公开(公告)号：US07443024B2

公开(公告)日：2008-10-28

申请号：US11180302

申请日：2005-07-12

申请人： Suk Kee Hong ,  Dong Hyun Park ,  Yeong Gyu Lee

发明人： Suk Kee Hong ,  Dong Hyun Park ,  Yeong Gyu Lee

IPC分类号： H01L23/10

CPC分类号： B81C1/00293 ,  B81B2203/0384 ,  B81C2203/019 ,  H01L24/81

摘要： A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment. The MEMS package includes a base substrate, with an MEMS element provided on a surface of the base substrate; a lid glass joined to the base substrate such that the lid glass covers the MEMS element and transmits incident light; a dam sealing member provided on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment; and a second sealing member deposited on an upper surface of the dam sealing member such that the second sealing member is provided on the surface of the base substrate and the side surface of the lid glass, thus secondarily hermetically sealing the MEMS element from the external environment.

摘要翻译： 公开了一种具有侧面双密封构件的微机电系统（MEMS）封装以及MEMS封装的制造方法。 MEMS封装通过图案化在基底基板上形成金属层而形成，使得金属层围绕设置在基底基板上的MEMS元件，将盖玻璃接合到金属层，并在其上提供侧面双重密封构件 基底基板的表面和盖玻璃的侧表面，从而将MEMS元件从外部环境气密地密封。 MEMS封装包括基底基板，其中MEMS元件设置在基底基板的表面上; 连接到基底基板上的盖玻璃使得盖玻璃覆盖MEMS元件并透射入射光; 设置在基底基板的表面和盖玻璃的侧面的坝密封构件，从而将MEMS元件从外部环境气密地密封; 以及第二密封构件，其沉积在所述坝密封构件的上表面上，使得所述第二密封构件设置在所述基底基板的表面和所述盖玻璃的侧表面上，从而二次将所述MEMS元件与所述外部环境密封 。

公开(公告)号：US07394139B2

公开(公告)日：2008-07-01

申请号：US11347187

申请日：2006-02-03

申请人： Heung Woo Park ,  Yeong Gyu Lee ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

发明人： Heung Woo Park ,  Yeong Gyu Lee ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： G02B26/0833 ,  G03H2225/24 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00014

摘要： Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

摘要翻译： 本文公开了一种使用倒装芯片安装技术的光调制器模块封装，其中使用倒装芯片安装技术将光调制器装置气密地安装。 光调制器装置被保护免受外部环境的影响，容易将电信号传输到外部，并且希望保持光调制器件的光学特性。

公开(公告)号：US07388282B2

公开(公告)日：2008-06-17

申请号：US11180979

申请日：2005-07-12

申请人： Yeong Gyu Lee ,  Suk Kee Hong

发明人： Yeong Gyu Lee ,  Suk Kee Hong

IPC分类号： H01L32/02

CPC分类号： B81C1/00269 ,  B81C2203/019 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.

摘要翻译： 公开了一种具有疏水层的微机电系统（MEMS）封装。 MEMS封装包括：基底基板，其具有设置在基底基板的表面上的MEMS元件; 与设置在基底基板上并覆盖MEMS元件的MEMS元件间隔开的盖; 侧密封构件，设置在基底基板的侧面和盖的表面上，从而将MEMS元件从外部环境密封; 以及覆盖侧面密封构件暴露于外部环境的部分的疏水层，从而从侧面密封构件除去亲水性。

公开(公告)号：US20060078247A1

公开(公告)日：2006-04-13

申请号：US11244563

申请日：2005-10-06

申请人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Heung Woo Park ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

发明人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Heung Woo Park ,  Suk Kee Hong ,  Chang Su Park ,  Ohk Kun Lim

IPC分类号： G02B6/12

CPC分类号： G02B6/4232

摘要： Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.

摘要翻译： 这里公开了一种用于光学调制器的封装结构，其被配置为使得光学调制装置和电子控制电路并入模块中，从而允许制造紧凑的模块，同时保持光学调制装置的光学特性。

公开(公告)号：US06915033B2

公开(公告)日：2005-07-05

申请号：US10689632

申请日：2003-10-22

申请人： Suk Kee Hong ,  Yeong Gyu Lee

发明人： Suk Kee Hong ,  Yeong Gyu Lee

IPC分类号： G02B6/32 ,  G02B6/35 ,  G02B26/08 ,  G02B6/26

CPC分类号： G02B6/3514 ,  G02B6/3548 ,  G02B6/3564

摘要： Disclosed are a multi-channel optical switch and a method for manufacturing the same. The multi-channel optical switch includes a supporter; an input terminal optical fiber fixed to the supporter for inputting an optical signal to be switched therethrough; multiple output terminal optical fibers fixed to the supporter for outputting the optical signal inputted through the input terminal optical fiber therethrough; multiple micro mirrors for reflecting the optical signal inputted through the input terminal optical fiber and then for directing the optical signal to a designated output terminal optical fiber among the multiple output terminal optical fibers; and multiple actuators respectively connected to the micro mirrors for adjusting the positions of the micro mirrors so that the optical signal is reflected by the micro mirrors.

摘要翻译： 公开了一种多通道光开关及其制造方法。 多通道光开关包括支架; 一个输入端子光纤，固定在支架上，用于输入要切换的光信号; 多个输出端子光纤固定到支撑件，用于输出通过输入端子光纤输入的光信号; 多个微镜，用于反射通过输入端子光纤输入的光信号，然后用于将光信号引导到多个输出端光纤之间的指定输出端光纤; 以及分别连接到微镜的多个致动器，用于调整微反射镜的位置，使得光信号被微镜反射。

公开(公告)号：US07343072B2

公开(公告)日：2008-03-11

申请号：US11244769

申请日：2005-10-06

申请人： Yeong Gyu Lee ,  Dong Ho Shin ,  Heung Woo Park ,  Jun Won An ,  Yurlov Victor

发明人： Yeong Gyu Lee ,  Dong Ho Shin ,  Heung Woo Park ,  Jun Won An ,  Yurlov Victor

IPC分类号： G02B6/32 ,  G02B6/26

CPC分类号： G02B26/0858 ,  G02B26/0808

摘要： Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array.

摘要翻译： 本文公开了一种光调制器封装，其具有制造或定位的倾斜透光盖，使得透光盖的表面相对于光调制阵列的反射表面倾斜。

公开(公告)号：US20120266673A1

公开(公告)日：2012-10-25

申请号：US13185660

申请日：2011-07-19

申请人： Hyun Kee Lee ,  Heung Woo Park ,  Nam Su Park ,  Yeong Gyu Lee ,  Sung Min Cho

发明人： Hyun Kee Lee ,  Heung Woo Park ,  Nam Su Park ,  Yeong Gyu Lee ,  Sung Min Cho

IPC分类号： G01P15/08 ,  H01L21/02

CPC分类号： H01L21/50 ,  G01P15/0802 ,  G01P15/09

摘要： Disclosed herein is an inertial sensor. The inertial sensor includes a sensor unit including a flexible substrate part on which a driving electrode and a sensing electrode are formed, a mass displaceably mounted on the flexible substrate part, and a support body coupled with the flexible substrate part in order to support the mass in a floated state and made of silicon; and a lower cap covering a bottom portion of the mass and made of silicon, wherein the lower cap and the sensor unit are coupled by a silicon direct bonding method, whereby the inertial sensor and the method of manufacturing the same may be obtained to improve the convenience in manufacturing and the reliability of the sensor by bonding the sensor unit and the lower cap by the silicon direct bonding method.

摘要翻译： 这里公开了惯性传感器。 惯性传感器包括传感器单元，其包括形成有驱动电极和感测电极的柔性基板部分，可移动地安装在柔性基板部分上的质量以及与柔性基板部分连接以支撑质量的支撑体 处于漂浮状态，由硅制成; 以及覆盖所述物体的底部并由硅制成的下盖，其中所述下盖和所述传感器单元通过硅直接粘合方法联接，由此可以获得惯性传感器及其制造方法，以改善 通过硅直接粘合法粘合传感器单元和下盖，便于制造和传感器的可靠性。

公开(公告)号：US07116456B2

公开(公告)日：2006-10-03

申请号：US11111457

申请日：2005-04-20

申请人： Young Nam Hwang ,  Yeong Gyu Lee ,  Ohk Kun Lim

发明人： Young Nam Hwang ,  Yeong Gyu Lee ,  Ohk Kun Lim

IPC分类号： G02B26/08

CPC分类号： G02B26/0808

摘要： Disclosed herein is a light modulator module package, which is advantageous because a size of the module package is minimized and heat is efficiently dispersed while the optical properties of a light modulator device are maintained.

摘要翻译： 这里公开了一种光调制器模块封装，这是有利的，因为模块封装的尺寸被最小化，并且在保持光调制器装置的光学特性的同时有效地分散热。

公开(公告)号：US08505190B2

公开(公告)日：2013-08-13

申请号：US13180289

申请日：2011-07-11

申请人： Hyun Kee Lee ,  Tae Joon Park ,  Sang Kee Yoon ,  Hyung Jae Park ,  Yeong Gyu Lee ,  Heung Woo Park

发明人： Hyun Kee Lee ,  Tae Joon Park ,  Sang Kee Yoon ,  Hyung Jae Park ,  Yeong Gyu Lee ,  Heung Woo Park

IPC分类号： G01R3/00

CPC分类号： G01P15/08 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C2203/032 ,  G01C19/5663 ,  G01P15/0802 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49124

摘要： Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

摘要翻译： 本文公开了一种制造惯性传感器的方法。 制造惯性传感器100的方法包括（A）将聚合物120施加到基底基材110上，（B）图案化聚合物120以在聚合物120中形成开口部分125，（C）通过 通过在厚度方向上的蚀刻工艺在开口部分125上暴露的基底基板110上形成空腔115，以及（D）通过使用聚合物120将盖130连接到器件基板140，由此将聚合物120施加到 基底基板110处于恒定厚度D3，使得帽130可以通过使用聚合物120而容易地结合到装置基板140。

公开(公告)号：US07227267B2

公开(公告)日：2007-06-05

申请号：US11245413

申请日：2005-10-06

申请人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Sang Kyeong Yun ,  Heung Woo Park ,  Chang Su Park

发明人： Yeong Gyu Lee ,  Jong Hyeong Song ,  Sang Kyeong Yun ,  Heung Woo Park ,  Chang Su Park

IPC分类号： H01L23/48

CPC分类号： H05K3/323 ,  B81B2207/093 ,  B81C1/00301 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81855 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/321 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

摘要翻译： 公开了使用倒装芯片安装技术的半导体封装。 半导体封装包括：半导体器件，其设置有从半导体器件延伸的多个第一焊盘; 衬底，其设置有与所述半导体器件的所述第一焊盘的位置对准的位置处从所述衬底延伸的多个第二焊盘; 以及插入在所述多个第一焊盘和所述多个第二焊盘之间的各向异性导电材料，以将所述第一焊盘电连接到相关联的第二焊盘，所述各向异性导电材料定位在所述半导体器件周围的离散位置处，从而在 半导体器件和衬底。