METHOD FOR PROVIDING MBS SERVICE IN A WAN NETWORK, AND SYSTEM THEREOF
    1.
    发明申请
    METHOD FOR PROVIDING MBS SERVICE IN A WAN NETWORK, AND SYSTEM THEREOF 失效
    在WAN网络中提供MBS服务的方法及其系统

    公开(公告)号:US20080123543A1

    公开(公告)日:2008-05-29

    申请号:US11772530

    申请日:2007-07-02

    IPC分类号: G06F11/30

    摘要: A system and method for providing Multicast/Broadcast Service (MBS) service to a mobile terminal in an MBS service provisioning system in a Wide Area Network (WAN) network are provided. An authentication server sends a message for requesting resource reservation, in which a Quality-of-Service (QoS) policy is included, when a registration procedure of the mobile terminal is performed. A base station stores the message sent from the authentication server, forwards the message to the mobile terminal, and sets up a channel to the mobile terminal upon receiving from the mobile terminal a request for channel setup based on the QoS policy.

    摘要翻译: 提供了一种用于向广域网(WAN)网络中的MBS服务提供系统中的移动终端提供多播/广播服务(MBS)服务的系统和方法。 当执行移动终端的注册过程时,认证服务器发送用于请求资源预留的消息,其中包括服务质量(QoS)策略。 基站存储从认证服务器发送的消息,将消息转发到移动终端,并且在从移动终端接收到基于QoS策略的信道建立请求时,向移动终端建立信道。

    Method for forming a self-aligned contact of a semiconductor device and method for manufacturing a semiconductor device using the same
    2.
    发明授权
    Method for forming a self-aligned contact of a semiconductor device and method for manufacturing a semiconductor device using the same 有权
    用于形成半导体器件的自对准接触的方法和使用其制造半导体器件的方法

    公开(公告)号:US06730570B2

    公开(公告)日:2004-05-04

    申请号:US10348017

    申请日:2003-01-22

    IPC分类号: H01L21336

    摘要: A method for forming a self-aligned contact in a semiconductor device which can reduce process failures and a method for manufacturing a semiconductor device that includes the self-aligned contact are provided. A self-aligned contact hole is formed in an interlayer dielectric film to expose a portion of the substrate between conductive structures formed thereon. A buffer layer is formed on a sidewall of the self-aligned contact hole, on the bottom of the self-aligned contact hole, and on the interlayer dielectric film such that the thickness of the buffer layer at an upper portion of the self-aligned contact hole is greater than the thickness of the buffer layer at the bottom of the self-aligned contact hole. After removing the portion of the buffer layer on the bottom of the self-aligned contact hole, a contact is formed in the self-aligned contact hole to make contact with the substrate.

    摘要翻译: 提供了一种用于在可以减少工艺故障的半导体器件中形成自对准接触的方法以及包括自对准接触的半导体器件的制造方法。 在层间电介质膜中形成自对准接触孔,以在其上形成的导电结构之间露出基板的一部分。 在自对准接触孔的侧壁,自对准接触孔的底部和层间电介质膜上形成缓冲层,使得缓冲层在自对准的上部的厚度 接触孔大于自对准接触孔底部缓冲层的厚度。 在自对准接触孔的底部上移除缓冲层的部分之后,在自对准接触孔中形成接触以与衬底接触。

    Vertical memory devices and methods of manufacturing the same
    3.
    发明授权
    Vertical memory devices and methods of manufacturing the same 有权
    垂直存储器件及其制造方法

    公开(公告)号:US09343475B2

    公开(公告)日:2016-05-17

    申请号:US14155842

    申请日:2014-01-15

    摘要: In a method of a vertical memory device, insulation layers and sacrificial layers are alternately and repeatedly formed on a substrate. A hole is formed through the insulation layers and the sacrificial layers that expose a top surface of the substrate. Then, an interior portion of the hole may be enlarged. A semiconductor pattern is formed to partially fill the enlarged portion of the hole. A blocking layer, a charge storage layer and a tunnel insulation layer may be formed on a sidewall of the hole and the semiconductor pattern. Then, the tunnel insulation layer, the charge storage layer and the blocking layer are partially removed to expose a top surface of the semiconductor pattern. A channel is formed on the exposed top surface of the semiconductor pattern and the tunnel insulation layer. The sacrificial layers are replaced with gate electrodes.

    摘要翻译: 在垂直存储器件的方法中,绝缘层和牺牲层在衬底上交替且重复地形成。 通过绝缘层和暴露衬底顶表面的牺牲层形成一个孔。 然后,可以扩大孔的内部。 半导体图案形成为部分地填充孔的扩大部分。 可以在孔和半导体图案的侧壁上形成阻挡层,电荷存储层和隧道绝缘层。 然后,部分去除隧道绝缘层,电荷存储层和阻挡层,以露出半导体图案的顶表面。 在半导体图案的暴露的顶表面和隧道绝缘层上形成沟道。 牺牲层被栅电极代替。

    Vertical Memory Devices and Methods of Manufacturing the Same
    4.
    发明申请
    Vertical Memory Devices and Methods of Manufacturing the Same 有权
    垂直存储器件及其制造方法

    公开(公告)号:US20150200203A1

    公开(公告)日:2015-07-16

    申请号:US14155842

    申请日:2014-01-15

    摘要: In a method of a vertical memory device, insulation layers and sacrificial layers are alternately and repeatedly formed on a substrate. A hole is formed through the insulation layers and the sacrificial layers that expose a top surface of the substrate. Then, an interior portion of the hole may be enlarged. A semiconductor pattern is formed to partially fill the enlarged portion of the hole. A blocking layer, a charge storage layer and a tunnel insulation layer may be formed on a sidewall of the hole and the semiconductor pattern. Then, the tunnel insulation layer, the charge storage layer and the blocking layer are partially removed to expose a top surface of the semiconductor pattern. A channel is formed on the exposed top surface of the semiconductor pattern and the tunnel insulation layer. The sacrificial layers are replaced with gate electrodes.

    摘要翻译: 在垂直存储器件的方法中,绝缘层和牺牲层在衬底上交替且重复地形成。 通过绝缘层和暴露衬底顶表面的牺牲层形成一个孔。 然后,可以扩大孔的内部。 半导体图案形成为部分地填充孔的扩大部分。 可以在孔和半导体图案的侧壁上形成阻挡层,电荷存储层和隧道绝缘层。 然后,部分去除隧道绝缘层,电荷存储层和阻挡层,以露出半导体图案的顶表面。 在半导体图案的暴露的顶表面和隧道绝缘层上形成沟道。 牺牲层被栅电极代替。

    Method of providing multicast/broadcast service using WiBro/WiMAX network and system using the method
    5.
    发明授权
    Method of providing multicast/broadcast service using WiBro/WiMAX network and system using the method 失效
    使用WiBro / WiMAX网络提供组播/广播服务的方法和使用该方法的系统

    公开(公告)号:US08588235B2

    公开(公告)日:2013-11-19

    申请号:US11812725

    申请日:2007-06-21

    IPC分类号: H04L12/28

    摘要: A system and method for providing a multicast/broadcast service (MBS) using a Wireless Broadband Internet/World Interoperability for Microwave Access (WiBro/WiMAX) network are provided, which include an MBS control unit for generating a beginning and an end of an MBS bearer session, a quality of service (QoS) control unit for requesting an allocation and release of a QoS, an access control router (ACR) for allocating a multicast service flow identifier (SFID) with respect to the MBS bearer session in order to provide an MBS user terminal with MBS bearer traffic which is received from an MBS content source, and for releasing the allocated multicast SFID when the release of the QoS is requested, and a radio access station (RAS) for allocating a multicast connection identifier (CID) corresponding to the allocated multicast SFID according to whether an MBS user requests the MBS bearer traffic, and controlling a radio resource with the MBS user terminal.

    摘要翻译: 提供了一种使用无线宽带因特网/世界微波接入互操作性(WiBro / WiMAX)网络提供多播/广播服务(MBS)的系统和方法,其包括用于生成MBS的开始和结束的MBS控制单元 承载会话,用于请求QoS的分配和释放的服务质量(QoS)控制单元,用于分配关于MBS承载会话的多播业务流标识符(SFID)的接入控制路由器(ACR),以提供 具有从MBS内容源接收到的MBS承载业务的MBS用户终端,以及在请求释放QoS时释放分配的多播SFID的MBS用户终端;以及用于分配多播连接标识符(CID)的无线接入站(RAS) 对应于所分配的组播SFID,根据MBS用户是否请求MBS承载业务,并且与MBS用户终端控制无线资源。

    Method for providing MBS service in a WAN network, and system thereof
    6.
    发明授权
    Method for providing MBS service in a WAN network, and system thereof 失效
    在WAN网络中提供MBS服务的方法及其系统

    公开(公告)号:US08547978B2

    公开(公告)日:2013-10-01

    申请号:US11772530

    申请日:2007-07-02

    IPC分类号: H04L12/28

    摘要: A system and method for providing Multicast/Broadcast Service (MBS) service to a mobile terminal in an MBS service provisioning system in a Wide Area Network (WAN) network are provided. An authentication server sends a message for requesting resource reservation, in which a Quality-of-Service (QoS) policy is included, when a registration procedure of the mobile terminal is performed. A base station stores the message sent from the authentication server, forwards the message to the mobile terminal, and sets up a channel to the mobile terminal upon receiving from the mobile terminal a request for channel setup based on the QoS policy.

    摘要翻译: 提供了一种用于向广域网(WAN)网络中的MBS服务提供系统中的移动终端提供多播/广播服务(MBS)服务的系统和方法。 当执行移动终端的注册过程时,认证服务器发送用于请求资源预留的消息,其中包括服务质量(QoS)策略。 基站存储从认证服务器发送的消息,将消息转发到移动终端,并且在从移动终端接收到基于QoS策略的信道建立请求时,向移动终端建立信道。

    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
    7.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20120068242A1

    公开(公告)日:2012-03-22

    申请号:US13234534

    申请日:2011-09-16

    IPC分类号: H01L29/788 H01L29/02

    CPC分类号: H01L27/11578 H01L27/11582

    摘要: A semiconductor device includes horizontal patterns on a substrate and the horizontal patterns have at least one opening therein, a pad pattern in an upper region of the opening, an insulating gap fill structure in the opening, the insulating gap fill structure is between the pad pattern and the substrate, and the insulating gap fill structure includes a first gap fill pattern and a second gap fill pattern. The first gap fill pattern includes a first oxide and the second gap fill pattern includes a second oxide, and the second oxide has a different etching selectivity from that of the first oxide. The device further includes a semiconductor pattern that is between a sidewall of the gap fill structure and sidewalls of the horizontal patterns and between a sidewall of the pad pattern and the sidewalls of the horizontal patterns.

    摘要翻译: 半导体器件包括在衬底上的水平图案,并且水平图案在其中具有至少一个开口,在开口的上部区域中的衬垫图案,开口中的绝缘间隙填充结构,绝缘间隙填充结构位于衬垫图案之间 并且所述衬底,并且所述绝缘间隙填充结构包括第一间隙填充图案和第二间隙填充图案。 第一间隙填充图案包括第一氧化物,第二间隙填充图案包括第二氧化物,第二氧化物具有与第一氧化物不同的蚀刻选择性。 该装置还包括位于间隙填充结构的侧壁和水平图案的侧壁之间以及垫图案的侧壁和水平图案的侧壁之间的半导体图案。

    Plasma enhanced chemical vapor deposition apparatus and method for forming nitride layer using the same
    8.
    发明授权
    Plasma enhanced chemical vapor deposition apparatus and method for forming nitride layer using the same 失效
    等离子体增强化学气相沉积装置和使用其形成氮化物层的方法

    公开(公告)号:US06828254B2

    公开(公告)日:2004-12-07

    申请号:US10277801

    申请日:2002-10-23

    IPC分类号: H01L2131

    摘要: A plasma enhanced chemical vapor deposition apparatus and a method of forming a nitride layer using the same, wherein the plasma enhanced CVD apparatus includes a process chamber including an upper chamber with a dome shape, a lower chamber, and an insulator therebetween, a gas distributing ring, a susceptor for supporting a wafer and heating the process chamber, a plasma compensation ring surrounding the susceptor, a vacuum pump and an electric power source connected to the process chamber. The gas distributing ring has a plurality of upwardly inclined nozzles, allowing upward distribution of reactive gases. The method of forming a nitride layer includes forming a protective film on inner walls of a process chamber, the protective film having at least two layers of differeing dielectric constant, and sequentially supplying reactive gases to the process chamber. A nitride layer formed thereby has low hydrogen content, good density and oxidation resistance.

    摘要翻译: 一种等离子体增强化学气相沉积装置和使用其形成氮化物层的方法,其中等离子体增强CVD装置包括处理室,该处理室包括具有圆顶形状的上室,下室和位于其间的绝缘体,气体分布 环,用于支撑晶片并加热处理室的基座,围绕基座的等离子体补偿环,真空泵和连接到处理室的电源。 气体分配环具有多个向上倾斜的喷嘴,允许反应气体向上分配。 形成氮化物层的方法包括在处理室的内壁上形成保护膜,所述保护膜具有至少两层不同的介电常数,并且将反应性气体顺序地供应到处理室。 由此形成的氮化物层具有低氢含量,良好的密度和抗氧化性。

    Methods of manufacturing a semiconductor device
    9.
    发明授权
    Methods of manufacturing a semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US07592227B2

    公开(公告)日:2009-09-22

    申请号:US11481928

    申请日:2006-07-07

    IPC分类号: H01L21/336

    摘要: Example embodiments of the present invention relate to methods of manufacturing a semiconductor device. Other example embodiments of the present invention relate to methods of manufacturing a semiconductor device having a gate electrode. In the method of manufacturing the semiconductor device, a gate electrode may be formed on a semiconductor substrate. Damage in the semiconductor substrate and a sidewall of the gate electrode may be cured, or repaired, by a radical re-oxidation process to form an oxide layer on the semiconductor substrate and the gate electrode. The radical re-oxidation process may be performed by providing a nitrogen gas onto the semiconductor substrate while increasing a temperature of the semiconductor substrate to a first temperature to passivate a surface of the gate electrode under a nitrogen gas atmosphere, providing an oxygen gas onto the semiconductor substrate while increasing the temperature from a first temperature to a second temperature to perform a first oxidation process and/or performing a second oxidation process at the second temperature.

    摘要翻译: 本发明的示例性实施例涉及制造半导体器件的方法。 本发明的其它示例实施例涉及制造具有栅电极的半导体器件的方法。 在制造半导体器件的方法中,可以在半导体衬底上形成栅电极。 可以通过自由基再氧化工艺固化或修复半导体衬底和栅电极的侧壁的损伤,以在半导体衬底和栅电极上形成氧化物层。 可以通过在半导体衬底上提供氮气同时将半导体衬底的温度提高到第一温度以在氮气气氛下钝化栅电极的表面来进行自由基再氧化工艺,从而将氧气提供到 半导体衬底,同时将温度从第一温度升至第二温度,以进行第一氧化工艺和/或在第二温度下进行第二氧化工艺。

    Method of trench isolation and method for manufacturing a non-volatile memory device using the same
    10.
    发明授权
    Method of trench isolation and method for manufacturing a non-volatile memory device using the same 有权
    沟槽隔离方法以及使用其的非易失性存储器件的制造方法

    公开(公告)号:US07101803B2

    公开(公告)日:2006-09-05

    申请号:US10784326

    申请日:2004-02-23

    IPC分类号: H01L21/311

    CPC分类号: H01L21/76224

    摘要: In accordance with a method of trench isolation, a first oxide layer is formed on a semiconductor substrate. A first conductive layer and a nitride layer are successively formed on the first oxide layer. The nitride layer, the first conductive layer and the first oxide layer are etched to form a nitride layer pattern, a first conductive layer pattern and an oxide layer pattern. A portion of the substrate adjacent to the first conductive layer pattern is etched to form a trench in the substrate. The trench is cured under dinitrogen monoxide (N2O) or nitrogen monoxide(NO) atmosphere. A second oxide layer is formed in the trench through an in-situ process.

    摘要翻译: 根据沟槽隔离的方法,在半导体衬底上形成第一氧化物层。 第一导电层和氮化物层依次形成在第一氧化物层上。 蚀刻氮化物层,第一导电层和第一氧化物层,以形成氮化物层图案,第一导电层图案和氧化物层图案。 蚀刻邻近第一导电层图案的衬底的一部分,以在衬底中形成沟槽。 沟槽在一氧化二氮(N 2 O 2 O)或一氧化氮(NO))气氛下固化。 通过原位工艺在沟槽中形成第二氧化物层。