公开(公告)号：US5360642A

公开(公告)日：1994-11-01

申请号：US65005

申请日：1993-05-24

申请人： Kiran B. Chandalia ,  Michael J. Morgan ,  Michael M. Martinez ,  James M. O'Connor ,  Stephen P. Noe

发明人： Kiran B. Chandalia ,  Michael J. Morgan ,  Michael M. Martinez ,  James M. O'Connor ,  Stephen P. Noe

IPC分类号： C08G18/10 ,  C08G18/18 ,  C08G18/28 ,  B05D3/02

CPC分类号： C08G18/284 ,  C08G18/10 ,  C08G18/18 ,  C08G18/1825 ,  C08G18/2805 ,  C08G18/283 ,  Y10T428/31547 ,  Y10T428/31551

摘要： This invention relates to a process for coating a substrate which comprises contacting the substrate with a low volatility organic (so-called "low VOC") coating composition having a viscosity as measured by ZAHN cup 2 of less than about 200 seconds and consisting essentially of at least one polyisocyanate prepolymer which is the reaction product of a polyisocyanate with an active hydrogen-containing compound selected from the group consisting of monoahls, polyols, imines, oxazolidines, and combinations thereof, a solvent in an amount of between 0% and 45% by weight based upon the amount of said polyisocyanate in said composition, and a tertiary amine catalyst, said composition being essentially free of any volatile mono- and di-isocyanates, and said composition being moisture curable upon exposure to atmospheric moisture. Also claimed is the coating composition itself.

摘要翻译： 本发明涉及一种用于涂覆基材的方法，该方法包括使底物与低挥发性有机（所谓的“低VOC”）涂料组合物接触，所述低挥发性有机（所谓的“低VOC”）涂料组合物具有通过ZAHN杯2测量的粘度小于约200秒， 至少一种多异氰酸酯预聚物，其是多异氰酸酯与选自单酚，多元醇，亚胺，恶唑烷及其组合的活性含氢化合物的反应产物，溶剂的量为0％至45％ 所述组合物基于所述组合物中所述多异氰酸酯的量和叔胺催化剂，所述组合物基本上不含任何挥发性单 - 和二 - 异氰酸酯，并且所述组合物在暴露于大气湿气时可湿气固化。 还要求的是涂料组合物本身。

公开(公告)号：US5521272A

公开(公告)日：1996-05-28

申请号：US427504

申请日：1995-04-24

申请人： James M. O'Connor ,  Stephen P. Noe ,  Henry J. Barnowski, Jr. ,  Ronald T. Wojcik

发明人： James M. O'Connor ,  Stephen P. Noe ,  Henry J. Barnowski, Jr. ,  Ronald T. Wojcik

IPC分类号： C08G18/80 ,  B05D7/16

CPC分类号： C08G18/807

摘要： A clear or colorless coating that is free of yellow discoloration, and a method for the production thereof, utilizing a pyrazole compound as a blocking agent for the blocked polyisocyanate employed in the coating composition.

摘要翻译： 不含黄色变色的透明或无色涂层及其制备方法，其中使用吡唑化合物作为涂料组合物中所用封端多异氰酸酯的封闭剂。

公开(公告)号：US5391614A

公开(公告)日：1995-02-21

申请号：US274877

申请日：1994-07-14

申请人： Kiran B. Chandalia ,  Michael J. Morgan ,  Michael M. Martinez ,  James M. O'Connor ,  Stephen P. Noe

发明人： Kiran B. Chandalia ,  Michael J. Morgan ,  Michael M. Martinez ,  James M. O'Connor ,  Stephen P. Noe

IPC分类号： C08G18/10 ,  C08G18/18 ,  C08G18/28

CPC分类号： C08G18/284 ,  C08G18/10 ,  C08G18/18 ,  C08G18/1825 ,  C08G18/2805 ,  C08G18/283 ,  Y10T428/31547 ,  Y10T428/31551

摘要： This invention relates to a process for coating a substrate which comprises contacting the substrate with a low volatility organic (so-called "low VOC") coating composition having a viscosity as measured by ZAHN cup 2 of less than about 200 seconds and consisting essentially of at least one polyisocyanate prepolymer which is the reaction product of a polyisocyanate with an active hydrogen-containing compound selected from the group consisting of monoahls, polyols, imines, oxazolidines, and combinations thereof, a solvent in an amount of between 0% and 45% by weight based upon the amount of said polyisocyanate in said composition, and a tertiary amine catalyst, said composition being essentially free of any volatile mono- and di-isocyanates, and said composition being moisture curable upon exposure to atmospheric moisture. Also claimed is the coating composition itself.

摘要翻译： 本发明涉及一种用于涂覆基材的方法，该方法包括使底物与低挥发性有机（所谓的“低VOC”）涂料组合物接触，所述低挥发性有机（所谓的“低VOC”）涂料组合物具有通过ZAHN杯2测量的粘度小于约200秒， 至少一种多异氰酸酯预聚物，其是多异氰酸酯与选自单酚，多元醇，亚胺，恶唑烷及其组合的活性含氢化合物的反应产物，溶剂的量为0％至45％ 所述组合物基于所述组合物中所述多异氰酸酯的量和叔胺催化剂，所述组合物基本上不含任何挥发性单 - 和二 - 异氰酸酯，并且所述组合物在暴露于大气湿气时可湿气固化。 还要求的是涂料组合物本身。

公开(公告)号：US5043534A

公开(公告)日：1991-08-27

申请号：US548322

申请日：1990-07-02

申请人： Deepak Mahulikar ,  Jeffrey S. Braden ,  Stephen P. Noe

发明人： Deepak Mahulikar ,  Jeffrey S. Braden ,  Stephen P. Noe

IPC分类号： H01L23/00 ,  H01L23/02 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/60

CPC分类号： H01L23/10 ,  H01L23/552 ,  H01L23/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3025

摘要： A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.

摘要翻译： 提供具有改进的电磁干扰屏蔽的金属电子封装。 金属底座和盖组件电互连以保持相同的电压电位，从而减少EMI引起的互感。 诸如接触销的导电导管提供互连。 如果电子设备安装在芯片焊盘上，则导电导管也连接到芯片连接的支撑焊盘。