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    Dry film resist transport and lamination system for semiconductor wafers
    2.
    发明授权
    Dry film resist transport and lamination system for semiconductor wafers 失效
    用于半导体晶片的干膜抗蚀剂输送和层压系统

    公开(公告)号：US5106450A

    公开(公告)日：1992-04-21

    申请号：US630668

    申请日：1990-12-20

    申请人： Norbert Freisitzer ,  Rolf G. Meinert

    发明人： Norbert Freisitzer ,  Rolf G. Meinert

    IPC分类号： B32B37/00 ,  B32B38/04 ,  G03F7/16 ,  H01L21/027 ,  H01L21/30 ,  H01L21/677

    CPC分类号： B32B38/04 ,  B32B38/18 ,  G03F7/161 ,  Y10T156/1189 ,  Y10T156/1322 ,  Y10T156/1326 ,  Y10T156/133 ,  Y10T156/1339 ,  Y10T156/1707 ,  Y10T156/171

    摘要： A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced to a laminating assembly 71 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. The bonded wafer 72 and decal are advanced to a Mylar peeler assembly 82 which strips the transport tape 40 and the Mylar layer 16 away from the wafer 72, thereby leaving a wafer 72 which laminated with dry film photoresist material 18.

    摘要翻译： 干膜光致抗蚀剂层压机包括一冲头和冲模组件24，该组件24将夹在聚酯薄膜层16和聚烯烃底层20之间的干膜光致抗蚀剂材料18组成的卷状薄膜光致抗蚀剂材料14冲压成光电贴标 。 光致抗蚀剂贴花粘合到粘性输送带40上，该带40将贴花带到聚烯烃剥离器组件54上，聚烯烃剥离器组件54沿着贴花的聚烯烃层20滚动高粘性带57，从而剥离贴花。 贴花被推进到层压组件71，层压组件71将贴花滚动到加热的晶片72上，从而将暴露的光致抗蚀剂材料18结合到晶片72.接合的晶片72和贴花被提前到Mylar剥离器组件82， 40和聚酯薄膜层16离开晶片72，从而留下与干膜光致抗蚀剂材料18层压的晶片72。

    Single chip thermal tester
    4.
    发明授权
    Single chip thermal tester 失效
    单芯片热测试仪

    公开(公告)号：US4696578A

    公开(公告)日：1987-09-29

    申请号：US876143

    申请日：1986-06-19

    申请人： Mohanlal S. Mansuria ,  Rolf G. Meinert ,  Sevgin Oktay ,  Carl D. Ostergren

    发明人： Mohanlal S. Mansuria ,  Rolf G. Meinert ,  Sevgin Oktay ,  Carl D. Ostergren

    IPC分类号： G01N25/18 ,  G01R31/28 ,  H01L21/66 ,  G01N25/00 ,  G01R31/26

    CPC分类号： G01R31/2874 ,  G01N25/18 ,  G01R31/2875 ,  H01L22/12 ,  H01L2924/0002

    摘要： A thermal tester for measuring the efficiency of a heat transfer device for cooling semiconductor chips is disclosed having a positioning means operable to position the heat transfer device in thermal contact with the chip. The positioning means is adjustable in at least 5 degrees of freedom. Temperature sensors are provided to sense the temperature of the chip, the chip support substrate and the positioning means adjacent the heat transfer device. Means is provided to dispose the chip and heat transfer device in a vacuum. Control means is also provided to adjust the temperature of the chip unitl it is the same as the substrate to thereby assure heat transfer occurs only from the chip to the positioning means by way of the heat transfer device. When this thermal balance is achieved the thermal resistance of the heat transfer device can be calculated.

    摘要翻译： 公开了一种用于测量用于冷却半导体芯片的传热装置的效率的热测试器，其具有可操作以将传热装置定位成与芯片热接触的定位装置。 定位装置可以至少5个自由度调节。 提供温度传感器以感测芯片的温度，芯片支撑基板和邻近传热装置的定位装置。 提供了在真空中设置芯片和传热装置的装置。 还提供控制装置以调节芯片单元1的温度，使其与基板相同，从而确保仅通过传热装置从芯片到定位装置的热传递。 当实现这种热平衡时，可以计算传热装置的热阻。