公开(公告)号：US06711815B2

公开(公告)日：2004-03-30

申请号：US10225200

申请日：2002-08-22

申请人： Sumie Hirai ,  Jun Ohmori

发明人： Sumie Hirai ,  Jun Ohmori

IPC分类号： H01K310

CPC分类号： H05K3/242 ,  H01L23/13 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48599 ,  H01L2224/4917 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/0393 ,  H05K3/0044 ,  H05K2203/049 ,  H05K2203/1545 ,  H05K2203/175 ,  H01L2924/00

摘要： A printed wired board is provided, in which an area for extracting liens for plating of the printed wired board is made small and at the same time the number of the extracting lines for plating within a packaging area is made small, resulting in an improvement of wiring efficiency. The circuit pattern formed on an insulating film has window portion and is not formed toward the periphery of the insulating film, and a bonding pad is electroplated, where the bonding pads are to be connected with a center-pad of a semiconductor by a bonding wire through the window portion. Accordingly, even when the shrinkage of semiconductor packages or narrow ball pitch is forwarded, the degree of freedom of drawing of circuit pattern in the printed wired board can be made large.

摘要翻译： 提供了一种印刷线路板，其中用于提取印刷线路板的电镀用留置区域较小，同时使包装区域内的电镀提取线的数量减少，从而改善了 接线效率。 在绝缘膜上形成的电路图案具有窗口部分，并且不形成在绝缘膜的周围，并且电镀接合焊盘，其中接合焊盘将通过接合线与半导体的中心焊盘连接 通过窗口部分。 因此，即使当半导体封装的收缩或窄球节距被转移时，也可以使印刷线路板中的电路图形的自由度变大。

公开(公告)号：US06462283B1

公开(公告)日：2002-10-08

申请号：US09390024

申请日：1999-09-03

申请人： Sumie Hirai ,  Jun Ohmori

发明人： Sumie Hirai ,  Jun Ohmori

IPC分类号： H05K116

CPC分类号： H05K3/242 ,  H01L23/13 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48599 ,  H01L2224/4917 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/0393 ,  H05K3/0044 ,  H05K2203/049 ,  H05K2203/1545 ,  H05K2203/175 ,  H01L2924/00

摘要： A printed wired board is provided, in which an area for extracting lines for plating of the printed wired board is made small and at the same time the number of the extracting lines for plating within a packaging area is made small, resulting in an improvement of wiring efficiency. The circuit pattern formed on an insulating film has a window portion and is not formed toward the periphery of the insulating film, and a bonding pad is electroplated, where the bonding pads are to be connected with a center-pad of a semiconductor by a bonding wire through the window portion. Accordingly, even when the shrinkage of semiconductor packages or narrow ball pitch is forwarded, the degree of freedom of drawing of circuit pattern in the printed wired board can be made large.

摘要翻译： 提供一种印刷线路板，其中用于提取印刷线路板的电镀线的区域较小，同时使包装区域内的电镀提取线的数量变小，从而改善了 接线效率。 形成在绝缘膜上的电路图案具有窗口部分，并且不形成在绝缘膜的周围，并且电镀接合焊盘，其中接合焊盘将通过键合与半导体的中心焊盘连接 穿过窗户部分。 因此，即使当半导体封装的收缩或窄球节距被转移时，也可以使印刷线路板中的电路图形的自由度变大。