Abstract:
A fluid dynamic bearing formed by a microelectromechanical systems (MEMS) wafer-level batch-fabrication process is provided. The process results in a high performance and high reliability fluid dynamic bearing having features including higher bearing lifetime at high RPM, improved bearing stiffness, durability and thrust/restoring forces capabilities. The present invention is especially useful with small form factor disc drive memory devices having constraints in motor height, such as a 2.5 inch disc drive, requiring high performance including high rotational speed and large areal density. A sacrificial layer is utilized in the process to simultaneously form symmetrical facing surfaces of relatively rotatable components. The facing surfaces define, therebetween, a desired feature, such as a journal bearing, a thrust bearing, a fluid channel, a fluid reservoir, a capillary seal, pressure generating grooves, and other profile geometries. Such geometry control allows for design freedom in obtaining a desired bearing performance and stiffness.
Abstract:
An electrical feedthrough assembly for establishing an electrical connection path through an aperture in a side wall of a housing, and a method of fabrication thereof. The feedthrough assembly comprises a plate and at least one electrical contact which extends through the plate. Preferably, a heating member is further provided to extend along a circumference of the plate. The plate is sized to span and surround the aperture so that, upon generation of heat by the heating member, at least one ring of sealing material adjacent the heating member flows to establish a seal between the plate and the housing wall surrounding the aperture. The heat is preferably generated by applying current to the heating member. The feedthrough assembly is preferably fabricated using a microfabrication process. A batch fabrication operation is preferably employed so that a population of the plates are formed from a single panel and subsequently separated therefrom.
Abstract:
A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.
Abstract:
In general, the invention is directed to techniques for integrated interconnects with a set of disc drives. The interconnects allow for a set of disc drives to be positioned in an array; for example, as set of disc drives may be stacked to communicate with a device through a single interface of the device. The interconnects may be formed as vias within the housing of the disc drives. Vias may produced using MEMS techniques, e.g., electroplating, as part of the manufacturing processes of the disc drive itself.
Abstract:
A micromechanical assembly couples to a positioning member and to a body having an aerodynamic surface subject to aerodynamic forces. The micromechanical assembly comprises a substrate including a flexible beam joining a first substrate portion that is attachable to the positioning member to a second substrate portion that is attachable to the body. The substrate includes a substrate surface extending at least over the flexible beam. A lithographic pattern is formed on the substrate surface. The lithographic pattern includes at least a first impedance element that senses flexing of the flexible beam. Contact pads are coupled to the lithographic pattern for coupling to a flex measurement circuit.
Abstract:
A transducer assembly in which an electric current is passed through plating solution in recesses of a metal substrate to plate electrical contact bumps having bump fronts in the recesses and exposed bump backs. The transducer is partially formed on the substrate, sealing the exposed bump backs. One or more vacuum processes are performed to complete formation of the transducer. At least a portion of the metal substrate is etched away to expose the bump fronts of the electrical contact bumps.
Abstract:
A disc drive has a disc rotatable about an axis, a slider carrying a transducing head for transducing data with a disc, and a dual stage actuation assembly supporting the slider to position the transducing head adjacent a selected radial track of the disc. The dual stage actuation assembly includes a movable actuator arm and a suspension assembly supported by the actuator arm. The suspension assembly includes a gimbal. The dual stage actuation assembly further includes a microactuator. The microactuator includes a stator having a top surface and a bottom surface wherein the gimbal is connected to the top surface of the stator. A rotor is operatively connected to the stator and the rotor supports the slider. A magnetic keeper structure is supported by the stator such that the rotor moves with respect to the magnetic keeper structure.
Abstract:
Utilizing reactive ion etching (RIE) lag, tethers are fabricated that reliably hold devices in place during processing and storage, yet are easily broken to remove the parts from the wafer as desired, without requiring excessive force that could damage the devices. The tethers are fabricated by slightly narrowing the periphery etch feature at several places. By adjusting the ratio of the main periphery width to the necked width at the tethers, the final thickness of the tether can be controlled to a small fraction of the wafer thickness, so that tethers defined by readily achievable feature sizes will reliably hold the parts in place until removal is desired. Since the tethers are now only a fraction of the wafer thickness, they will reliably break to release the part at a force level that will not damage the part.
Abstract:
An apparatus includes a structure including a waveguide and a pocket adjacent to an input facet of the waveguide. A laser has an output facet and is positioned in the pocket. A stop is included one at least one of the laser and a wall of the pocket. The stop is positioned at an interface between the laser and the wall of the pocket such that the output facet of the laser and the input facet of the waveguide are separated by a gap.
Abstract:
A micro-electromechanical systems (MEMS) disc drive includes high-precision and integrated components to allow for increased functionality, robustness and reduced size as compared to currently produced disc drives. Integrating multiple subcomponents of the disc drive using batch processing provides low manufacturing costs. Furthermore, using MEMS techniques, new features can be added to disc drives. For example, an environmental control component, an accelerometer and/or a thermometer may be integrated into the housing of the disc drive.