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    Bisbenzocyclobutene compounds with hydrophobic substituents, a method for making same
    2.
    发明授权
    Bisbenzocyclobutene compounds with hydrophobic substituents, a method for making same 失效
    具有疏水取代基的双苯并环丁烯化合物，其制备方法

    公开(公告)号：US5354929A

    公开(公告)日：1994-10-11

    申请号：US128611

    申请日：1993-09-28

    Applicant: Robert A. Kirchhoff ,  P. J. Thomas ,  R. Garth Pews

    Inventor： Robert A. Kirchhoff ,  P. J. Thomas ,  R. Garth Pews

    IPC: C07C13/44 ,  C07C13/00

    CPC classification number: C07C13/44 ,  C07C2102/06

    Abstract: The invention is a bis-BCB compound of the structure: ##STR1## a method for making same and polymers made therefrom. The novel compounds of this invention are useful in preparing polymers that can form thin film coatings for multichip midules (MCMs) and integrated circuits (ICs). These compounds can be isolated as liquids at room temperature, and can form polymers that are hydrophobic and have low dielectrical and dissipative properties.

    Abstract translation: 本发明是一种双-BCB化合物，其结构如下：＆lt; IMAGE＆gt;其制备方法和由其制备的聚合物。 本发明的新型化合物可用于制备可形成多芯片（MCM）和集成电路（IC）的薄膜涂层的聚合物。 这些化合物可以在室温下作为液体分离，并且可以形成疏水性且具有低介电性和耗散性的聚合物。

    Liquid bisarylcyclobutene monomers and polymers
    3.
    发明授权
    Liquid bisarylcyclobutene monomers and polymers 失效
    液体双芳基环丁烯单体和聚合物

    公开(公告)号：US5276228A

    公开(公告)日：1994-01-04

    申请号：US007926

    申请日：1993-01-25

    Applicant: Kenneth J. Bruza ,  Robert A. Kirchhoff

    Inventor： Kenneth J. Bruza ,  Robert A. Kirchhoff

    IPC: C07C13/44

    CPC classification number: C07C13/44 ,  C07C2102/06

    Abstract: This invention is directed to a class of arylcyclobutene monomers having the general formula: ##STR1## wherein Ar is aromatic, with the proviso that the carbons of the cyclobutene rings are bonded to adjacent carbon atoms on the same aromatic ring of Ar;and R.sup.1 is a divalent alkyl, cycloaliphatic, aromatic, heteroaromatic, or heterocyclic moiety;polymeric compositions containing these monomers; and articles containing said polymeric compositions.

    Abstract translation: 本发明涉及一类具有以下通式的芳基环丁烯单体：其中Ar是芳族的，条件是环丁烯环的碳与Ar的相同芳环上的相邻碳原子键合; 并且R 1是二价烷基，脂环族，芳族，杂芳族或杂环部分; 含有这些单体的聚合物组合物; 和含有所述聚合物组合物的制品。

    Sacrificial benzocyclobutene/norbornene polymers for making air gap semiconductor devices
    6.
    发明授权
    Sacrificial benzocyclobutene/norbornene polymers for making air gap semiconductor devices 有权
    用于制造气隙半导体器件的牺牲苯并环丁烯/降冰片烯聚合物

    公开(公告)号：US07598114B2

    公开(公告)日：2009-10-06

    申请号：US10544428

    申请日：2004-01-30

    Applicant: Youngfu Li ,  Robert A. Kirchhoff ,  Jason Q. Niu ,  Kenneth L. Foster

    Inventor： Youngfu Li ,  Robert A. Kirchhoff ,  Jason Q. Niu ,  Kenneth L. Foster

    IPC: H01L51/40

    CPC classification number: H01L21/02118 ,  H01L21/312 ,  H01L21/7682

    Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene.

    Abstract translation: 一种通过以下步骤在半导体结构内形成气隙的方法：（a）使用牺牲聚合物占据半导体结构中的空间; 步骤（a）的牺牲聚合物是：（a）5-亚乙基-2-降冰片烯和乙烯基苯并环丁烯的共聚物（或者（b）加热半导体结构以分解在半导体结构内留下空隙的牺牲聚合物，其中步骤 乙烯基苯并环丁烯衍生物）; 或（b）5-亚乙基-2-降冰片烯与5-（3-苯并环丁基）-2-降冰片烯的共聚物; 或（c）5-（3-苯并环丁基）-2-降冰片烯的聚合物。 另外，具有位于导体线之间的牺牲聚合物的半导体结构，其中所述牺牲聚合物是：（a）5-亚乙基-2-降冰片烯和乙烯基苯并环丁烯（或乙烯基苯并环丁烯衍生物）的共聚物; 或（b）5-亚乙基-2-降冰片烯与5-（3-苯并环丁基）-2-降冰片烯的共聚物; 或（c）5-（3-苯并环丁基）-2-降冰片烯的聚合物。

    N-substituted arylcyclo butenyl-unsaturated cyclic imides
    7.
    发明授权
    N-substituted arylcyclo butenyl-unsaturated cyclic imides 失效
    N-取代芳基环丁烯基不饱和环状酰亚胺

    公开(公告)号：US4965329A

    公开(公告)日：1990-10-23

    申请号：US297804

    申请日：1989-01-13

    Applicant: Robert A. Kirchhoff

    Inventor： Robert A. Kirchhoff

    IPC: C07C13/44 ,  C07D207/44 ,  C07D207/452 ,  C07F7/08

    CPC classification number: C07D207/452 ,  C07C13/44 ,  C07F7/0809 ,  C07C2102/06

    Abstract: The invention is a compound which comprises an unsaturated cyclic imide moiety and an aryl cyclobutene moiety, wherein the cyclobutene moiety is fused to the aryl radical, and wherein the imide nitrogen is connected to the aryl radical by a direct bond or a bridging member. Another aspect of this invention is a polyimide polymeric composition which results from the polymerization of the above-described compounds.

    Abstract translation: 本发明是包含不饱和环酰亚胺部分和芳基环丁烯部分的化合物，其中环丁烯部分与芳基稠合，并且其中酰亚胺氮通过直接键或桥连构件连接到芳基上。 本发明的另一方面是由上述化合物的聚合产生的聚酰亚胺聚合物组合物。

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