公开(公告)号：US07170012B2

公开(公告)日：2007-01-30

申请号：US11142399

申请日：2005-06-02

申请人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

发明人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

IPC分类号： H05K1/09

CPC分类号： H05K3/44 ,  H05K1/115 ,  H05K3/4641 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/09663

摘要： A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.

摘要翻译： 包括至少一个绝缘层和至少一个布线层的叠层的多层电路板。 布线层由具有形成在第一金属层的一侧或两侧上的第一金属层和第二金属层的复合构件形成。 第一金属层的热膨胀系数小于第二金属层。 第二金属层的导电率比第一金属层高。 绝缘层具有通过第二金属层的表面设置的底部的盲通孔。 在绝缘层的表面和盲通孔中设置层间互连部，并且形成在盲通孔中，与第二金属层的表面接触。

公开(公告)号：US07095623B2

公开(公告)日：2006-08-22

申请号：US10445000

申请日：2003-05-27

申请人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

发明人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K3/44 ,  H05K1/115 ,  H05K3/4641 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/09663

摘要： A multilayer circuit board having a high level of reliability in terms of electric connection against temperature changes caused by the actual operation of electronic equipment, a manufacturing process, a substrate for multilayer circuitry, and an electronic apparatus. The multilayer circuit board comprises a laminate of at least one insulating layer and at least one wiring layer, wherein the wiring layer is formed by a composite member comprising a first metal layer and a second metal layer formed on one or both sides of the first metal layer, the first metal layer having a smaller coefficient of thermal expansion than the second metal layer, the second metal layer having a higher electric conductivity than the first metal layer, wherein the insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer, the circuit board further comprising a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole, wherein the layer-to-layer interconnection portion in the blind via-hole is formed in such a manner as to be in contact with the surface of the second metal layer.

公开(公告)号：US20050225956A1

公开(公告)日：2005-10-13

申请号：US11142398

申请日：2005-06-02

申请人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

发明人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

IPC分类号： H05K1/09 ,  H01L21/4763 ,  H01L23/12 ,  H01L23/14 ,  H05K1/11 ,  H05K1/14 ,  H05K3/44 ,  H05K3/46

CPC分类号： H05K3/44 ,  H05K1/115 ,  H05K3/4641 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/09663

摘要： A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.

公开(公告)号：US6129993A

公开(公告)日：2000-10-10

申请号：US246717

申请日：1999-02-09

申请人： Shingo Kumamoto ,  Ichiro Kishigami ,  Hironori Nakanishi ,  Hideya Yamada

发明人： Shingo Kumamoto ,  Ichiro Kishigami ,  Hironori Nakanishi ,  Hideya Yamada

IPC分类号： B32B3/24 ,  H01L23/373

CPC分类号： H01L23/373 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15322 ,  Y10T428/12486 ,  Y10T428/12632 ,  Y10T428/12833 ,  Y10T428/12917

摘要： Provided are a heat spreader that can reduce an increase in the thermal expansion coefficient up to high temperatures of not lower than 500.degree. C. and has an excellent thermal expansion property and an adequate heat-conductive property and a method of making the same. This heat spreader comprises high-thermal-conductivity layers made of a Cu-base metal, low-thermal-expansion layers made of an Fe--Ni-base alloy each of which layers is provided with a plurality of through holes, and thermal expansion-restraining layers of a metal with a thermal expansion coefficient .alpha. at 30-800.degree. C. of not more than 7.5.times.10.sup.-6 /.degree. C.

摘要翻译： 提供一种散热器，其能够降低高于500℃的高温下的热膨胀系数的增加，并且具有优异的热膨胀性和足够的导热性及其制造方法。 该散热器包括由Cu基金属制成的高导热性层，由Fe-Ni基合金制成的低热膨胀层，各层设有多个通孔，热膨胀 - 在30-800℃的热膨胀系数α的金属的约束层不超过7.5×10 -6 /℃

公开(公告)号：US20050205297A1

公开(公告)日：2005-09-22

申请号：US11142399

申请日：2005-06-02

申请人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

发明人： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

IPC分类号： H05K1/09 ,  H01L21/4763 ,  H01L23/12 ,  H01L23/14 ,  H05K1/11 ,  H05K1/14 ,  H05K3/44 ,  H05K3/46

CPC分类号： H05K3/44 ,  H05K1/115 ,  H05K3/4641 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/09663

摘要： A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.

摘要翻译： 包括至少一个绝缘层和至少一个布线层的叠层的多层电路板。 布线层由具有形成在第一金属层的一侧或两侧上的第一金属层和第二金属层的复合构件形成。 第一金属层的热膨胀系数小于第二金属层。 第二金属层的导电率比第一金属层高。 绝缘层具有通过第二金属层的表面设置的底部的盲通孔。 在绝缘层的表面和盲通孔中设置层间互连部，并且形成在盲通孔中，与第二金属层的表面接触。