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公开(公告)号：US07479795B2
公开(公告)日：2009-01-20
申请号：US11415278
申请日：2006-05-02
Applicant: Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
Inventor： Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
IPC: G01R31/02
CPC classification number: G01R31/2874 , G05D23/1393 , G05D23/19
Abstract: A temperature control apparatus includes a socket holder which is provided on a tester head and holds a socket to mount an IC chip. A socket cover has an opening to pass the end of a handler pusher for holding the IC chip on testing. The socket cover forms a closed space around the IC chip in a state that the IC chip is pressed to the socket by the pusher. A gas supplying unit externally supplies the closed space with gas of a predetermined temperature.
Abstract translation: 一种温度控制装置，包括：插座保持器，其设置在测试头上并保持用于安装IC芯片的插座。 插座盖具有通过用于保持IC芯片进行测试的处理器推动器的端部的开口。 插座盖在IC芯片通过推动器按压到插座的状态下在IC芯片周围形成封闭空间。 气体供给单元向封闭空间外部供给预定温度的气体。
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公开(公告)号：US20070240871A1
公开(公告)日：2007-10-18
申请号：US11654649
申请日：2007-01-18
Applicant: Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
Inventor： Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
IPC: F25B29/00
CPC classification number: F25B41/04 , F25B2400/01 , F25B2400/0409 , F25B2400/0411 , F25B2600/2501 , F25B2600/2513 , F25B2700/21 , F25B2700/21152 , G01R31/2874
Abstract: A temperature control apparatus including a temperature control head kept in contact with an electronic device as a testing object thermally, an electric heater attached to the temperature control head, a refrigerant passage formed within the temperature control head so as to run through inside thereof, a compressor which compresses refrigerant coming out of the temperature control head, a temperature sensor which detects a temperature of refrigerant on an outlet side of the compressor, a condenser which condenses refrigerant coming out of the compressor, a returning portion which returns refrigerant condensed by the condenser to the temperature control head, and a control portion which bypasses the condensed refrigerant to the intake side of the compressor by a predetermined quantity corresponding to an output of the temperature sensor.
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公开(公告)号：US20070102087A1
公开(公告)日：2007-05-10
申请号：US10581051
申请日：2004-11-25
Applicant: Shinichi Iwasaki , Kazuma Nakazawa , Humitaka Ino , Yoshikatsu Hatakeyama , Shintaro Hayashi
Inventor： Shinichi Iwasaki , Kazuma Nakazawa , Humitaka Ino , Yoshikatsu Hatakeyama , Shintaro Hayashi
CPC classification number: B29D30/0681 , B29D2030/0683 , B60C17/06
Abstract: A manufacturing method for annular run-flat tire support which has a supporting part and a leg part, and which, at the time of run-flat running, is capable of carrying load, comprises the steps of supplying said supporting part and said leg part, applying a bonding agent including a chemical conversion treatment to the bonding region of the radial-direction inside end part of said supporting part that is provided for bonding to said leg part, and bonding between said radial-direction inside end part and said leg part. Thereby, a manufacturing method for run-flat tire support which maintains a high bondability between the supporting part and the leg part, and is excellent in durability, and a run-flat tire support are provided.
Abstract translation: 一种具有支撑部分和腿部的环形漏气保用轮胎支撑件的制造方法，并且在平滑行驶时能够承载载荷，包括以下步骤：将所述支撑部分和所述腿部部分 将包括化学转化处理的粘合剂施加到所述支撑部件的径向内端部的与所述腿部接合的接合区域，以及所述径向内端部和所述腿部部分之间的接合 。 因此，提供了一种用于在支撑部分和腿部之间保持高粘合性并且耐久性优异的防喘振轮胎支撑件的制造方法和缺气保用轮胎支撑件。
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公开(公告)号：US07214072B1
公开(公告)日：2007-05-08
申请号：US11261586
申请日：2005-10-31
Applicant: Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
Inventor： Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
IPC: H01R12/00
CPC classification number: G01R31/2893
Abstract: A pusher of an IC chip handler has a pusher frame which is attached to a pusher main body to be driven by the IC chip handler and a plurality of pusher heads attached to the pusher frame. Each of the pusher heads comprises a holder which is held by the pusher frame. At least one spring post is freely protruded outward from the inside of the holder, and a compression spring has one end arranged under pressure to a spring receiving portion of the spring post. A spring push plate arranges the compression spring to the spring receiving portion of the spring post under pressure, and an adjusting member adjusts a compression force of the compression spring. A device holding unit is attached to an end of the spring post protruded outside of the holder.
Abstract translation: IC芯片处理器的推动器具有推动器框架，该推动器框架附接到推动器主体以由IC芯片处理器驱动并且多个推动头附接到推动器框架。 每个推动头包括由推动器框架保持的保持器。 至少一个弹簧柱从保持器的内部自由地向外突出，并且压缩弹簧的一端被压力地布置在弹簧柱的弹簧接收部分。 弹簧推板在压力下将压缩弹簧布置到弹簧柱的弹簧接收部分，并且调节构件调节压缩弹簧的压缩力。 装置保持单元附接到突出于保持器外部的弹簧柱的端部。
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公开(公告)号：US20070099447A1
公开(公告)日：2007-05-03
申请号：US11261586
申请日：2005-10-31
Applicant: Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
Inventor： Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
IPC: H01R12/00
CPC classification number: G01R31/2893
Abstract: A pusher of an IC chip handler has a pusher frame which is attached to a pusher main body to be driven by the IC chip handler and a plurality of pusher heads attached to the pusher frame. Each of the pusher heads comprises a holder which is held by the pusher frame. At least one spring post is freely protruded outward from the inside of the holder, and a compression spring has one end arranged under pressure to a spring receiving portion of the spring post. A spring push plate arranges the compression spring to the spring receiving portion of the spring post under pressure, and an adjusting member adjusts a compression force of the compression spring. A device holding unit is attached to an end of the spring post protruded outside of the holder.
Abstract translation: IC芯片处理器的推动器具有推动器框架，该推动器框架附接到推动器主体以由IC芯片处理器驱动并且多个推动头附接到推动器框架。 每个推动头包括由推动器框架保持的保持器。 至少一个弹簧柱从保持器的内部自由地向外突出，并且压缩弹簧的一端被压力地布置在弹簧柱的弹簧接收部分。 弹簧推板在压力下将压缩弹簧布置到弹簧柱的弹簧接收部分，并且调节构件调节压缩弹簧的压缩力。 装置保持单元附接到突出于保持器外部的弹簧柱的端部。
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Patent Agency Ranking
公开(公告)号：US06797543B2
公开(公告)日：2004-09-28
申请号：US10610526
申请日：2003-07-02
Applicant: Tetsuichiro Kasahara , Hirokazu Tsukioka , Shintaro Hayashi
Inventor： Tetsuichiro Kasahara , Hirokazu Tsukioka , Shintaro Hayashi
IPC: H01L2328
CPC classification number: G06K19/07779 , G06K19/07749 , G06K19/07783 , H01L2224/48091 , H01L2224/48472 , H05K1/0393 , H05K1/165 , H05K3/0052 , H05K3/202 , H05K3/281 , H05K2201/10424 , H01L2924/00014 , H01L2924/00
Abstract: A process for manufacturing an IC card includes a step of forming a plane coil by etching or punching a thin metal plate so that the plane coil consists of a conductor line wound as several loops in substantially the same plane and has respective terminals. A semiconductor element having electrodes is mounted on the plane coil. An adhesive agent or tape is attached to a predetermined area of the plane coil so that adjacent conductor lines in the loops are kept a predetermined gap therebetween. The plane coil is disposed between a pair of films to cover the plane coil therebetween, one of the films being provided with adhesive layer on a surface facing to the other film to seal the plane coil with the semiconductor element by attaching the pair of films with respect to each other by means of the adhesive layer.
Abstract translation: IC卡的制造方法包括通过蚀刻或冲压薄金属板来形成平面线圈的步骤，使得平面线圈由在大体上相同的平面上缠绕成几个环的导体线组成并且具有各自的端子。 具有电极的半导体元件安装在平面线圈上。 粘合剂或胶带附着到平面线圈的预定区域，使得环中的相邻导体线保持在其间的预定间隙。 平面线圈设置在一对薄膜之间以覆盖它们之间的平面线圈，其中一个膜在面向另一个薄膜的表面上设置有粘合剂层，以通过将该对薄膜与 通过粘合剂层彼此相对。
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公开(公告)号：US20140197403A1
公开(公告)日：2014-07-17
申请号：US14343038
申请日：2012-10-03
Applicant: Shintaro Hayashi
Inventor： Shintaro Hayashi
IPC: H01L51/52
CPC classification number: H01L51/5203 , G02F1/133602 , H01L51/50 , H01L51/524 , H01L51/5275 , H01L2224/48091 , H05B33/26 , H01L2924/00014
Abstract: A light emission device includes: an organic electroluminescent element including and second electrodes; a wiring board including first and second patterned conductors; and first and second connection parts. The first and the second electrodes include first and second extended portions. The first and the second extended portions overlap the first and the second patterned conductors, respectively. The first connection part includes a first through-hole wire and a first protrusion electrode protruding from the first patterned conductor to be inside the first through-hole wire so as to be electrically connected to the first through-hole wire. The second connection part includes a second through-hole wire and a second protrusion electrode protruding from the second patterned conductor to be inside the second through-hole wire so as to be electrically connected to the second through-hole wire.
Abstract translation: 发光器件包括：有机电致发光元件和第二电极; 包括第一和第二图案化导体的布线板; 以及第一和第二连接部件。 第一和第二电极包括第一和第二延伸部分。 第一和第二延伸部分别分别与第一图案导体和第二图案导体重叠。 第一连接部分包括第一通孔线和从第一图案化导体突出的第一通孔线，以在第一通孔线内部以与第一通孔线电连接。 第二连接部分包括第二通孔线和从第二图案化导体突出的第二突出电极，以在第二通孔线内部以与第二通孔线电连接。
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公开(公告)号：US20120298910A1
公开(公告)日：2012-11-29
申请号：US13577585
申请日：2011-02-08
Applicant: Katzuto Ando , Shintaro Hayashi , Hirokuni Kugimoto , Masayuki Ishizuka
Inventor： Katzuto Ando , Shintaro Hayashi , Hirokuni Kugimoto , Masayuki Ishizuka
CPC classification number: C04B35/505 , B82Y30/00 , C04B35/6263 , C04B35/62635 , C04B35/62695 , C04B35/64 , C04B35/645 , C04B35/803 , C04B2235/405 , C04B2235/5248 , C04B2235/526 , C04B2235/5264 , C04B2235/5268 , C04B2235/5288 , C04B2235/5436 , C04B2235/5445 , C04B2235/77 , C04B2235/85 , C04B2235/9607 , C04B2235/9692 , C09K5/00 , H01J37/32477 , H01J37/3255 , H01J37/32642
Abstract: Provided is a sintered object which has excellent resistance to corrosion by corrosive halogen gases and by the plasmas thereof and has excellent thermal conductivity and excellent electrical conductivity. Even when applied to members for use in various vacuum process devices, the sintered object has few limitations on design. The sintered object is usable in a wide range of applications, and is highly versatile. Also provided is a method for producing the sintered object. Furthermore provided is a high-frequency transmission material which has direct-current electrical conductivity for reducing fluctuations in plasma potential and has capacitive properties that enable the material to transmit high-frequency power necessary for plasma excitation, and which has no fear of causing contamination of a sample with a metal and has resistance to corrosion by plasmas. Still further provided are: a sintered object which has excellent resistance to corrosion by corrosive halogen gases and by the plasmas thereof and has no frequency dependence when a high-frequency voltage is applied thereto and with which it is possible to actualize the stability of a plasma; and a method for producing the sintered object.
Abstract translation: 本发明提供一种烧结体，其具有优异的抗腐蚀性卤素气体及其等离子体的耐腐蚀性，并且具有优异的导热性和优异的导电性。 即使应用于各种真空处理装置中使用的构件，烧结体的设计也受到限制。 该烧结体可用于广泛的应用，并且具有高度的通用性。 还提供了一种烧结体的制造方法。 此外还提供了一种高频透射材料，其具有用于减小等离子体电位波动的直流电导率，并且具有使材料能够传输等离子体激发所需的高频功率的电容性质，并且不会引起污染 具有金属的样品并具有耐等离子体腐蚀性。 另外提供的是：通过腐蚀性卤素气体及其等离子体具有优异的耐腐蚀性且在施加高频电压时没有频率依赖性并且可以实现等离子体的稳定性的烧结体 ; 以及烧结体的制造方法。
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公开(公告)号：US07531056B2
公开(公告)日：2009-05-12
申请号：US10581051
申请日：2004-11-25
Applicant: Shinichi Iwasaki , Kazuma Nakazawa , Humitaka Ino , Yoshikatsu Hatakeyama , Shintaro Hayashi
Inventor： Shinichi Iwasaki , Kazuma Nakazawa , Humitaka Ino , Yoshikatsu Hatakeyama , Shintaro Hayashi
CPC classification number: B29D30/0681 , B29D2030/0683 , B60C17/06
Abstract: A manufacturing method for annular run-flat tire support which has a supporting part and a leg part, and which, at the time of run-flat running, is capable of carrying load, comprises the steps of supplying said supporting part and said leg part, applying a bonding agent including a chemical conversion treatment to the bonding region of the radial-direction inside end part of said supporting part that is provided for bonding to said leg part, and bonding between said radial-direction inside end part and said leg part. Thereby, a manufacturing method for run-flat tire support which maintains a high bondability between the supporting part and the leg part, and is excellent in durability, and a run-flat tire support are provided.
Abstract translation: 一种具有支撑部分和腿部的环形漏气保用轮胎支撑件的制造方法，并且在平滑行驶时能够承载载荷，包括以下步骤：将所述支撑部分和所述腿部部分 将包括化学转化处理的粘合剂施加到所述支撑部件的径向内端部的与所述腿部接合的接合区域，以及所述径向内端部和所述腿部部分之间的接合 。 因此，提供了一种用于在支撑部分和腿部之间保持高粘合性并且耐久性优异的防喘振轮胎支撑件的制造方法和缺气保用轮胎支撑件。
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公开(公告)号：US20070240872A1
公开(公告)日：2007-10-18
申请号：US11705452
申请日：2007-02-13
Applicant: Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
Inventor： Shintaro Hayashi , Osamu Urakawa , Mitsuo Koizumi
IPC: F25B29/00
CPC classification number: F25B41/04 , F25B2400/01 , F25B2400/0409 , F25B2400/0411 , F25B2600/2501 , F25B2600/2513 , F25B2700/21 , F25B2700/21152 , G01R31/2874
Abstract: A temperature control apparatus including a temperature control head kept in contact with an electronic device as a testing object thermally, an electric heater attached to the temperature control head, a refrigerant passage formed within the temperature control head so as to run through inside thereof, a compressor which compresses refrigerant coming out of the temperature control head, a temperature sensor which detects a temperature of refrigerant on an outlet side of the compressor, a condenser which condenses refrigerant coming out of the compressor, a returning portion which returns refrigerant condensed by the condenser to the temperature control head, and a control portion which bypasses the condensed refrigerant to the intake side of the compressor by a predetermined quantity corresponding to an output of the temperature sensor.
Abstract translation: 一种温度控制装置，包括与作为测试对象的电子设备保持接触的温度控制头，附接到温度控制头的电加热器，形成在温度控制头内以便穿过其内部的制冷剂通道， 压缩机，其压缩从温度控制头出来的制冷剂，温度传感器，其检测压缩机出口侧的制冷剂的温度;冷凝器，冷凝从压缩机出来的制冷剂;返回部，其返回由冷凝器冷凝的制冷剂 控制部分，其将冷凝的制冷剂旁路到压缩机的进气侧，预定量对应于温度传感器的输出。
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