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公开(公告)号：US08564702B2
公开(公告)日：2013-10-22
申请号：US13213777
申请日：2011-08-19
CPC分类号： H01L27/14601 , H01L25/16 , H01L27/14618 , H01L27/14623 , H01L27/14627 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H04N5/2253 , H04N5/2257 , H05K1/0284 , H05K1/0306 , H05K1/144 , H01L2924/00014 , H01L2924/00
摘要： At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.
摘要翻译： 至少一个固态成像装置和一个或多个裸IC，其设置在固态成像装置的背面或背面侧并用作外围电路。 裸IC被树脂密封。 可以在固态成像装置和裸IC之间插入电路板，或者将固态成像装置和IC直接接合在一起。 根据另一方面，作为固态成像装置的外围电路的IC芯片和其他部件设置在遮光壳体的内表面（主要是天花板表面）上。 根据另一方面，一种用于通过成像装置将成像光引入到装置内部而形成的图像的固态成像装置设置有本身具有暗空间并容纳成像装置的封装 以及用于将成像光引入暗空间并在成像装置的成像面上形成成像对象的图像的针孔。
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公开(公告)号：US06174174B1
公开(公告)日：2001-01-16
申请号：US09380766
申请日：1999-09-28
申请人： Kenzo Suzuki , Toshimasa Hiroike , Hiroshi Nagano , Hisataka Izawa , Yasuo Maru , Shigeo Ikeda
发明人： Kenzo Suzuki , Toshimasa Hiroike , Hiroshi Nagano , Hisataka Izawa , Yasuo Maru , Shigeo Ikeda
IPC分类号： H01R1200
CPC分类号： H01R13/2421 , G01R1/0483 , H01R33/765 , Y10S439/931
摘要： A socket for an IC used in electrically connecting the IC to a test device for testing electrical properties of the IC. The socket for an IC includes a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC, with the opening facing the anisotropic electrically conductive adhesive. The socket for an IC also includes a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening. The contact electrodes and the coil-shaped contacts facing each other via the anisotropic electrically conductive adhesive are mechanically and electrically connected to each other via the anisotropic electrically conductive adhesive.
摘要翻译： 用于将IC电连接到用于测试IC的电性能的测试装置的IC的插座。 用于IC的插座包括印刷电路板，其一个表面上以与IC的外部电极的阵列间距相同的间距布置多个接触电极，并且其相对表面上布置有多个端子电极 连接到接触电极，布置在印刷电路板的接触电极上的各向异性导电粘合剂，布置在印刷电路板的一个表面上并具有用于设置IC的开口的基座，其开口面向各向异性 导电胶。 用于IC的插座还包括布置在开口中的多个线圈状触点，其一端经由各向异性导电粘合剂位于接触电极的上方，并且其另一端从开口突出。 通过各向异性导电粘合剂彼此面对的接触电极和线圈状接触器通过各向异性导电粘合剂彼此机械地和电连接。
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公开(公告)号：US5783815A
公开(公告)日：1998-07-21
申请号：US734021
申请日：1996-10-18
申请人： Shigeo Ikeda
发明人： Shigeo Ikeda
IPC分类号： H05K7/12 , H01L27/14 , H01L27/146 , H01L31/0203 , H01L31/0232 , H01L31/10 , H04N5/225 , H04N5/335 , H04N5/359 , H01J5/02
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L31/0203 , H01L31/0232 , H01L2924/0002
摘要： While the lens fitting member is temporarily bonded on the printed circuit board by a semi-hardening adhesive, the lens fitting member is located so as to adjust the lens to a specific position in relation to the solid-state image sensing element, and the semi-hardening adhesive is then hardened to completely bond the lens fitting member on the printed circuit board, thus reducing the assembly man-hour of a solid-state image sensing device in which a solid-state image sensing element is mounted on a printed circuit board and a lens fitting member with a lens fitted on is provided so as to adjust the lens to a specific position in relation to the solid-state image sensing element.
摘要翻译： 当通过半硬化粘合剂将透镜配合构件暂时地接合在印刷电路板上时，透镜配合构件被定位成将透镜调整到与固体摄像元件相关的特定位置，半 然后硬化粘合剂被硬化以将透镜配件构件完全粘合在印刷电路板上，从而减少固态图像感测装置的组装工时，其中将固态图像感测元件安装在印刷电路板上 并且设置安装有透镜的透镜配合构件，以便将透镜调整到与固态图像感测元件相关的特定位置。
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4.发明授权Content publishing system, publishing method for a content publishing system, and publishing terminal 有权内容发布系统，内容发布系统的发布方式和发布终端公开(公告)号：US09361935B2
公开(公告)日：2016-06-07
申请号：US12621302
申请日：2009-11-18
CPC分类号： G11B20/10 , G11B20/00869 , G11B2220/2537 , H04L41/082 , H04L41/0853 , H04L41/22
摘要： A content publishing system, a publishing method for a content publishing system, and a publishing terminal provide a service that is particularly convenient for the customer. A content publishing system SY having a plurality of publishing terminals 204 that record and publish content information containing content on recording media has an order content input unit 610 enabling customers to input order content, a publishing terminal extraction unit 420 that extracts from among the plural publishing terminals 204 one or more publishing terminals 204 that can process the order content based on the order content, a calculation unit 550 that calculates the required time denoting the time required to publish the order content according to the order content for the extracted one or more publishing terminals 204, a display unit 620 that displays the calculated required times of the one or more publishing terminals 204, and an order terminal selection unit 630 for specifying the publishing terminal 204 to process the order from among the one or more publishing terminals 204 displayed. The content publishing system, a publishing method for a content publishing system, and a publishing terminal record content using the specified publishing terminal 204.
摘要翻译： 内容发布系统，内容发布系统的发布方法和发布终端提供对于客户特别方便的服务。 具有记录和发布包含记录媒体内容的内容信息的多个出版终端204的内容发布系统SY具有能够使客户输入订单内容的订单内容输入单元610，从多个出版物中提取的发布终端提取单元420 终端204可以基于订单内容处理订单内容的一个或多个发布终端204;计算单元550，其根据提取的一个或多个发布的订单内容计算表示发布订单内容所需的时间的所需时间 终端204，显示所计算的一个或多个发布终端204所需时间的显示单元620以及用于指定出版终端204以处理所显示的一个或多个发布终端204之间的顺序的订单终端选择单元630。 内容发布系统，内容发布系统的发布方法以及使用指定的发布终端204的发布终端记录内容。
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公开(公告)号：US20120229854A1
公开(公告)日：2012-09-13
申请号：US13417123
申请日：2012-03-09
申请人： Hidetoshi MAESHIMA , Shigeo IKEDA
发明人： Hidetoshi MAESHIMA , Shigeo IKEDA
IPC分类号： G06F3/12
CPC分类号： G11B23/40 , B41J3/4071
摘要： A media processing device executes a printing process that prints data created by a desired software program on the label side of a medium, and a write process that writes data to the medium, in a continuous operation. A production command step commands executing a media production process. An image data acquisition step acquires image data produced by a desirable application when triggered by the production command. A print data generating step generates print data from the image data. A data acquisition step acquires data used in the write process when triggered by the production command. A data output step links and outputs the print data and the write data to the media processing device.
摘要翻译： 媒体处理装置执行打印处理，该打印处理在连续操作中将在期望的软件程序创建的数据打印在介质的标签侧上，以及将数据写入介质的写入处理。 生产命令步骤命令执行媒体制作过程。 图像数据获取步骤在由生产命令触发时获取由期望的应用产生的图像数据。 打印数据生成步骤从图像数据生成打印数据。 数据采集步骤在由生产命令触发时获取在写入过程中使用的数据。 数据输出步骤将打印数据和写数据链接并输出到媒体处理设备。
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公开(公告)号：US5739596A
公开(公告)日：1998-04-14
申请号：US630956
申请日：1996-04-05
CPC分类号： G06F1/263 , G06F1/30 , Y10T307/615 , Y10T307/62 , Y10T307/625
摘要： An electronic apparatus comprises a main circuit having a main CPU and a power supply system which includes plural main batteries for supplying operating power to said main circuit, a back-up battery, a switching circuit connected between each main battery and the main circuit, power means for enabling the operation of the main circuit, a charge detector for detecting the charging level of each main battery, and power controller responsive to the power means and the charge detector and having a sub-CPU for individually controlling the switching circuit according to either a single connection mode or a multiple connection mode. In the single connection mode only one of the main batteries is connected to said main circuit. In the multiple connection mode, at least two main batteries, each in series with a respective diode means, are connected in parallel to the main circuit. The back-up battery is connected to supply power to the power controller only when either no main battery is installed or the charging level of each of the installed main batteries is below a predetermined value required for back-up operation.
摘要翻译： 电子设备包括主电路，主电路具有主CPU和电源系统，该电源系统包括用于向所述主电路提供工作电力的多个主电池，备用电池，连接在每个主电池和主电路之间的开关电路，电源 用于启动主电路的操作的装置，用于检测每个主电池的充电电平的电荷检测器以及响应于电力装置和充电检测器的功率控制器，并且具有用于根据任一方式单独控制开关电路的子CPU 单连接模式或多连接模式。 在单连接模式中，只有一个主电池连接到所述主电路。 在多重连接模式中，与主电路并联连接的至少两个主电池与各自的二极管装置串联连接。 连接备用电池仅在没有安装主电池或每个安装的主电池的充电水平低于备用操作所需的预定值时才向电源控制器供电。
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公开(公告)号：US5574383A
公开(公告)日：1996-11-12
申请号：US382808
申请日：1995-02-02
申请人： Takashi Saito , Shigeo Ikeda , Masumi Okutsu
发明人： Takashi Saito , Shigeo Ikeda , Masumi Okutsu
CPC分类号： G01R1/0433
摘要： An IC measuring and testing device and measuring and testing method comprising a measurement handler socket provided with mold-receiving base having guiding members corresponding to the shape of a mold body of an IC to be tested around its periphery and probes for contacting outer leads of the IC, and a suction arm for suction-supporting the IC and transferring it to the mold-receiving base, the IC measuring and testing device performing measuring and testing on the IC mounted in the mold-receiving base by means of the suction arm, the guide members corresponding to and separated from the outer leads of the IC, and terminal portions of the probes being arranged inserted into these separation portions. As a result, when the IC is set, the guide members and the like of the socket can be prevented from striking against the outer leads of the IC and deforming them.
摘要翻译： 一种IC测量和测试装置和测量和测试方法，包括测量处理器插座，其设置有模具接收基座，其具有对应于围绕其周边测试的IC的模具本体的形状的引导构件，以及用于接触外部引线的探针 IC，以及用于抽吸支撑IC并将其传送到模具接收基座的抽吸臂，IC测量和测试装置通过抽吸臂对安装在模具接收基座中的IC进行测量和测试， 与IC的外引线相对应并分离的引导构件，并且将探针的端子部插入到这些分离部中。 结果，当设置IC时，可以防止插座的引导构件等撞击IC的外引线并使其变形。
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公开(公告)号：US08098309B2
公开(公告)日：2012-01-17
申请号：US10891633
申请日：2004-07-15
CPC分类号： H01L27/14601 , H01L25/16 , H01L27/14618 , H01L27/14623 , H01L27/14627 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H04N5/2253 , H04N5/2257 , H05K1/0284 , H05K1/0306 , H05K1/144 , H01L2924/00014 , H01L2924/00
摘要： At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.
摘要翻译： 设置至少一个固态成像装置和设置在固态成像装置的背面或背面侧并用作外围电路的一个或多个裸IC。 裸IC被树脂密封。 可以在固态成像装置和裸IC之间插入电路板，或者将固态成像装置和IC直接接合在一起。 根据另一方面，作为固态成像装置的外围电路的IC芯片和其他部件设置在遮光壳体的内表面（主要是天花板表面）上。 根据另一方面，一种用于通过成像装置将成像光引入到装置内部而形成的图像的固态成像装置设置有本身具有暗空间并容纳成像装置的封装 以及用于将成像光引入暗空间并在成像装置的成像面上形成成像对象的图像的针孔。
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公开(公告)号：US4565918A
公开(公告)日：1986-01-21
申请号：US472933
申请日：1983-03-07
申请人： Hideaki Ayabe , Takeshi Toyosawa , Shigeo Ikeda , Ken-Ichiro Ohta
发明人： Hideaki Ayabe , Takeshi Toyosawa , Shigeo Ikeda , Ken-Ichiro Ohta
CPC分类号： G01D15/10
摘要： In an automatic recording instrument having a thermal recording-pen to record on a heat sensitive recording-paper, an operational amplifier output supplies the heating current to the thermal pen through a resistor. A non-linear transfer element receives the output voltage of the amplifier and delivers a voltage having a predetermined non-linear relation to its input. The voltage difference between the output of the non-linear transfer element and the junction point of the thermal pen to the resistor is feedback connected to the input of the amplifier. When the relative velocity between the pen and the paper is increased, the input voltage of the amplifier is increased to increase the output voltage, and when the output voltage is increased, the resistance of the thermal pen is increased to balance to the output of the non-linear transfer element for reducing the input to the amplifier. This means that the heated temperature of the thermal pen is raised when the pen moves faster on the paper and a constant thickness of the recording is maintained in a wide range of the relative velocity between the pen and the paper.
摘要翻译： 在具有记录在热敏记录纸上的热记录笔的自动记录装置中，运算放大器输出通过电阻将加热电流提供给热笔。 非线性传递元件接收放大器的输出电压，并向其输入端传递具有预定非线性关系的电压。 非线性传输元件的输出与热笔与电阻的连接点之间的电压差反馈到放大器的输入端。 当笔和纸之间的相对速度增加时，增加放大器的输入电压以增加输出电压，并且当输出电压增加时，热笔的电阻增加以平衡到 非线性传输元件，用于减小放大器的输入。 这意味着当笔在纸张上移动得更快时，热笔的加热温度升高，并且记录的恒定厚度保持在笔和纸之间的相对速度的宽范围内。
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公开(公告)号：US20120069230A1
公开(公告)日：2012-03-22
申请号：US13213777
申请日：2011-08-19
IPC分类号： H04N5/335
CPC分类号： H01L27/14601 , H01L25/16 , H01L27/14618 , H01L27/14623 , H01L27/14627 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H04N5/2253 , H04N5/2257 , H05K1/0284 , H05K1/0306 , H05K1/144 , H01L2924/00014 , H01L2924/00
摘要： At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.
摘要翻译： 至少一个固态成像装置和一个或多个裸IC，其设置在固态成像装置的背面或背面侧并用作外围电路。 裸IC被树脂密封。 可以在固态成像装置和裸IC之间插入电路板，或者将固态成像装置和IC直接接合在一起。 根据另一方面，作为固态成像装置的外围电路的IC芯片和其他部件设置在遮光壳体的内表面（主要是天花板表面）上。 根据另一方面，一种用于通过成像装置将成像光引入到装置内部而形成的图像的固态成像装置设置有本身具有暗空间并容纳成像装置的封装 以及用于将成像光引入暗空间并在成像装置的成像面上形成成像对象的图像的针孔。
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