerization of the above-described compounds.

Abstract translation: 本发明是包含不饱和环酰亚胺部分和芳基环丁烯部分的化合物，其中环丁烯部分与芳基稠合，并且其中酰亚胺氮通过直接键或桥连构件连接到芳基上。 本发明的另一方面是由上述化合物的聚合产生的聚酰亚胺聚合物组合物。

公开(公告)号：US4783514A

公开(公告)日：1988-11-08

申请号：US872372

申请日：1986-06-09

Applicant: Robert A. Kirchhoff ,  Alan K. Schrock ,  Stephen F. Hahn

Inventor： Robert A. Kirchhoff ,  Alan K. Schrock ,  Stephen F. Hahn

IPC: C07C13/44 ,  C07C1/00 ,  C07C13/38 ,  C07C15/58 ,  C07C67/00 ,  C07D207/38 ,  C07D207/44 ,  C07D207/452 ,  C07F7/08 ,  C08F10/00 ,  C08F12/00 ,  C08F12/02 ,  C08F12/08 ,  C08F12/32 ,  C08F22/36 ,  C08F32/08 ,  C08F38/00 ,  C08F232/08 ,  C08G61/00 ,  C08G61/02 ,  C08G61/06

CPC classification number: C07D207/452 ,  C07C13/44 ,  C07C255/00 ,  C07D207/38 ,  C07F7/0809 ,  C08F12/32 ,  C08F38/00 ,  C08G61/00

Abstract: Polymeric compositions are comprised of, in polymerized form, a monomer which contains one reactive arylcyclobutane moiety.

Abstract translation: 聚合物组合物以聚合形式包含含有一个反应性芳基环丁烷部分的单体。

公开(公告)号：US4724260A

公开(公告)日：1988-02-09

申请号：US835013

申请日：1986-02-28

Applicant: Robert A. Kirchhoff ,  Alan K. Schrock ,  Stephen F. Hahn

Inventor： Robert A. Kirchhoff ,  Alan K. Schrock ,  Stephen F. Hahn

IPC: C07C13/44 ,  C07D207/44 ,  C07D207/452 ,  C07F7/08 ,  C07D221/02

CPC classification number: C07D207/452 ,  C07C13/44 ,  C07F7/0809 ,  C07C2102/06

Abstract: Monomeric compositions comprising a monomer containing one arylcyclobutane moiety, and a molecular group comprising at least one unsaturated alkyl group are provided.

Abstract translation: 提供包含含有一个芳基环丁烷部分的单体和包含至少一个不饱和烷基的分子基团的单体组合物。

公开(公告)号：US5923945A

公开(公告)日：1999-07-13

申请号：US748301

申请日：1996-11-13

Applicant: Glenn A. Eisman ,  Selim Yalvac ,  Robert A. Kirchhoff ,  Kevin E. Howard ,  Brian M. Banker ,  Matthew R. Kesterson

Inventor： Glenn A. Eisman ,  Selim Yalvac ,  Robert A. Kirchhoff ,  Kevin E. Howard ,  Brian M. Banker ,  Matthew R. Kesterson

IPC: C01B21/06 ,  C01B21/072 ,  C04B41/45 ,  C04B41/81 ,  H01L23/15 ,  B05D7/00

CPC classification number: C04B41/009 ,  C01B21/06 ,  C01B21/0728 ,  C04B41/4584 ,  C04B41/81 ,  H01L23/15 ,  C04B2111/00844 ,  C04B2111/27 ,  H01L2924/0002 ,  Y10T428/12056

Abstract: The invention is a process for the preparation of coated nitride powder, comprising contacting one or more metal complex(es), organo-aluminum material, optionally one or more silicon compounds or mixtures thereof, with nitride powder under conditions such that coated nitride powder is formed. A metal complex is a metal-containing system which is soluble in a host liquid. The process of the invention is a process for making coated nitride powder and obtaining the desirable properties of coated nitride powder, while maintaining the desirable properties of the uncoated powder, such as good thermal conductivity, for use in electronic applications. In another aspect, the invention is a coated nitride powder which has the advantageous properties of the uncoated powder and is a desirable alternative to current nitride coatings.

Abstract translation: 本发明是一种制备涂覆氮化物粉末的方法，包括使一种或多种金属络合物，有机铝材料，任选的一种或多种硅化合物或其混合物与氮化物粉末接触，使得涂覆的氮化物粉末为 形成。 金属络合物是可溶于主体液体的含金属体系。 本发明的方法是制备涂覆氮化物粉末并获得涂覆的氮化物粉末的期望性能的方法，同时保持未涂覆的粉末的所需性质，例如良好的导热性，用于电子应用。 在另一方面，本发明是涂覆的氮化物粉末，其具有未涂覆粉末的有利性质，并且是目前氮化物涂层的理想替代方案。