摘要:
Provided are semiconductor integrated circuit (IC) devices including gate patterns having a step difference therebetween and a connection line interposed between the gate patterns. The semiconductor IC device includes a semiconductor substrate including a peripheral active region, a cell active region, and a device isolation layer. Cell gate patterns are disposed on the cell active region and the device isolation layer. A peripheral gate pattern is disposed on the peripheral active region. A cell electrical node is disposed on the cell active region adjacent to the cell gate patterns. Peripheral electrical nodes are disposed on the peripheral active region adjacent to the peripheral gate pattern. Connection lines are disposed on the cell gate patterns disposed on the device isolation layer. The connection lines are connected between the cell gate patterns and the peripheral gate pattern.
摘要:
Provided is a semiconductor device in which a short margin between a storage contact plug and a bit line contact plug may be increased. The device includes a substrate including isolation regions and active regions defined by the isolation regions, gates disposed in the substrate and configured to intersect the active regions and define source regions and drain regions in the active regions, an interlayer insulating layer disposed on the substrate, bit line contact plugs configured to penetrate the interlayer insulating layer and contact the drain regions, and first bit line structures and second bit line structures disposed on the interlayer insulating layer. The first bit line structures include first bit line conductive patterns and first bit line spacers covering sidewalls of the first bit line conductive patterns. The second bit line structures include second bit line conductive patterns configured to contact the bit line contact plugs to be substantially parallel to the first bit line conductive patterns and first bit line spacers covering sidewalls of the second bit line conductive patterns and sidewalls of the bit line contact plugs.
摘要:
A method of manufacturing a semiconductor device which can prevent leakage current caused by gate electrodes intersecting element isolation layers in a major axis of an active region, and which further has vertical channels to provide a sufficient overlap margin, and a semiconductor device manufactured using the above method. The device includes gate electrodes formed on element isolation layers that are disposed between active regions and have top surfaces that are higher than the top surfaces of the active regions. Since the gate electrodes are formed on the element isolation layers, leakage current in a semiconductor substrate is prevented. In addition, the gate electrodes are formed using a striped shape mask pattern, thereby obtaining a sufficient overlap margin compared to a contact shape or bar shape pattern.
摘要:
A recessed gate structure in a semiconductor device includes a gate electrode partially buried in a substrate, a blocking member formed in the buried portion of the gate electrode, and a gate insulation layer formed between the gate electrode and the substrate. The blocking member may effectively prevent a void or a seam in the buried portion of the gate electrode from contacting the gate insulation layer adjacent to a channel region in subsequent manufacturing processes. Thus, the semiconductor device may have a regular threshold voltage and a leakage current passing through the void or the seam may efficiently decrease.
摘要:
Provided is a semiconductor device in which a short margin between a storage contact plug and a bit line contact plug may be increased. The device includes a substrate including isolation regions and active regions defined by the isolation regions, gates disposed in the substrate and configured to intersect the active regions and define source regions and drain regions in the active regions, an interlayer insulating layer disposed on the substrate, bit line contact plugs configured to penetrate the interlayer insulating layer and contact the drain regions, and first bit line structures and second bit line structures disposed on the interlayer insulating layer. The first bit line structures include first bit line conductive patterns and first bit line spacers covering sidewalls of the first bit line conductive patterns. The second bit line structures include second bit line conductive patterns configured to contact the bit line contact plugs to be substantially parallel to the first bit line conductive patterns and first bit line spacers covering sidewalls of the second bit line conductive patterns and sidewalls of the bit line contact plugs.
摘要:
According to some embodiments of the invention, a method of forming a transistor includes forming a device isolation layer in a semiconductor substrate. The device isolation layer is formed to define at least one active region. A channel region is formed in a predetermined portion of the active region of the semiconductor substrate. Two channel portion holes are formed to extend downward from a main surface of the semiconductor substrate to be in contact with the channel region. Gate patterns fill the channel portion holes and cross the active region. The resulting transistor is capable of ensuring a constant threshold voltage without being affected by an alignment state of the channel portion hole and the gate pattern.
摘要:
A semiconductor device includes first gate structures, second gate structures, a first capping layer pattern, a second capping layer pattern, first spacers, second spacers, third spacers, and a substrate having first impurity regions and second impurity regions. The first gate structures are arranged on the substrate at a first pitch. The second gate structures are arranged on the substrate at a second pitch greater than the first pitch. The first capping layer pattern has segments extending along side faces of the first gate structures and segments extending along the substrate. The second capping layer pattern has segments extending along the second gate structures and segments extending along the substrate. The first spacers and the second spacers are stacked on the second capping layer pattern. The third spacers are formed on the first capping layer pattern.
摘要:
An integrated circuit device is manufactured by forming an insulating layer on a substrate. A capping layer is formed on the insulating layer and both the capping layer and the insulating layer are patterned. Insulating spacers are formed on sidewalls of the insulating layer so that the insulating spacers, the capping layer, and the substrate enclose the insulating layer.
摘要:
A recessed gate structure in a semiconductor device includes a gate electrode partially buried in a substrate, a blocking member formed in the buried portion of the gate electrode, and a gate insulation layer formed between the gate electrode and the substrate. The blocking member may effectively prevent a void or a seam in the buried portion of the gate electrode from contacting the gate insulation layer adjacent to a channel region in subsequent manufacturing processes. Thus, the semiconductor device may have a regular threshold voltage and a leakage current passing through the void or the seam may efficiently decrease.
摘要:
According to some embodiments of the invention, a method of forming a transistor includes forming a device isolation layer in a semiconductor substrate. The device isolation layer is formed to define at least one active region. A channel region is formed in a predetermined portion of the active region of the semiconductor substrate. Two channel portion holes are formed to extend downward from a main surface of the semiconductor substrate to be in contact with the channel region. Gate patterns fill the channel portion holes and cross the active region. The resulting transistor is capable of ensuring a constant threshold voltage without being affected by an alignment state of the channel portion hole and the gate pattern.