摘要:
A semiconductor device includes a first FinFET device and a second FinFET device. The first FinFET device includes a first gate, a first source, and a first drain. The first FinFET device has a first source/drain proximity. The second FinFET device includes a second gate, a second source, and a second drain. The second FinFET device has a second source/drain proximity that is smaller than the first source/drain proximity. In some embodiments, \the first FinFET device is an Input/Output (I/O) device, and the second FinFET device is a non-I/O device such as a core device. In some embodiments, the greater source/drain proximity of the first FinFET device is due to an extra spacer of the first FinFET device that does not exist for the second FinFET device.
摘要:
The present invention generally relates to nanofabrication and, in some embodiments, to methods of synthesizing selectively binding patched nanoparticles and the devices that can be made from them. In some embodiments, the invention relates to methods of assembling arbitrarily shaped structures from patched nanocubes and the devices and uses that follow. For example, nanocube building blocks may be patched by stamping their faces with a selectively binding chemical species (e.g. DNA, antibody-antigen pairs, etc.), or by using self-assembly to attach to the nanocubes multiple selectively binding patch species whose immiscibility can be preprogrammed. Arbitrarily shaped structures can then be designed and assembled by deciding which faces will be bonded to each other in some target structure and combining nanocubes that have selectively binding patches on those faces. Other aspects of the invention are also directed to methods of making such nanocubes or other nanoparticles, methods of forming such nanocubes.
摘要:
A semiconductor device includes a first FinFET device and a second FinFET device. The first FinFET device includes a first gate, a first source, and a first drain. The first FinFET device has a first source/drain proximity. The second FinFET device includes a second gate, a second source, and a second drain. The second FinFET device has a second source/drain proximity that is smaller than the first source/drain proximity. In some embodiments, \the first FinFET device is an Input/Output (I/O) device, and the second FinFET device is a non-I/O device such as a core device. In some embodiments, the greater source/drain proximity of the first FinFET device is due to an extra spacer of the first FinFET device that does not exist for the second FinFET device.
摘要:
A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other through an electrical connection that includes respective gate contacts and one or more conductive interconnect structures.
摘要:
A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other through an electrical connection formed by linear-shaped conductive structures. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned.
摘要:
A semiconductor device includes first and second p-type diffusion regions, and first and second n-type diffusion regions that are each electrically connected to a common node. Conductive features are each defined within any one gate level channel that is uniquely associated with and defined along one of a number of parallel gate electrode tracks. The conductive features respectively form gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. The gate electrodes of the first PMOS and second NMOS transistor devices are electrically connected in part by a first conductor within a first interconnect level. The gate electrodes of the second PMOS and first NMOS transistor devices are electrically connected in part by a second conductor within the first interconnect level. The first PMOS, second PMOS, first NMOS, and second NMOS transistor devices define a cross-coupled transistor configuration having commonly oriented gate electrodes.
摘要:
A semiconductor device includes first and second p-type diffusion regions, and first and second n-type diffusion regions that are each electrically connected to a common node. A gate electrode level region is formed in accordance with a virtual grate defined by virtual lines that extend in only a first parallel direction, such that an equal perpendicular spacing exists between adjacent ones of the virtual lines. Conductive features are each defined within any one gate level channel that is uniquely associated with and defined along one of a number of virtual lines of the virtual grate. The conductive features form gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. The gate electrodes of the first PMOS and second NMOS transistor devices are electrically connected, and the gate electrodes of the second PMOS and first NMOS transistor devices are electrically connected.
摘要:
A semiconductor device includes conductive features within a gate electrode level region that are each fabricated from respective originating rectangular-shaped layout features having its centerline aligned parallel to a first direction. The conductive features form gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. The gate electrodes of the first PMOS, second PMOS, first NMOS, and second NMOS transistor devices respectively extend along different gate electrode tracks. A first set of interconnected conductors electrically connect the gate electrodes of the first PMOS and second NMOS transistor devices. A second set of interconnected conductors electrically connect the gate electrodes of the second PMOS and first NMOS transistor devices. The first and second sets of interconnected conductors traverse across each other within different levels of the semiconductor device.
摘要:
A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other through an electrical connection that includes two conductive contacting structures at a location not over an inner non-diffusion region.
摘要:
A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other through an electrical connection formed by linear-shaped conductive structures. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned.