公开(公告)号：US5858312A

公开(公告)日：1999-01-12

申请号：US877914

申请日：1997-06-18

Applicant: Thierry Sindzingre ,  Stephane Rabia

Inventor： Thierry Sindzingre ,  Stephane Rabia

IPC: B01J19/08 ,  H01J37/32 ,  C01B13/11 ,  B01J19/12

CPC classification number: H01J37/32082 ,  B01J19/088 ,  H01J37/32357 ,  H01J37/3244

Abstract: A gas excitation device, comprisinga gas excitation chamber comprising a gas inlet passage defining a path of gas in communication with a primary gas supply sources, an outlet passage for excited gas, a venturi-effect constriction arranged on the path of the gas between the primary supply source and the inlet passage, and at least one secondary gas supply source in communication with a region located downstream of the constriction, the gas delivered by the secondary source being entrained by venturi effect into the excitation chamber under the effect of the gas delivered by the primary source.

Abstract translation: 一种气体激发装置，包括气体激发室，其包括气体入口通道，所述气体入口通道限定与主气体供应源连通的气体路径，用于激发气体的出口通道，布置在气体路径上的文丘里效应收缩部 主供应源和入口通道，以及与位于收缩部下游的区域连通的至少一个二次气体供应源，由二次源输送的气体在输送气体的作用下被文丘里效应带入激发室 由主要来源。

公开(公告)号：US5722581A

公开(公告)日：1998-03-03

申请号：US655206

申请日：1996-06-07

Applicant: Thierry Sindzingre ,  Stephane Rabia ,  Nicolas Potier

Inventor： Thierry Sindzingre ,  Stephane Rabia ,  Nicolas Potier

IPC: B23K1/08 ,  B23K1/20 ,  B23K3/00 ,  B23K31/02 ,  H05K3/34

CPC classification number: B23K1/20 ,  B23K2201/42 ,  H05K3/3468 ,  H05K3/3489

Abstract: A method for wave soldering a circuit having two or more faces comprising the steps of: (i) passing at least one initial gas mixture comprising at least one of an inert gas, a reducing gas and an oxidizing gas into at least one apparatus for forming excited or unstable gas species; (ii) converting the at least one initial gas mixture into at least one primary gas mixture comprising excited or unstable gas species and substantially free of electrically charged species; (iii) treating each of the two or more faces of the circuit with the at least one primary gas mixture at a pressure close to atmospheric pressure; and (iv) contacting the two or more faces of the circuit with at least one wave of a liquid soldering alloy.

Abstract translation: 一种用于波峰焊接具有两个或更多个面的电路的方法，包括以下步骤：（i）将至少一种包含惰性气体，还原气体和氧化气体中的至少一种的初始气体混合物送入至少一个用于形成的装置 激发或不稳定的气体物种; （ii）将至少一种初始气体混合物转化成至少一种包含激发或不稳定气体物质并且基本上不带电荷的物质的主要气体混合物; （iii）在接近大气压的压力下用至少一种主要气体混合物处理电路的两个或更多个面中的每一个; 和（iv）使电路的两个或更多个面与液体焊接合金的至少一波接触。

公开(公告)号：US6146503A

公开(公告)日：2000-11-14

申请号：US147463

申请日：1999-01-04

Applicant: Thierry Sindzingre ,  Stephane Rabia

Inventor： Thierry Sindzingre ,  Stephane Rabia

IPC: C08J7/00 ,  B29C59/12 ,  H05F3/00

CPC classification number: B29C59/12

Abstract: In this process for dry surface treatment of at least one surface portion of an object, a gas is passed through an instrument for forming excited or unstable gas species, and said surface portion is brought in front of the outlet of said device with a view to treating it with said excited or unstable gas species, the secondary gas delivered as outlet from the instrument being subsequently taken in again by the Venturi effect and reinjected into the instrument.

Abstract translation: PCT No.PCT / FR97 / 01027 Sec。 371日期1999年1月4日 102（e）日期1999年1月4日PCT提交1997年6月10日PCT公布。 公开号WO98 / 00284 日期1998年1月8日在用于干物表面处理物体的至少一个表面部分的方法中，气体通过用于形成激发或不稳定气体物质的仪器，并且所述表面部分被带到所述 装置，以便用所述激发或不稳定的气体物质进行处理，随后从仪器出口输送的二次气体随后被文丘里效应吸入并重新注入到仪器中。

公开(公告)号：US5941448A

公开(公告)日：1999-08-24

申请号：US984539

申请日：1997-12-03

Applicant: Thierry Sindzingre ,  Stephane Rabia ,  Nicolas Potier ,  Denis Verbockhaven

Inventor： Thierry Sindzingre ,  Stephane Rabia ,  Nicolas Potier ,  Denis Verbockhaven

IPC: B23K1/20

CPC classification number: B23K1/203

Abstract: A method for dry fluxing at least one metallic surface of an article comprising the steps of:a) passing at least one initial gas mixture comprising (1) at least one of an inert gas and a reducing gas and (2) an oxidizing gas mixture comprising water vapor into at least one apparatus for forming excited or unstable gas species, the initial gas mixture including 50 ppm to 6% water vapor;b) converting the at least one initial gas mixture to at least one primary gas mixture comprising excited or unstable gas species; andc) treating the surface to be fluxed, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable gas species and substantially free of electrically charged species obtained from the primary gas mixture.

Abstract translation: 一种干法熔化制品的至少一个金属表面的方法，包括以下步骤：a）使至少一种初始气体混合物通过，所述初始气体混合物包括（1）惰性气体和还原气体中的至少一种，和（2）氧化性气体混合物 将水蒸汽包含在至少一个用于形成激发或不稳定气体物质的装置中，初始气体混合物包括50ppm至6％的水蒸汽; b）将至少一种初始气体混合物转化为至少一种包含激发或不稳定气体物质的初级气体混合物; 和c）在包含激发或不稳定的气体物质并基本上不含从主气体混合物获得的带电物质的气态处理气氛下，以接近大气压的压力处理要被助熔的表面。

公开(公告)号：US06990750B2

公开(公告)日：2006-01-31

申请号：US10627320

申请日：2003-07-25

Applicant: Martin Theriault ,  Kristen Boyce ,  Stephane Rabia

Inventor： Martin Theriault ,  Kristen Boyce ,  Stephane Rabia

IPC: F26B7/00

CPC classification number: H01L21/67769 ,  H01L21/67017

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

公开(公告)号：US06877219B1

公开(公告)日：2005-04-12

申请号：US09698817

申请日：2000-10-26

Applicant: Martin Theriault ,  Stephane Rabia ,  Jason Uner

Inventor： Martin Theriault ,  Stephane Rabia ,  Jason Uner

IPC: H05K13/02 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0417 ,  H05K13/02 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49137 ,  Y10T29/53096 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53265

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract translation: 本发明的装置和方法涉及在表面安装装置贴装机的部件收纳部中使用干燥气氛。 干燥的气氛提供消除烘烤过程和其他水分管理问题的好处。 根据本发明的一个方面，一种用于将部件放置在印刷电路板上的部件放置机构包括：部件存储区域，用于从部件存储区域获取部件并将部件放置在印刷电路板上的部件放置系统， 围绕组件存储区域的外壳，以及用于将干燥气体输送到存储区域以防止水分被组分吸收的干燥气体输送系统。

公开(公告)号：US06622399B1

公开(公告)日：2003-09-23

申请号：US09699001

申请日：2000-10-26

Applicant: Martin Theriault ,  Kristen Boyce ,  Stephane Rabia

Inventor： Martin Theriault ,  Kristen Boyce ,  Stephane Rabia

IPC: F26B700

CPC classification number: H01L21/67769 ,  H01L21/67017

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Abstract translation: 本发明的装置和方法涉及电气部件存储区域中的暖和干燥气氛的使用。 温暖和干燥的氛围通过从组件中除去水分而有助于消除烘烤过程和其他水分管理问题。 根据本发明的一个方面，一种部件存储系统包括封闭部件存储区域和用于将干燥气体输送到存储区域以防止水分被部件吸收的干燥气体输送系统，以及温度控制 用于将干燥气体的温度控制在约10℃至约60℃的系统

公开(公告)号：US6021940A

公开(公告)日：2000-02-08

申请号：US967041

申请日：1997-11-10

Applicant: Thierry Sindzingre ,  Stephane Rabia ,  Denis Verbokhaven ,  Gilles Conor

Inventor： Thierry Sindzingre ,  Stephane Rabia ,  Denis Verbokhaven ,  Gilles Conor

IPC: B23K1/00 ,  B23K1/012 ,  B23K1/20 ,  B23K35/38 ,  C23G5/00 ,  H05K3/26 ,  H05K3/34 ,  B23K31/00

CPC classification number: B23K1/203 ,  B23K1/012 ,  B23K35/38 ,  B23K35/383 ,  C23G5/00 ,  H05K3/3489 ,  B23K2201/42

Abstract: The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least partially metallic, electronic component is to be mounted, (2) the solder paste, and (3) the metallic portions of the electronic component. The method comprises treating the metallic surface with a gaseous treatment atmosphere comprising unstable or excited gaseous species, and is substantially free of electrically charged species.

Abstract translation: 本发明涉及在回流焊接操作之前，期间或之后的干洗或干式助熔金属表面的方法。 干洗或干式助焊剂的金属表面包括（1）金属基材上至少部分金属的电子元件将被安装在其上，（2）焊膏，和（3）电子部件的金属部分 。 该方法包括用包含不稳定或激发的气态物质的气态处理气氛处理金属表面，并且基本上不带电荷的物质。

公开(公告)号：US6007637A

公开(公告)日：1999-12-28

申请号：US746876

申请日：1996-11-18

Applicant: Thierry Sindzingre ,  Stephane Rabia ,  Daniel Guerin ,  Christian Larquet

Inventor： Thierry Sindzingre ,  Stephane Rabia ,  Daniel Guerin ,  Christian Larquet

IPC: C23G5/00 ,  B08B7/04

CPC classification number: C23G5/00

Abstract: The invention relates to a process for the dry surface treatment of at least one metal surface portion, according to which the portion is treated at a pressure close to atmospheric pressure by a gaseous treatment atmosphere comprising excited or unstable species and substantially devoid of electrically charged species, obtained from a primary gaseous mixture and if necessary an adjacent gaseous mixture, the primary gaseous mixture being obtained at the gas outlet of at least one device for the production of excited or unstable gaseous species, in which an initial gaseous mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent mixture not having passed through the device.

Abstract translation: 本发明涉及一种用于干表面处理至少一个金属表面部分的方法，根据该方法，该部分在接近于大气压的压力下通过包含激发或不稳定物质的气体处理气氛进行处理，并且基本上没有带电荷的物质 从主要气体混合物获得，如果需要的话，相邻的气体混合物，在至少一个装置的气体出口处获得主要气体混合物，用于产生激发或不稳定的气态物质，其中包含惰性气体的初始气体混合物 和/或还原气体和/或氧化气体已经被转化，相邻的混合物没有通过该装置。

公开(公告)号：US07137194B2

公开(公告)日：2006-11-21

申请号：US11063698

申请日：2005-02-22

Applicant: Martin Theriault ,  Stephane Rabia ,  Jason Uner

Inventor： Martin Theriault ,  Stephane Rabia ,  Jason Uner

IPC: H05K3/30

CPC classification number: H05K13/0417 ,  H05K13/02 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49137 ,  Y10T29/53096 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53265

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract translation: 本发明的装置和方法涉及在表面安装装置贴装机的部件收纳部中使用干燥气氛。 干燥的气氛提供消除烘烤过程和其他水分管理问题的好处。 根据本发明的一个方面，一种用于将部件放置在印刷电路板上的部件放置机构包括：部件存储区域，用于从部件存储区域获取部件并将部件放置在印刷电路板上的部件放置系统， 围绕组件存储区域的外壳，以及用于将干燥气体输送到存储区域以防止水分被组分吸收的干燥气体输送系统。