公开(公告)号：US08206895B2

公开(公告)日：2012-06-26

申请号：US12179198

申请日：2008-07-24

申请人： Ikuo Yoneda ,  Shunko Magoshi

发明人： Ikuo Yoneda ,  Shunko Magoshi

IPC分类号： G03F7/207

CPC分类号： G03F7/0035

摘要： According to an aspect of the present invention, there is provided a method for forming a pattern including: applying a photosensitive resin onto a film on a wafer substrate; partly exposing the photosensitive resin to light and developing the photosensitive resin to form a first pattern having an opening portion; applying a photo-curable material onto the film exposed by the opening portion of the first pattern; bringing one face of an optically-transmissive template having a second pattern formed on the one face into contact with the photo-curable material, the second pattern including projections and reentrants; irradiating the photo-curable material with light; and separating the template from the photo-curable material.

摘要翻译： 根据本发明的一个方面，提供了一种用于形成图案的方法，包括：将光敏树脂施加到晶片衬底上的膜上; 将感光性树脂部分地曝光并使感光性树脂显影，形成具有开口部的第一图案; 将光可固化材料施加到由第一图案的开口部分暴露的薄膜上; 使具有形成在所述一个面上的第二图案的光学透射模板的一个面与所述光固化材料接触，所述第二图案包括突起和折入物; 用光照射光固化材料; 并将模板与可光固化材料分离。

公开(公告)号：US20080214010A1

公开(公告)日：2008-09-04

申请号：US12018490

申请日：2008-01-23

申请人： Ikuo YONEDA ,  Shunko MAGOSHI

发明人： Ikuo YONEDA ,  Shunko MAGOSHI

IPC分类号： H01L21/311 ,  B28B21/42

CPC分类号： H01L21/0271 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material.

摘要翻译： 根据本发明，提供了一种半导体器件制造方法，包括：使具有预定图案的模具与形成在待加工基板上的压印材料的至少一部分接触，并将基板上的图案形成为 通过顺序地转印每个镜头的图案来处理，其中待加工的基底的切割区域和监视器图案形成区域之一被涂覆有压印材料。

公开(公告)号：US07079994B2

公开(公告)日：2006-07-18

申请号：US09912398

申请日：2001-07-26

申请人： Ryoichi Inanami ,  Shunko Magoshi ,  Katsuya Okumura

发明人： Ryoichi Inanami ,  Shunko Magoshi ,  Katsuya Okumura

IPC分类号： G06G7/34 ,  G06F7/02 ,  G06F9/44 ,  G06F15/82

CPC分类号： H01J37/3026 ,  G06Q20/20 ,  H01J2237/31762 ,  Y02P90/265

摘要： A user is requested to input specifications of a semiconductor device. Based on the specifications, a plurality of circuit patterns are generated by a CP method, and a design parameter is calculated for each of the circuit patterns. The user is provided with information of the plurality of circuit patterns together with the design parameters. The user selects a desired circuit pattern, whereas the server calculates manufacturing costs of the device and presents them to the user. The user checks the costs and then places an order.

公开(公告)号：US08282868B2

公开(公告)日：2012-10-09

申请号：US12926359

申请日：2010-11-12

申请人： Ikuo Yoneda ,  Shunko Magoshi

发明人： Ikuo Yoneda ,  Shunko Magoshi

IPC分类号： B29C59/00

CPC分类号： H01L21/0271 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material.

摘要翻译： 根据本发明，提供了一种半导体器件制造方法，包括：使具有预定图案的模具与形成在待加工基板上的压印材料的至少一部分接触，并将基板上的图案形成为 通过顺序地转印每个镜头的图案来处理，其中待加工的基底的切割区域和监视器图案形成区域之一被涂覆有压印材料。

公开(公告)号：US07854604B2

公开(公告)日：2010-12-21

申请号：US12018490

申请日：2008-01-23

申请人： Ikuo Yoneda ,  Shunko Magoshi

发明人： Ikuo Yoneda ,  Shunko Magoshi

IPC分类号： B29C59/00

CPC分类号： H01L21/0271 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material.

摘要翻译： 根据本发明，提供了一种半导体器件制造方法，包括：使具有预定图案的模具与形成在待加工基板上的压印材料的至少一部分接触，并将基板上的图案形成为 通过顺序地转印每个镜头的图案来处理，其中待加工的基底的切割区域和监视器图案形成区域之一被涂覆有压印材料。

公开(公告)号：US06835942B2

公开(公告)日：2004-12-28

申请号：US10602670

申请日：2003-06-25

申请人： Shunko Magoshi ,  Shinji Sato

发明人： Shunko Magoshi ,  Shinji Sato

IPC分类号： H01J37302

CPC分类号： H01J37/3175 ,  B82Y10/00 ,  B82Y40/00 ,  H01J2237/31769

摘要： A method for correcting a proximity effect applied to a dose of an electron beam exposure, includes classifying an underlying pattern of a level underlying a thin film layer; dividing a processing pattern to be transferred on the thin film layer into a first pattern overlapping with the underlying pattern and a second pattern which does not overlap with the underlying pattern according to the classified underlying pattern; calculating a pattern area density for the first and second patterns in a unit region; and calculating a corrected dose for the processing pattern according to the pattern area density.

公开(公告)号：US06543044B2

公开(公告)日：2003-04-01

申请号：US09814996

申请日：2001-03-23

申请人： Ryoichi Inanami ,  Shunko Magoshi

发明人： Ryoichi Inanami ,  Shunko Magoshi

IPC分类号： G21K510

CPC分类号： H01J37/3026 ,  H01J2237/30416 ,  H01J2237/3175

摘要： Using the hierarchy cell5, cell51, cell52, cell4 of the figure cells in the design pattern data, it is not necessary to take the actual forms of patterns and the arrangement information of data (relation between patterns, period of arrangement) into consideration, and therefore, characters for CP exposure can be extracted effectively.

摘要翻译： 使用设计图案数据中的图形单元的层次结构单元5，单元格51，单元格52，单元格4，不需要考虑图形的实际形式和数据的排列信息（图案，排列周期之间的关系），以及 因此，可以有效地提取CP曝光的字符。

公开(公告)号：US06495841B1

公开(公告)日：2002-12-17

申请号：US09299145

申请日：1999-04-26

申请人： Atsushi Ando ,  Shunko Magoshi ,  Kazuyoshi Sugihara ,  Yuichiro Yamazaki ,  Motosuke Miyoshi ,  Katsuya Okumura ,  Kiyoshi Hattori

发明人： Atsushi Ando ,  Shunko Magoshi ,  Kazuyoshi Sugihara ,  Yuichiro Yamazaki ,  Motosuke Miyoshi ,  Katsuya Okumura ,  Kiyoshi Hattori

IPC分类号： H01J37317

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  H01J37/023 ,  H01J37/3174

摘要： In an electron beam drawing apparatus including an objective lens for focusing an electron beam emitted from an electron gun on a sample surface and an objective deflector for controlling the position of the electron beam on the sample surface, an objective driving mechanism for mechanically moving the objective lens and objective deflector in a plane perpendicular to the optical axis of the electron beam is provided and an optical axis shifting deflector arranged nearer to the electron gun than the objective lens and objective deflector, for deflecting the electron beam in synchronism with the operation of the objective lens and objective deflector is provided.

摘要翻译： 在包括用于将从电子枪发射的电子束聚焦在样品表面上的物镜和用于控制电子束在样品表面上的位置的物镜偏转器的电子束描绘装置中，用于机械地移动物镜的物镜驱动机构 提供了与电子束的光轴垂直的平面中的透镜和物镜偏转器，并且与物镜和物镜偏转器相比更靠近电子枪布置的光轴移动偏转器，用于与电子束的操作同步地偏转 提供物镜和物镜偏转器。

公开(公告)号：US5994030A

公开(公告)日：1999-11-30

申请号：US30888

申请日：1998-02-26

申请人： Kazuyoshi Sugihara ,  Hiromi Niiyama ,  Shunko Magoshi ,  Atsushi Ando ,  Tetsuro Nakasugi ,  Shinji Sato ,  Yumi Watanabe ,  Yosimitu Kato ,  Toru Shibata ,  Katsuya Okumura

发明人： Kazuyoshi Sugihara ,  Hiromi Niiyama ,  Shunko Magoshi ,  Atsushi Ando ,  Tetsuro Nakasugi ,  Shinji Sato ,  Yumi Watanabe ,  Yosimitu Kato ,  Toru Shibata ,  Katsuya Okumura

IPC分类号： H01L21/027 ,  G03F7/20 ,  H01J37/317 ,  G03C5/00

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/203 ,  G03F7/2059 ,  G03F7/7045 ,  H01J37/3174

摘要： A rough pattern exceeding the resolution limit of light exposure is formed by light resolution. A fine pattern not exceeding the resolution limit of light exposure is formed by charge-beam exposure. Combining the rough pattern and the fine pattern produces a desired pattern. The sharing of the work between light exposure and charge-beam exposure exhibits the high throughput of light exposure and the excellent resolving power of charge-beam exposure.

公开(公告)号：US20110065254A1

公开(公告)日：2011-03-17

申请号：US12926359

申请日：2010-11-12

申请人： Ikuo Yoneda ,  Shunko Magoshi

发明人： Ikuo Yoneda ,  Shunko Magoshi

IPC分类号： H01L21/30

CPC分类号： H01L21/0271 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material.

摘要翻译： 根据本发明，提供了一种半导体器件制造方法，包括：使具有预定图案的模具与形成在待加工基板上的压印材料的至少一部分接触，并将基板上的图案形成为 通过顺序地转印每个镜头的图案来处理，其中待加工的基底的切割区域和监视器图案形成区域之一被涂覆有压印材料。