公开(公告)号：US20120018186A1

公开(公告)日：2012-01-26

申请号：US13177199

申请日：2011-07-06

申请人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

发明人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

IPC分类号： H05K5/02 ,  H01B13/00 ,  B32B37/00

CPC分类号： H05K3/0058 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/145 ,  B32B2037/1223 ,  B32B2038/0092 ,  B32B2309/105 ,  B32B2457/14 ,  H05K2201/0999 ,  H05K2201/10098

摘要： Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

摘要翻译： 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。

公开(公告)号：US08785792B2

公开(公告)日：2014-07-22

申请号：US13177199

申请日：2011-07-06

申请人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

发明人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

IPC分类号： H01L23/28

CPC分类号： H05K3/0058 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/145 ,  B32B2037/1223 ,  B32B2038/0092 ,  B32B2309/105 ,  B32B2457/14 ,  H05K2201/0999 ,  H05K2201/10098

摘要： Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

摘要翻译： 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。

公开(公告)号：US20110026233A1

公开(公告)日：2011-02-03

申请号：US12801829

申请日：2010-06-28

申请人： Soon Min Hong ,  Ja Myeong Koo ,  Young Jun Moon ,  Sun Gu Yi

发明人： Soon Min Hong ,  Ja Myeong Koo ,  Young Jun Moon ,  Sun Gu Yi

IPC分类号： H05K1/14 ,  H05K7/00 ,  G05G15/06 ,  H01B13/008

CPC分类号： H01B13/008 ,  H01B7/0838 ,  H05K1/0283 ,  H05K3/103 ,  H05K3/281 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/10287 ,  H05K2203/1545

摘要： Disclosed herein is an apparatus for manufacturing an elastic cable including conductor tracks arranged in a zigzag shape between elastic films. The apparatus may include a conductor track supplying unit to supply at least one conductor track, an aligning unit to align the at least one conductor track supplied from the conductor track supplying unit, a film supplying unit to supply elastic films such that the at least one conductor track is surrounded by the elastic films, and a thermal lamination roller unit to thermally laminate the at least one conductor track arranged between the elastic films, wherein the aligning unit is reciprocally movable to arrange the at least one conductor track in a zigzag shape between the elastic films when the at least one conductor track is supplied to the thermal lamination roller unit.

摘要翻译： 本文公开了一种用于制造弹性电缆的装置，其包括在弹性膜之间以锯齿形布置的导体轨道。 所述装置可以包括导体轨迹提供单元，用于提供至少一个导体轨道，对准单元以对准从导体轨道供应单元提供的至少一个导体轨道，薄膜供应单元供应弹性薄膜使得至少一个 导体轨道由弹性膜包围，并且热层压辊单元热排列布置在弹性膜之间的至少一个导体轨迹，其中对准单元是可往复移动的，以将至少一个导体轨道布置成Z字形， 当至少一个导体轨道被提供给热层压辊单元时的弹性膜。