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1.发明授权Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor 失效在焊接或镀锡之前，使用包括水蒸气的气氛在金属表面进行干式助熔的方法
公开(公告)号：US5941448A
公开(公告)日：1999-08-24
申请号：US984539
申请日：1997-12-03
IPC分类号： B23K1/20
CPC分类号： B23K1/203
摘要： A method for dry fluxing at least one metallic surface of an article comprising the steps of:a) passing at least one initial gas mixture comprising (1) at least one of an inert gas and a reducing gas and (2) an oxidizing gas mixture comprising water vapor into at least one apparatus for forming excited or unstable gas species, the initial gas mixture including 50 ppm to 6% water vapor;b) converting the at least one initial gas mixture to at least one primary gas mixture comprising excited or unstable gas species; andc) treating the surface to be fluxed, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable gas species and substantially free of electrically charged species obtained from the primary gas mixture.
摘要翻译： 一种干法熔化制品的至少一个金属表面的方法，包括以下步骤：a）使至少一种初始气体混合物通过，所述初始气体混合物包括（1）惰性气体和还原气体中的至少一种，和（2）氧化性气体混合物 将水蒸汽包含在至少一个用于形成激发或不稳定气体物质的装置中，初始气体混合物包括50ppm至6％的水蒸汽; b）将至少一种初始气体混合物转化为至少一种包含激发或不稳定气体物质的初级气体混合物; 和c）在包含激发或不稳定的气体物质并基本上不含从主气体混合物获得的带电物质的气态处理气氛下，以接近大气压的压力处理要被助熔的表面。
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2.发明授权
公开(公告)号：US5722581A
公开(公告)日：1998-03-03
申请号：US655206
申请日：1996-06-07
CPC分类号： B23K1/20 , B23K2201/42 , H05K3/3468 , H05K3/3489
摘要： A method for wave soldering a circuit having two or more faces comprising the steps of: (i) passing at least one initial gas mixture comprising at least one of an inert gas, a reducing gas and an oxidizing gas into at least one apparatus for forming excited or unstable gas species; (ii) converting the at least one initial gas mixture into at least one primary gas mixture comprising excited or unstable gas species and substantially free of electrically charged species; (iii) treating each of the two or more faces of the circuit with the at least one primary gas mixture at a pressure close to atmospheric pressure; and (iv) contacting the two or more faces of the circuit with at least one wave of a liquid soldering alloy.
摘要翻译： 一种用于波峰焊接具有两个或更多个面的电路的方法，包括以下步骤：（i）将至少一种包含惰性气体，还原气体和氧化气体中的至少一种的初始气体混合物送入至少一个用于形成的装置 激发或不稳定的气体物种; （ii）将至少一种初始气体混合物转化成至少一种包含激发或不稳定气体物质并且基本上不带电荷的物质的主要气体混合物; （iii）在接近大气压的压力下用至少一种主要气体混合物处理电路的两个或更多个面中的每一个; 和（iv）使电路的两个或更多个面与液体焊接合金的至少一波接触。
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公开(公告)号：US6146503A
公开(公告)日：2000-11-14
申请号：US147463
申请日：1999-01-04
申请人： Thierry Sindzingre , Stephane Rabia
发明人： Thierry Sindzingre , Stephane Rabia
CPC分类号： B29C59/12
摘要： In this process for dry surface treatment of at least one surface portion of an object, a gas is passed through an instrument for forming excited or unstable gas species, and said surface portion is brought in front of the outlet of said device with a view to treating it with said excited or unstable gas species, the secondary gas delivered as outlet from the instrument being subsequently taken in again by the Venturi effect and reinjected into the instrument.
摘要翻译： PCT No.PCT / FR97 / 01027 Sec。 371日期1999年1月4日 102（e）日期1999年1月4日PCT提交1997年6月10日PCT公布。 公开号WO98 / 00284 日期1998年1月8日在用于干物表面处理物体的至少一个表面部分的方法中，气体通过用于形成激发或不稳定气体物质的仪器，并且所述表面部分被带到所述 装置，以便用所述激发或不稳定的气体物质进行处理，随后从仪器出口输送的二次气体随后被文丘里效应吸入并重新注入到仪器中。
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4.发明授权Method and device for supplying several working gases, and its application to an installation for assembling electronic components 失效用于提供几种工作气体的方法和装置，以及其用于组装电子部件的安装公开(公告)号：US06293997B1
公开(公告)日：2001-09-25
申请号：US09423296
申请日：1999-11-09
IPC分类号： B01D5322
CPC分类号： C01B13/0251 , B01D53/229 , B01D53/75 , B01D53/869 , B01J19/14 , C01B13/0248 , C01B2210/0046
摘要： A method for delivering at least two working gases from a common air supply comprising the steps of depleting the air in O2 in order to obtain a first gas mixture having an O2 content less than or equal to t1; delivering at least a portion of this first gas mixture as a first working gas; depleting another portion of this first gas mixture in O2 in order to obtain the second gas mixture having an O2 content less than or equal to t2, wherein t1 is greater than t2; and delivering the second gas mixture as a second working gas.
摘要翻译： 一种用于从共用空气供应器输送至少两种工作气体的方法，包括以下步骤：在O 2中耗尽空气，以获得O2含量小于或等于t1的第一气体混合物; 将第一气体混合物的至少一部分输送为第一工作气体; 在O 2中消耗该第一气体混合物的另一部分，以获得O2含量小于或等于t2的第二气体混合物，其中t1大于t2; 以及将第二气体混合物作为第二工作气体递送。
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公开(公告)号：US5858312A
公开(公告)日：1999-01-12
申请号：US877914
申请日：1997-06-18
申请人： Thierry Sindzingre , Stephane Rabia
发明人： Thierry Sindzingre , Stephane Rabia
CPC分类号： H01J37/32082 , B01J19/088 , H01J37/32357 , H01J37/3244
摘要： A gas excitation device, comprisinga gas excitation chamber comprising a gas inlet passage defining a path of gas in communication with a primary gas supply sources, an outlet passage for excited gas, a venturi-effect constriction arranged on the path of the gas between the primary supply source and the inlet passage, and at least one secondary gas supply source in communication with a region located downstream of the constriction, the gas delivered by the secondary source being entrained by venturi effect into the excitation chamber under the effect of the gas delivered by the primary source.
摘要翻译： 一种气体激发装置，包括气体激发室，其包括气体入口通道，所述气体入口通道限定与主气体供应源连通的气体路径，用于激发气体的出口通道，布置在气体路径上的文丘里效应收缩部 主供应源和入口通道，以及与位于收缩部下游的区域连通的至少一个二次气体供应源，由二次源输送的气体在输送气体的作用下被文丘里效应带入激发室 由主要来源。
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公开(公告)号：US6021940A
公开(公告)日：2000-02-08
申请号：US967041
申请日：1997-11-10
CPC分类号： B23K1/203 , B23K1/012 , B23K35/38 , B23K35/383 , C23G5/00 , H05K3/3489 , B23K2201/42
摘要： The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least partially metallic, electronic component is to be mounted, (2) the solder paste, and (3) the metallic portions of the electronic component. The method comprises treating the metallic surface with a gaseous treatment atmosphere comprising unstable or excited gaseous species, and is substantially free of electrically charged species.
摘要翻译： 本发明涉及在回流焊接操作之前，期间或之后的干洗或干式助熔金属表面的方法。 干洗或干式助焊剂的金属表面包括（1）金属基材上至少部分金属的电子元件将被安装在其上，（2）焊膏，和（3）电子部件的金属部分 。 该方法包括用包含不稳定或激发的气态物质的气态处理气氛处理金属表面，并且基本上不带电荷的物质。
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公开(公告)号：US6007637A
公开(公告)日：1999-12-28
申请号：US746876
申请日：1996-11-18
CPC分类号： C23G5/00
摘要： The invention relates to a process for the dry surface treatment of at least one metal surface portion, according to which the portion is treated at a pressure close to atmospheric pressure by a gaseous treatment atmosphere comprising excited or unstable species and substantially devoid of electrically charged species, obtained from a primary gaseous mixture and if necessary an adjacent gaseous mixture, the primary gaseous mixture being obtained at the gas outlet of at least one device for the production of excited or unstable gaseous species, in which an initial gaseous mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent mixture not having passed through the device.
摘要翻译： 本发明涉及一种用于干表面处理至少一个金属表面部分的方法，根据该方法，该部分在接近于大气压的压力下通过包含激发或不稳定物质的气体处理气氛进行处理，并且基本上没有带电荷的物质 从主要气体混合物获得，如果需要的话，相邻的气体混合物，在至少一个装置的气体出口处获得主要气体混合物，用于产生激发或不稳定的气态物质，其中包含惰性气体的初始气体混合物 和/或还原气体和/或氧化气体已经被转化，相邻的混合物没有通过该装置。
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8.发明授权Method and device for dry fluxing of metallic surfaces before soldering or tinning 失效在焊接或镀锡之前，金属表面干法熔化的方法和装置
公开(公告)号：US6089445A
公开(公告)日：2000-07-18
申请号：US55705
申请日：1998-04-07
申请人： Thierry Sindzingre , Stephane Rabia
发明人： Thierry Sindzingre , Stephane Rabia
IPC分类号： B23K1/20 , B23K3/00 , B23K31/02 , B23K35/38 , C23C18/18 , C23G5/00 , H01T19/00 , H05K3/34 , B23K1/00
CPC分类号： H05K3/3489 , B23K1/203 , B23K35/38 , B23K35/383 , C23G5/00
摘要： The invention relates to a method for drying fluxing of a metallic surface before soldering or tinning using an alloy, according to which the surface to be fluxed is treated, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable species and being substantially free of electrically charged species, which is obtained from a primary gas mixture and, optionally, an adjacent gas mixture, the primary gas mixture being obtained at the gas outlet of at least one apparatus for forming excited or unstable gas species, in which an initial gas mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent gas mixture not having passed through the apparatus.
摘要翻译： 本发明涉及一种在使用合金进行焊接或镀锡之前干燥金属表面的助熔剂的方法，根据该方法，待处理的表面在接近大气压的压力下用包含激发或不稳定物质的气体处理气氛 并且基本上不含从主气体混合物和任选的相邻气体混合物获得的带电物质，所述主气体混合物在至少一个用于形成激发或不稳定气体物质的装置的气体出口处获得， 其中包含惰性气体和/或还原气体和/或氧化气体的初始气体混合物已经被转化，相邻的气体混合物没有通过设备。
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9.发明授权Method and device for forming an excited gaseous treatment atmosphere lacking electrically charged species used for treating metallic substrates 失效用于形成没有用于处理金属基底的带电物质的激发态气体处理气氛的方法和装置
公开(公告)号：US5807615A
公开(公告)日：1998-09-15
申请号：US663164
申请日：1996-06-06
申请人： Thierry Sindzingre , Stephane Rabia
发明人： Thierry Sindzingre , Stephane Rabia
IPC分类号： C23C16/42 , C23C16/452 , C23C16/50 , C23C16/509 , C23C16/22
CPC分类号： C23C16/5093 , C23C16/452 , C23C16/5096
摘要： A method of forming a gaseous treatment atmosphere capable of depositing a silicon on a metal substrate comprising the steps of: converting an initial gas mixture into a primary gas mixture in an apparatus for forming excited or unstable gas species, the primary gas mixture comprising excited or unstable gaseous species substantially devoid of electrically charged species, combining the primary gas mixture with an adjacent gas mixture which comprises at least one silicon precursor gas and which has not passed through the apparatus, to form the gaseous treatment atmosphere.
摘要翻译： PCT No.PCT / FR94 / 01423 Sec。 371日期：1996年6月6日 102（e）日期1996年6月6日PCT 1994年12月7日PCT PCT。 公开号WO95 / 16802 日期：1995年6月22日一种形成能够在金属基底上沉积硅的气态处理气氛的方法，包括以下步骤：在用于形成激发或不稳定气体物质的装置中将初始气体混合物转化为初级气体混合物， 气体混合物，其包含基本上不带电荷的物质的激发或不稳定的气态物质，将主气体混合物与包含至少一种硅前体气体并且未通过该装置的相邻气体混合物组合以形成气态处理气氛。
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10.发明授权
公开(公告)号：US5807614A
公开(公告)日：1998-09-15
申请号：US640802
申请日：1996-06-05
IPC分类号： C23C16/42 , C23C16/452 , C23C16/50 , C23C16/509 , C23C16/22
CPC分类号： C23C16/452 , C23C16/5093
摘要： A method of forming a gaseous treatment atmosphere capable of depositing a silicon-containing film on a nonmetallic substrate comprising the steps of: converting an initial treatment gas mixture into a primary treatment gas mixture in an apparatus for forming excited or unstable gas species, the primary treatment gas mixture comprising excited or unstable gaseous species substantially devoid of electrically charged species, combining the primary treatment gas mixture with an adjacent treatment gas mixture which comprises at least one gaseous silicon precursor which has not passed through the apparatus, to form the gaseous treatment atmosphere.
摘要翻译： PCT No.PCT / FR94 / 01422 Sec。 371日期：1996年6月5日 102（e）日期1996年6月5日PCT 1994年12月7日PCT公布。 WO95 / 16801 PCT出版物 日期：1995年6月22日一种形成能够在非金属基底上沉积含硅膜的气态处理气氛的方法，包括以下步骤：将初始处理气体混合物转化成用于形成激发或不稳定的装置的初级处理气体混合物 气体物质，主要处理气体混合物包含基本上没有带电物质的激发或不稳定的气态物质，将主处理气体混合物与包含至少一种尚未通过设备的气态硅前体的相邻处理气体混合物组合成 形成气体处理气氛。
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