公开(公告)号：US07394139B2

公开(公告)日：2008-07-01

申请号：US11347187

申请日：2006-02-03

Applicant: Heung Woo Park ,  Yeong Gyu Lee ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

Inventor： Heung Woo Park ,  Yeong Gyu Lee ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

IPC: H01L27/14 ,  H01L31/00

CPC classification number: G02B26/0833 ,  G03H2225/24 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00014

Abstract: Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

Abstract translation: 本文公开了一种使用倒装芯片安装技术的光调制器模块封装，其中使用倒装芯片安装技术将光调制器装置气密地安装。 光调制器装置被保护免受外部环境的影响，容易将电信号传输到外部，并且希望保持光调制器件的光学特性。

公开(公告)号：US07388282B2

公开(公告)日：2008-06-17

申请号：US11180979

申请日：2005-07-12

Applicant: Yeong Gyu Lee ,  Suk Kee Hong

Inventor： Yeong Gyu Lee ,  Suk Kee Hong

IPC: H01L32/02

CPC classification number: B81C1/00269 ,  B81C2203/019 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.

Abstract translation: 公开了一种具有疏水层的微机电系统（MEMS）封装。 MEMS封装包括：基底基板，其具有设置在基底基板的表面上的MEMS元件; 与设置在基底基板上并覆盖MEMS元件的MEMS元件间隔开的盖; 侧密封构件，设置在基底基板的侧面和盖的表面上，从而将MEMS元件从外部环境密封; 以及覆盖侧面密封构件暴露于外部环境的部分的疏水层，从而从侧面密封构件除去亲水性。

公开(公告)号：US20070075417A1

公开(公告)日：2007-04-05

申请号：US11543391

申请日：2006-10-04

Applicant: Young-Nam Hwang ,  Yeong-Gyu Lee ,  Suk-Kee Hong ,  Heung-Woo Park

Inventor： Young-Nam Hwang ,  Yeong-Gyu Lee ,  Suk-Kee Hong ,  Heung-Woo Park

IPC: H01L23/12

CPC classification number: B81B7/0077 ,  B81B2201/045

Abstract: A MEMS module package using a sealing cap having heat releasing capability is disclosed, which comprises a lower substrate, a MEMS element mounted on the lower substrate, a driver integrated circuit mounted on the lower substrate adjacently to the MEMS element which operates the MEMS element, and a sealing cap positioned in contact with the lower substrate which has a MEMS-element protrusion portion in physical contact with the MEMS element and has one or more grooves for housing the MEMS element and the driver integrated circuit. The MEMS module package using a sealing cap having heat releasing capability and a manufacturing method thereof according to an aspect of the present invention utilize an effective heat releasing structure to release the heat generated in each element.

Abstract translation: 公开了一种使用具有放热能力的密封盖的MEMS模块封装，其包括下基板，安装在下基板上的MEMS元件，安装在下基板上的与驱动MEMS元件的MEMS元件相邻的驱动器集成电路， 以及与所述下基板接触的密封盖，所述密封帽具有与所述MEMS元件物理接触的MEMS元件突出部分，并且具有用于容纳所述MEMS元件和所述驱动器集成电路的一个或多个凹槽。 根据本发明的一个方面的使用具有放热能力的密封盖的MEMS模块封装及其制造方法利用有效的放热结构来释放每个元件中产生的热量。

公开(公告)号：US07113689B2

公开(公告)日：2006-09-26

申请号：US10606348

申请日：2003-06-26

Applicant: Yoon Shik Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee ,  Suk Kee Hong ,  Joon Seok Kang ,  Jung Hyun Lee

Inventor： Yoon Shik Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee ,  Suk Kee Hong ,  Joon Seok Kang ,  Jung Hyun Lee

IPC: G02B6/00

CPC classification number: G02B6/353 ,  G02B6/266 ,  G02B6/35 ,  G02B6/3552 ,  G02B6/356 ,  G02B6/357 ,  G02B6/358 ,  G02B6/3582 ,  G02B6/3592 ,  G02B6/3594

Abstract: An MEMS variable optical attenuator includes a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of coaxially aligned optical waveguides having a receiving end and a transmitting end, respectively, and an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven by the micro-electric actuator. A surface layer is formed on the optical shutter, has reflectivity less than 80% so as to allow incident light beams to partially transmit thereinto, and further has a sufficient light extinction ratio, thereby extinguishing the partially transmitted light beams therein.

Abstract translation: MEMS可变光衰减器包括具有平面表面的基板，布置在基板的平面表面上的微电致动器，分别具有接收端和发射端的一对同轴对准的光波导，以及可移动的光闸 到光波导的接收端和发送端之间的预定位置，并由微电动致动器驱动。 表面层形成在光学快门上，具有小于80％的反射率，以便使入射光束部分地透射，并且还具有足够的消光比，由此熄灭其中部分透射的光束。

公开(公告)号：US20060078247A1

公开(公告)日：2006-04-13

申请号：US11244563

申请日：2005-10-06

Applicant: Yeong Gyu Lee ,  Jong Hyeong Song ,  Heung Woo Park ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

Inventor： Yeong Gyu Lee ,  Jong Hyeong Song ,  Heung Woo Park ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

IPC: G02B6/12

CPC classification number: G02B6/4232

Abstract: Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.

Abstract translation: 这里公开了一种用于光学调制器的封装结构，其被配置为使得光学调制装置和电子控制电路并入模块中，从而允许制造紧凑的模块，同时保持光学调制装置的光学特性。

公开(公告)号：US06915033B2

公开(公告)日：2005-07-05

申请号：US10689632

申请日：2003-10-22

Applicant: Suk Kee Hong ,  Yeong Gyu Lee

Inventor： Suk Kee Hong ,  Yeong Gyu Lee

IPC: G02B6/32 ,  G02B6/35 ,  G02B26/08 ,  G02B6/26

CPC classification number: G02B6/3514 ,  G02B6/3548 ,  G02B6/3564

Abstract: Disclosed are a multi-channel optical switch and a method for manufacturing the same. The multi-channel optical switch includes a supporter; an input terminal optical fiber fixed to the supporter for inputting an optical signal to be switched therethrough; multiple output terminal optical fibers fixed to the supporter for outputting the optical signal inputted through the input terminal optical fiber therethrough; multiple micro mirrors for reflecting the optical signal inputted through the input terminal optical fiber and then for directing the optical signal to a designated output terminal optical fiber among the multiple output terminal optical fibers; and multiple actuators respectively connected to the micro mirrors for adjusting the positions of the micro mirrors so that the optical signal is reflected by the micro mirrors.

Abstract translation: 公开了一种多通道光开关及其制造方法。 多通道光开关包括支架; 一个输入端子光纤，固定在支架上，用于输入要切换的光信号; 多个输出端子光纤固定到支撑件，用于输出通过输入端子光纤输入的光信号; 多个微镜，用于反射通过输入端子光纤输入的光信号，然后用于将光信号引导到多个输出端光纤之间的指定输出端光纤; 以及分别连接到微镜的多个致动器，用于调整微反射镜的位置，使得光信号被微镜反射。

公开(公告)号：US06901204B2

公开(公告)日：2005-05-31

申请号：US10610756

申请日：2003-07-02

Applicant: Yoon Shik Hong ,  Sang Kee Yoon ,  Suk Kee Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Jung Hyun Lee

Inventor： Yoon Shik Hong ,  Sang Kee Yoon ,  Suk Kee Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Jung Hyun Lee

IPC: G02B6/00 ,  B81B3/00 ,  G02B6/26 ,  G02B6/35 ,  G02B26/02 ,  H02N1/00 ,  G02B6/42 ,  G02B26/00 ,  G02B26/08

CPC classification number: G02B6/353 ,  G02B6/266 ,  G02B6/3552 ,  G02B6/357 ,  G02B6/3584 ,  G02B6/3594

Abstract: Disclosed is an MEMS variable optical attenuator comprising a substrate having a planar surface, optical fibers having an optical signal transmitting end and an optical signal receiving end, respectively, coaxially arranged on the substrate, a micro-electric actuator arranged on the substrate for providing a driving stroke along a direction perpendicular to an optical axis of the optical beam, at least one lever structure arranged on the substrate for receiving the driving stroke of the micro-electric actuator at a first end thereof and transferring an amplified displacement distance to an optical shutter through a second end thereof, an optical shutter arranged on the substrate and connected to the second end of the lever structure so as to be moved by the amplified displacement distance, thereby being displaced to an attenuation position of the optical beam.

Abstract translation: 公开了一种MEMS可变光衰减器，其包括具有平坦表面的基板，具有光信号发射端的光纤和分别同轴地布置在基板上的光信号接收端，布置在基板上的微电致动器，用于提供 沿着与所述光束的光轴垂直的方向驱动行程;至少一个杠杆结构，布置在所述基板上，用于在其第一端处接收所述微型致动器的驱动行程，并将放大的位移距离传送到光学快门 通过其第二端，设置在基板上并连接到杠杆结构的第二端的光闸，以便被放大的位移距离移动，从而被移位到光束的衰减位置。

公开(公告)号：US07319553B2

公开(公告)日：2008-01-15

申请号：US11358537

申请日：2006-02-21

Applicant: Suk Kee Hong

Inventor： Suk Kee Hong

IPC: G02B26/00 ,  G02B5/18

CPC classification number: G02B26/0808

Abstract: Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip bonded to a substrate, and an opening of the substrate is blocked using a piece of glass.

Abstract translation: 这里公开了光调制器模块封装结构。 在光调制器模块封装结构中，将光调制器件和驱动集成电路器件倒装芯片接合到基片上，并且使用玻璃片阻挡基片的开口。

公开(公告)号：US07078804B2

公开(公告)日：2006-07-18

申请号：US10952253

申请日：2004-09-28

Applicant: Suk-Kee Hong ,  Yeong-Gyu Lee ,  Heung-Woo Park

Inventor： Suk-Kee Hong ,  Yeong-Gyu Lee ,  Heung-Woo Park

IPC: H01L23/04 ,  H01L23/06 ,  H01L23/02 ,  H01L29/22

CPC classification number: B81C1/00269 ,  H01L2224/48463

Abstract: A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.

Abstract translation: 公开了具有侧密封构件的微机电系统（MEMS）封装和制造封装的方法。 在本发明的MEMS封装和方法中，密封构件形成在盖玻璃的侧表面上，该盖玻璃安装在围绕设置在基底基板上的MEMS元件的间隔件上并且覆盖MEMS元件，使得密封构件密封 将MEMS元件从外部环境密封。

公开(公告)号：US07443024B2

公开(公告)日：2008-10-28

申请号：US11180302

申请日：2005-07-12

Applicant: Suk Kee Hong ,  Dong Hyun Park ,  Yeong Gyu Lee

Inventor： Suk Kee Hong ,  Dong Hyun Park ,  Yeong Gyu Lee

IPC: H01L23/10

CPC classification number: B81C1/00293 ,  B81B2203/0384 ,  B81C2203/019 ,  H01L24/81

Abstract: A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment. The MEMS package includes a base substrate, with an MEMS element provided on a surface of the base substrate; a lid glass joined to the base substrate such that the lid glass covers the MEMS element and transmits incident light; a dam sealing member provided on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment; and a second sealing member deposited on an upper surface of the dam sealing member such that the second sealing member is provided on the surface of the base substrate and the side surface of the lid glass, thus secondarily hermetically sealing the MEMS element from the external environment.

Abstract translation: 公开了一种具有侧面双密封构件的微机电系统（MEMS）封装以及MEMS封装的制造方法。 MEMS封装通过图案化在基底基板上形成金属层而形成，使得金属层围绕设置在基底基板上的MEMS元件，将盖玻璃接合到金属层，并在其上提供侧面双重密封构件 基底基板的表面和盖玻璃的侧表面，从而将MEMS元件从外部环境气密地密封。 MEMS封装包括基底基板，其中MEMS元件设置在基底基板的表面上; 连接到基底基板上的盖玻璃使得盖玻璃覆盖MEMS元件并透射入射光; 设置在基底基板的表面和盖玻璃的侧面的坝密封构件，从而将MEMS元件从外部环境气密地密封; 以及第二密封构件，其沉积在所述坝密封构件的上表面上，使得所述第二密封构件设置在所述基底基板的表面和所述盖玻璃的侧表面上，从而二次将所述MEMS元件与所述外部环境密封 。