公开(公告)号：US20120018186A1

公开(公告)日：2012-01-26

申请号：US13177199

申请日：2011-07-06

申请人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

发明人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

IPC分类号： H05K5/02 ,  H01B13/00 ,  B32B37/00

CPC分类号： H05K3/0058 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/145 ,  B32B2037/1223 ,  B32B2038/0092 ,  B32B2309/105 ,  B32B2457/14 ,  H05K2201/0999 ,  H05K2201/10098

摘要： Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

摘要翻译： 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。

公开(公告)号：US08785792B2

公开(公告)日：2014-07-22

申请号：US13177199

申请日：2011-07-06

申请人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

发明人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

IPC分类号： H01L23/28

CPC分类号： H05K3/0058 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/145 ,  B32B2037/1223 ,  B32B2038/0092 ,  B32B2309/105 ,  B32B2457/14 ,  H05K2201/0999 ,  H05K2201/10098

摘要： Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

摘要翻译： 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。

公开(公告)号：US20110026233A1

公开(公告)日：2011-02-03

申请号：US12801829

申请日：2010-06-28

申请人： Soon Min Hong ,  Ja Myeong Koo ,  Young Jun Moon ,  Sun Gu Yi

发明人： Soon Min Hong ,  Ja Myeong Koo ,  Young Jun Moon ,  Sun Gu Yi

IPC分类号： H05K1/14 ,  H05K7/00 ,  G05G15/06 ,  H01B13/008

CPC分类号： H01B13/008 ,  H01B7/0838 ,  H05K1/0283 ,  H05K3/103 ,  H05K3/281 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/10287 ,  H05K2203/1545

摘要： Disclosed herein is an apparatus for manufacturing an elastic cable including conductor tracks arranged in a zigzag shape between elastic films. The apparatus may include a conductor track supplying unit to supply at least one conductor track, an aligning unit to align the at least one conductor track supplied from the conductor track supplying unit, a film supplying unit to supply elastic films such that the at least one conductor track is surrounded by the elastic films, and a thermal lamination roller unit to thermally laminate the at least one conductor track arranged between the elastic films, wherein the aligning unit is reciprocally movable to arrange the at least one conductor track in a zigzag shape between the elastic films when the at least one conductor track is supplied to the thermal lamination roller unit.

摘要翻译： 本文公开了一种用于制造弹性电缆的装置，其包括在弹性膜之间以锯齿形布置的导体轨道。 所述装置可以包括导体轨迹提供单元，用于提供至少一个导体轨道，对准单元以对准从导体轨道供应单元提供的至少一个导体轨道，薄膜供应单元供应弹性薄膜使得至少一个 导体轨道由弹性膜包围，并且热层压辊单元热排列布置在弹性膜之间的至少一个导体轨迹，其中对准单元是可往复移动的，以将至少一个导体轨道布置成Z字形， 当至少一个导体轨道被提供给热层压辊单元时的弹性膜。

公开(公告)号：US20090139758A1

公开(公告)日：2009-06-04

申请号：US12155401

申请日：2008-06-03

申请人： Hyo Young Shin ,  Seung Boo Jung ,  Young Jun Moon ,  Soon Min Hong ,  Chang Yong Lee ,  Ja Myeong Koo ,  Hyun Tae Kim ,  Jong Bum Lee ,  Hyun Joo Han

发明人： Hyo Young Shin ,  Seung Boo Jung ,  Young Jun Moon ,  Soon Min Hong ,  Chang Yong Lee ,  Ja Myeong Koo ,  Hyun Tae Kim ,  Jong Bum Lee ,  Hyun Joo Han

IPC分类号： H05K3/36 ,  H01R12/04

CPC分类号： H05K3/361 ,  H05K3/328 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/09881 ,  H05K2201/0989 ,  H05K2203/0285 ,  H05K2203/167 ,  Y10T29/49126

摘要： A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.

摘要翻译： 公开了一种印刷电路板（PCB）组件，其包括第一PCB，多个第一电极端子彼此间隔布置在该第一PCB上; 分别与第一电极端子分别连接的多个第二电极端子彼此间隔布置的第二PCB; 以及防止第一和第二电极端子在第一和第二电极端子彼此超声波焊接时偏离其正确位置的防分离部件。 因此，由于分离防止部件，第一和第二PCB的相对于彼此的横向运动受到限制，所以多个第一电极端子和第二电极端子可以彼此接合而不偏离其正确的位置。

公开(公告)号：US08624124B2

公开(公告)日：2014-01-07

申请号：US13078131

申请日：2011-04-01

申请人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

发明人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

IPC分类号： H05K1/02 ,  H01B7/08

CPC分类号： H05K1/0283 ,  H01B7/06 ,  H05K1/0218 ,  H05K1/0219 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/09681

摘要： According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.

摘要翻译： 根据示例性实施例，多层可拉伸电缆包括多层可拉伸膜和可拉伸膜中的多条导电线。 导电线在可拉伸膜的厚度方向上的多层可拉伸膜的至少两个不同层中，至少一根导线是信号线，并且与信号线相邻的层中的至少一个其它导电线为 接地线。 信号线和接地线是锯齿形图案，并且平行于多层可拉伸膜的宽度方向。

公开(公告)号：US20110272181A1

公开(公告)日：2011-11-10

申请号：US13078131

申请日：2011-04-01

申请人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

发明人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

IPC分类号： H05K1/02

CPC分类号： H05K1/0283 ,  H01B7/06 ,  H05K1/0218 ,  H05K1/0219 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/09681

摘要： According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.

摘要翻译： 根据示例性实施例，多层可拉伸电缆包括多层可拉伸膜和可拉伸膜中的多条导电线。 导电线在可拉伸膜的厚度方向上的多层可拉伸膜的至少两个不同层中，至少一根导线是信号线，并且与信号线相邻的层中的至少一个其它导电线为 接地线。 信号线和接地线是锯齿形图案，并且平行于多层可拉伸膜的宽度方向。

公开(公告)号：US20100248505A1

公开(公告)日：2010-09-30

申请号：US12659607

申请日：2010-03-15

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

IPC分类号： H01R12/02 ,  H05K3/30

CPC分类号： H01R13/6658 ,  H01R43/24 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/10189 ,  H05K2203/0228 ,  Y10T29/417 ,  Y10T29/4913

摘要： Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.

摘要翻译： 这里公开了一种印刷电路板及其连接方法。 电路板组件的连接方法可以包括通过向印刷电路板组件施加树脂来模制印刷电路板组件，通过部分去除模制的印刷电路板来暴露安装在印刷电路板上的连接器的电极端子的端部 并且将连接构件连接到连接器的电极端子的暴露端。 因此，即使整个印刷电路板组件被模制，连接构件也可以自由地连接到印刷电路板组件的连接器。

公开(公告)号：US20120043116A1

公开(公告)日：2012-02-23

申请号：US13211596

申请日：2011-08-17

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H01L23/49833 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/19107

摘要： Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB.

摘要翻译： 这里公开了由诸如硅，玻璃或陶瓷的脆性材料制成的印刷电路板组件，并且设置有将其与外部连接构件电连接的连接器，以及用于模制印刷电路板组件的方法，其中印刷电路板 通过向其上施加聚合物树脂来模塑组装以赋予印刷电路板组件的硬度，并且将其连接到外部连接构件的电极端子暴露于外部。 这里公开的是内插器的互连结构，通过焊接点电连接到主印刷电路板（PCB）的互连结构插入在插入件和焊点之间，以防止或减少焊点上的应力集中，引起 通过插入器和主PCB之间的系数热膨胀差异。

公开(公告)号：US09197026B2

公开(公告)日：2015-11-24

申请号：US13211652

申请日：2011-08-17

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

IPC分类号： H01R43/00 ,  H05K13/00 ,  H01R43/24

CPC分类号： H01R43/24 ,  Y10T29/49147

摘要： Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.

摘要翻译： 公开了一种印刷电路板组件PBA，其上安装有用于与外部连接元件电连接的连接器。 这种组件可以用PBA的模制方法形成，其包括将聚合物树脂施加到PBA以模制PBA以便提供刚度。 根据本公开的上述PBA成型方法是包括PCB和连接在PCB上以将其与外部连接元件电连接的连接器的PBA的成型方法。 该方法包括将连接器与连接器盖组合，将树脂施加到与连接器盖结合的PBA上，以执行PBA的成型，以及将连接器盖与模制的PBA分离，以露出用于外部连接元件的电极端子。

公开(公告)号：US08971047B2

公开(公告)日：2015-03-03

申请号：US13610145

申请日：2012-09-11

申请人： Yong Won Lee ,  Tae Sang Park ,  Hyo Young Shin ,  Ji Young Jang ,  Young Jun Moon ,  Soon Min Hong

发明人： Yong Won Lee ,  Tae Sang Park ,  Hyo Young Shin ,  Ji Young Jang ,  Young Jun Moon ,  Soon Min Hong

IPC分类号： H05K1/00 ,  H05K1/14 ,  H05K3/28 ,  H05K3/36 ,  H05K5/06 ,  H05K1/18 ,  H05K3/32

CPC分类号： H05K1/147 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/148 ,  H05K1/189 ,  H05K3/284 ,  H05K3/323 ,  H05K3/361 ,  H05K5/065 ,  H05K2201/055 ,  H05K2203/1316 ,  H01L2924/00012

摘要： A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.

摘要翻译： 一种印刷电路板组件，其能够通过使用晶片本身作为印刷电路板而具有安装在晶片级的电子部件，所述印刷电路板组件包括多个电子部件，安装有多个电子部件的印刷电路板 其上配置有完全覆盖印刷电路板的保护体，以及连接单元，该连接单元的一端暴露于用于印刷电路板的保护体的外部，以与电路板电连接，其中印刷电路板 包括形成有晶片的晶片印刷电路板。