公开(公告)号：US4142948A

公开(公告)日：1979-03-06

申请号：US881845

申请日：1978-02-27

申请人： Sakae Tajima ,  Takashi Mouri ,  Shigeyoshi Morisaki

发明人： Sakae Tajima ,  Takashi Mouri ,  Shigeyoshi Morisaki

IPC分类号： C25D3/06 ,  C25D3/10 ,  C25D3/56

CPC分类号： C25D3/06 ,  C25D3/56

摘要： Disclosed is an aqueous chromium deposition solution containing chromium in the trivalent state, from which a bright decorative chromium plate can be advantageously formed. The chromium deposition solution contains (a) a water-soluble trivalent chromium salt; (b) at least one compound selected from unsubstituted and amino- or hydroxy-substituted carboxylic acids and salts thereof; (c) a water-soluble aluminum salt, and; (d) ammonium ion.

公开(公告)号：US4082591A

公开(公告)日：1978-04-04

申请号：US727624

申请日：1976-09-28

申请人： Shigeyoshi Morisaki ,  Nobuo Kitamura

发明人： Shigeyoshi Morisaki ,  Nobuo Kitamura

IPC分类号： H05K1/09 ,  C23C10/28 ,  C25D3/30 ,  C25D5/50 ,  C25D7/06 ,  H05K3/24 ,  H05K3/38 ,  C25D1/00

CPC分类号： H05K3/244 ,  C25D3/30 ,  C25D5/505 ,  H05K2201/0355 ,  H05K2203/0723

摘要： A process is disclosed for preventing oxidative coloring while maintaining good solderability of copper foil wherein a thin layer of tin or a combination of tin and zinc alloy is electro-deposited on the surface of the shiny side of copper foil and the tin or binary alloy diffuses into the surface portion of electrodeposited copper foil by heating, such as drying, baking or lamination under heat and pressure. By virtue of an extremely thin layer of the tin alloy thus formed, the bright tone of the copper surface is maintained during storage or during subsequent lamination of the foil, and the solderability thereof is also improved.

公开(公告)号：US4049481A

公开(公告)日：1977-09-20

申请号：US696624

申请日：1976-06-16

申请人： Shigeyoshi Morisaki

发明人： Shigeyoshi Morisaki

IPC分类号： B21C37/02 ,  C25D3/56 ,  C25D7/06 ,  H05K3/38 ,  C25D3/22 ,  C25D3/30

CPC分类号： H05K3/384 ,  C25D3/565 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/12715 ,  Y10T428/12792 ,  Y10T428/24917

摘要： The present invention relates to a method of treatment on the surface of copperfoil mainly used for printed circuits. More particularly, it relates to a method of electrodeposition of a binary alloy consisting of zinc and tin as a barrier layer against copper migration into an adhesive substrate during subsequent heat press lamination, while a binary alloy on copperfoil is converted to ternary alloy defusing into copper by heat press lamination resulting in a layer of Cu-Zn-Sn, ternary alloy. This layer prevents spottings on the etched surfaces and provides high resistance to hydrochloric acid, and better adhesion than hitherto used alloys.

摘要翻译： 本发明涉及主要用于印刷电路的铜箔表面处理方法。 更具体地说，本发明涉及一种由锌和锡组成的二元合金作为阻挡层的电沉积方法，以便在随后的热压层压过程中将铜迁移到粘合剂基底中，而将铜箔上的二元合金转化为三元合金缓解为铜 通过热压层压，得到一层Cu-Zn-Sn，三元合金。 该层防止蚀刻表面上的斑点，并提供对盐酸的高耐受性，以及比迄今使用的合金更好的粘附力。

公开(公告)号：US4010005A

公开(公告)日：1977-03-01

申请号：US477587

申请日：1974-06-10

申请人： Shigeyoshi Morisaki ,  Kazuo Mase

发明人： Shigeyoshi Morisaki ,  Kazuo Mase

IPC分类号： B32B15/04 ,  B32B15/08 ,  C23C30/00 ,  C25D7/06 ,  C25D15/02 ,  H05K3/38 ,  B32B15/20

CPC分类号： C23C30/00 ,  C25D15/02 ,  H05K3/384 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12486 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12681 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/1291 ,  Y10T428/12993

摘要： A copper foil having high bond strength with an insoluble particle-containing metal plate formed thereon, the plated copper foil being adapted for use in the preparation of, for example, a printed circuit.

摘要翻译： 与形成在其上的不溶性颗粒金属板具有高粘合强度的铜箔，镀铜铜适用于制备例如印刷电路。