公开(公告)号：US11981114B2

公开(公告)日：2024-05-14

申请号：US18025705

申请日：2021-07-09

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Masao Uesaka

IPC: B32B3/12 ,  B29C37/00 ,  B32B5/02 ,  B32B5/26 ,  B32B7/12 ,  B32B27/12 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12

CPC classification number: B32B37/1207 ,  B29C37/0075 ,  B32B3/12 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/12 ,  B32B27/12 ,  B32B27/302 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2037/1223 ,  B32B2250/05 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2305/024 ,  B32B2305/188 ,  B32B2307/54 ,  B32B2307/7376 ,  B32B2307/748 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2323/10 ,  B32B2355/00 ,  B32B2367/00 ,  B32B2377/00 ,  B32B2605/18 ,  B32B2607/00

Abstract: A method of manufacturing a sandwich panel (100) includes: a step of preparing a plurality of sheet-like prepregs (211); a step of performing a first heating and pressurization process through a release film (25) on upper and lower surfaces of a laminate where the plurality of prepregs (211) are laminated such that the laminate is integrated to obtain a composite facing material (40); and a step of disposing the composite facing material (40) on each of an upper surface side and a lower surface side of a sheet-like core layer (10) having a honeycomb structure and integrating the laminate through a second heating and pressurization process, in which a pressure of the first heating and pressurization process is higher than or equal to a pressure of the second heating and pressurization process.

公开(公告)号：US11840048B2

公开(公告)日：2023-12-12

申请号：US17932803

申请日：2022-09-16

Applicant: AGC Inc.

Inventor： Kosuke Takada

IPC: B32B17/10 ,  B32B7/12 ,  B32B37/12

CPC classification number: B32B17/10018 ,  B32B7/12 ,  B32B17/10779 ,  B32B17/10798 ,  B32B2037/1223 ,  B32B2250/03 ,  B32B2309/02 ,  B32B2309/105

Abstract: A laminated body includes a glass substrate, an adhesion layer, and a resin layer in this order. The adhesion layer includes a side-contact portion. The side-contact portion is located outside an outer edge of the resin layer in a part of an entire circumferential of the outer edge when observing the laminated body from a normal direction of a surface of the glass substrate, and is in contact with at least a part of a side surface of the resin layer.

公开(公告)号：US11752747B2

公开(公告)日：2023-09-12

申请号：US18068577

申请日：2022-12-20

Applicant: DIC Corporation

Inventor： Daiki Tomiya ,  Yuki Kaburagi ,  Takashi Moriya

IPC: B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B37/12

CPC classification number: B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B37/1207 ,  B32B2037/1223 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2274/00 ,  B32B2307/31 ,  B32B2307/702 ,  B32B2323/00

Abstract: A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).

公开(公告)号：US20230234346A1

公开(公告)日：2023-07-27

申请号：US18068577

申请日：2022-12-20

Applicant: DIC Corporation

Inventor： Daiki Tomiya ,  Yuki Kaburagi ,  Takashi Moriya

IPC: B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B37/12

CPC classification number: B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B37/1207 ,  B32B2274/00 ,  B32B2037/1223 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2307/702 ,  B32B2307/31 ,  B32B2323/00

Abstract: A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).

公开(公告)号：US20180273798A1

公开(公告)日：2018-09-27

申请号：US15996713

申请日：2018-06-04

Applicant: Kaneka Corporation ,  Japan Aerospace Exploration Agency

Inventor： Masahiko Miyauchi ,  Yuichi Ishida ,  Toshio Ogasawara ,  Rikio Yokota

IPC: C09D179/08 ,  C08L79/08 ,  B29C39/38 ,  B32B5/26 ,  B32B37/12 ,  B32B38/00 ,  C08G73/10 ,  C08J5/18 ,  C08J5/24 ,  B29C39/02 ,  B29L7/00 ,  B29K79/00

CPC classification number: C09D179/08 ,  B29C39/02 ,  B29C39/38 ,  B29K2079/08 ,  B29L2007/008 ,  B32B5/26 ,  B32B37/1207 ,  B32B38/004 ,  B32B2037/1223 ,  B32B2037/1238 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/105 ,  B32B2307/306 ,  B32B2307/51 ,  B32B2307/54 ,  B32B2313/04 ,  B32B2379/08 ,  B32B2605/18 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/1053 ,  C08G73/1071 ,  C08J5/18 ,  C08J5/24 ,  C08J2379/08 ,  C08L79/08 ,  C08L2205/025

Abstract: An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R1 or R2 shows a phenyl group and the other shows a hydrogen atom; R3 and R4 show a divalent residue of aromatic diamine; R5 and R6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m≥1, n≥0, 1≤m+n≤20, and 0.05≤m/(m+n)≤1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R1 and R2 show a divalent residue of aromatic diamine; R3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m≥1 and n≥0, and an arrangement of repeating units may be either a block or random.)

公开(公告)号：US20180250915A1

公开(公告)日：2018-09-06

申请号：US15758146

申请日：2015-11-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： KUAN-TING WU ,  CHIEN-LUNG YANG ,  CHENG-FENG LIAO

IPC: B32B15/088 ,  B21D26/021 ,  B21D26/055 ,  B21D26/059 ,  B29C70/86 ,  B32B1/02 ,  B32B15/082 ,  B32B15/09 ,  B32B15/14 ,  B32B15/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B3/28 ,  B32B7/12 ,  B32B37/10

CPC classification number: B32B15/088 ,  B21D26/021 ,  B21D26/055 ,  B21D26/059 ,  B29C70/088 ,  B29C70/86 ,  B29K2705/00 ,  B32B1/02 ,  B32B3/28 ,  B32B7/12 ,  B32B15/08 ,  B32B15/082 ,  B32B15/09 ,  B32B15/14 ,  B32B15/20 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/308 ,  B32B27/34 ,  B32B27/365 ,  B32B37/10 ,  B32B37/12 ,  B32B38/1866 ,  B32B2037/1223 ,  B32B2250/02 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2305/22 ,  B32B2307/50 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/18 ,  B32B2311/24 ,  B32B2313/04

Abstract: Examples of forming metal composites are described herein. In an example, a metal sheet is formed into a predetermined shape using superplastic thermal forming technique. Further, a carbon fiber-reinforced polymer sheet is shaped into the predetermined shape by thermal forming. The metal sheet and the carbon fiber-reinforced polymer sheet are coupled by applying an adhesive between the metal sheet and the carbon fiber-reinforced polymer sheet, to form a metal composite.

公开(公告)号：US09957420B2

公开(公告)日：2018-05-01

申请号：US14270656

申请日：2014-05-06

Applicant: Henkel AG & Co. KGaA

Inventor： Thomas Morgeneyer ,  Lutz Pielert ,  Juergen Lotz

IPC: B32B37/12 ,  C09J7/02 ,  B32B7/12 ,  B32B21/04 ,  B32B21/06 ,  B32B21/08 ,  B32B21/13 ,  C09J175/08

CPC classification number: C09J7/35 ,  B32B7/12 ,  B32B21/04 ,  B32B21/06 ,  B32B21/08 ,  B32B21/13 ,  B32B37/1207 ,  B32B2037/1223 ,  B32B2255/08 ,  B32B2255/26 ,  B32B2255/28 ,  C09J175/08 ,  Y10T428/2809

Abstract: Composite of shaped bodies made from wooden materials with film-shaped substrates, wherein a surface of the shaped body has a first layer comprising a crosslinked radiation-curing hot-melt adhesive, said layer is covered with a second adhesive layer of a hot-melt adhesive, and said second adhesive layer is adhesively bonded to a film-shaped substrate. A method for producing composite shaped bodies of this type is provided, in which method, as one step, the surface is coated with a UV-crosslinkable hot-melt adhesive, and which method makes in-line production of the composite bodies possible.

公开(公告)号：US09878526B2

公开(公告)日：2018-01-30

申请号：US15355370

申请日：2016-11-18

Applicant: GLOBAL IP HOLDINGS, LLC

Inventor： Darius J. Preisler ,  Christopher A. Heikkila

IPC: B32B37/04 ,  B32B7/12 ,  B32B3/12 ,  B32B5/02 ,  B32B27/06 ,  B32B27/08 ,  B32B27/12 ,  B29C51/14 ,  B29C51/42 ,  B29C51/46 ,  B32B27/32 ,  B32B37/14 ,  B29C59/00 ,  C09J5/00 ,  B32B38/00 ,  B29L31/22 ,  B29K23/00 ,  B29K105/04 ,  B29K105/00 ,  B29C53/06 ,  B32B37/12

CPC classification number: B32B37/04 ,  B29C51/145 ,  B29C51/421 ,  B29C51/46 ,  B29C53/06 ,  B29C59/007 ,  B29K2023/12 ,  B29K2105/04 ,  B29K2105/256 ,  B29L2031/22 ,  B32B3/12 ,  B32B5/024 ,  B32B7/12 ,  B32B27/065 ,  B32B27/08 ,  B32B27/12 ,  B32B27/32 ,  B32B37/146 ,  B32B2037/1223 ,  B32B2038/0024 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2262/0253 ,  B32B2266/0214 ,  B32B2266/0292 ,  B32B2274/00 ,  B32B2317/18 ,  B32B2323/10 ,  B32B2323/16 ,  B32B2398/20 ,  B32B2471/02 ,  B32B2605/003 ,  C09J5/00 ,  Y10T156/10 ,  Y10T156/1007 ,  Y10T428/23979 ,  Y10T428/24149 ,  Y10T428/24504

Abstract: A method of making a sandwich-type composite panel having a cellulose-based core and a living hinge from a stack of material is provided. The stack includes first and second reinforced thermoplastic skins, first and second sheets of thermoplastic adhesive and a cellulose-based cellular core disposed between the sheets and the skins. A pressure is applied to the stack after heating the stack wherein the skins are bonded to the core by the sheets to form the composite panel. A portion of the composite panel is crushed at a predetermined location simultaneously with applying the pressure to locally compact and separate the cellular core at the predetermined location to form two side portions of the panel. The heated first skin stretches during the step of crushing while remaining intact between the two side portions. The skins bond together at the predetermined location to form the living hinge.

公开(公告)号：US09870938B2

公开(公告)日：2018-01-16

申请号：US14510491

申请日：2014-10-09

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Akira Tamenori

IPC: H01L21/683 ,  H01L21/304 ,  B32B37/06 ,  B32B37/12 ,  B32B38/00 ,  B32B38/18 ,  H01L21/78

CPC classification number: H01L21/6836 ,  B32B37/06 ,  B32B37/1207 ,  B32B38/0012 ,  B32B38/18 ,  B32B2037/1223 ,  B32B2038/0016 ,  B32B2038/0028 ,  B32B2307/202 ,  B32B2405/00 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/6838 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  Y10T156/1028

Abstract: A semiconductor element producing method is disclosed. In the method, a surface protective tape including a base layer and an adhesive layer (including an intermediate layer) is attached to the front surface of a wafer that has unevenness caused by a polyimide passivation. The wafer is placed on a stage, with the surface protective tape facing the stage. The surface protective tape is heated while being drawn to the stage to flatten the surface of the surface protective tape. A grinding process is performed on the rear surface of the wafer to reduce the thickness of the wafer. A rear surface element structure is formed on the rear surface of the wafer, and the wafer is diced into chips.

公开(公告)号：US09855731B2

公开(公告)日：2018-01-02

申请号：US14070182

申请日：2013-11-01

Applicant: 3Form, LLC

Inventor： Matthew T. Sutton ,  John E. C. Willham

IPC: B32B37/06 ,  B32B27/08 ,  B32B7/12 ,  B32B27/30 ,  B32B27/36 ,  B32B27/40 ,  B32B27/18 ,  B32B37/18 ,  B32B37/10 ,  B32B37/12

CPC classification number: B32B37/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B37/1009 ,  B32B37/182 ,  B32B2037/1223 ,  B32B2250/40 ,  B32B2307/4023 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2307/75 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2451/00 ,  B32B2607/00 ,  Y10T156/10 ,  Y10T428/24868

Abstract: Implementations of the present invention relate to systems, methods, and apparatus for manufacturing aesthetically pleasing, decorative architectural resin panels having high-resolution image layers. In particular, at least one implementation includes a laminated resin panel having a decorative image layer formed from layered or cross-linked ink free from cracks, splits, or other deformation. Additional implementations relate to curved or otherwise non-planar decorative architectural resin panels having high-resolution image layers.