公开(公告)号：US20080211083A1

公开(公告)日：2008-09-04

申请号：US12007590

申请日：2008-01-11

申请人： Joon-Seok Kang ,  Sung Yi ,  Jae-Cheon Doh ,  Suk-Youn Hong ,  Sun-Kyong Kim ,  Jong-Hwan Baek

发明人： Joon-Seok Kang ,  Sung Yi ,  Jae-Cheon Doh ,  Suk-Youn Hong ,  Sun-Kyong Kim ,  Jong-Hwan Baek

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L24/19 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/28 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/83101 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package and a manufacturing method thereof are disclosed. The electronic package manufacturing method, which includes providing a printed circuit board (PCB) having one surface on which a first chip is mounted; attaching one surface of a second chip on the other surface of the PCB, a pad being formed in the other surface of the second chip; encapsulating the second chip by coating the other surface of the PCB with an insulation material; and processing a first via by punching a hole on the insulation material, the first via being electrically interconnected to the pad, can perform stable handling in a process of mounting a semiconductor chip, make it unnecessary to add a process for chip encapsulation and realize a system in package having high density and high reliability.

摘要翻译： 公开了电子封装及其制造方法。 电子封装制造方法，其包括提供具有一个表面的印刷电路板（PCB），其上安装有第一芯片; 将第二芯片的一个表面附接在所述PCB的另一个表面上，衬垫形成在所述第二芯片的另一个表面中; 通过用绝缘材料涂覆PCB的另一表面来封装第二芯片; 并且通过冲压绝缘材料上的孔来处理第一通孔，第一通孔电连接到焊盘，可以在安装半导体芯片的过程中执行稳定的处理，使得不需要添加用于芯片封装的工艺，并实现 封装体系密度高，可靠性高。

公开(公告)号：US20130050690A1

公开(公告)日：2013-02-28

申请号：US13566537

申请日：2012-08-03

申请人： Sang Yong YU ,  Eun Hee Bong ,  Seok Kim ,  Sun Kyong Kim ,  Jae Youn Jeong

发明人： Sang Yong YU ,  Eun Hee Bong ,  Seok Kim ,  Sun Kyong Kim ,  Jae Youn Jeong

IPC分类号： G01J1/10

CPC分类号： G01J1/08 ,  G01J1/0266 ,  G01J2001/4247

摘要： Disclosed herein is a calibration device for a light measuring equipment, the calibration device including: a standard illuminant emitting light for calibration; and a universal jig fixing target light measuring equipments to be calibrated having various sizes and moving in a direction in parallel with an optical axis of the standard illuminant. Therefore, it is possible to use both of a method of performing calibration by changing a distance between the standard illuminant and the target light measuring equipment to be calibrated and a method of performing calibration by changing a current applied to the standard illuminant. In addition, it is possible to perform calibration for the light measuring equipment having a plurality of sensors and to significantly improve accuracy of calibration.

摘要翻译： 本文公开了一种用于光测量设备的校准装置，所述校准装置包括：发射用于校准的光的标准光源; 以及具有各种尺寸的待校准的目标光测量设备的通用夹具，并且在与标准光源的光轴平行的方向上移动。 因此，可以使用通过改变标准光源与要校准的目标光测量设备之间的距离来执行校准的方法和通过改变施加到标准光源的电流来执行校准的方法。 此外，可以对具有多个传感器的光测量设备进行校准，并且显着提高校准精度。

公开(公告)号：US08779580B2

公开(公告)日：2014-07-15

申请号：US12010321

申请日：2008-01-23

申请人： Joon-Seok Kang ,  Sung Yi ,  Jae-Cheon Doh ,  Do-Jae Yoo ,  Sun-Kyong Kim ,  Jong-Hwan Baek

发明人： Joon-Seok Kang ,  Sung Yi ,  Jae-Cheon Doh ,  Do-Jae Yoo ,  Sun-Kyong Kim ,  Jong-Hwan Baek

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H05K1/0203 ,  H01L21/50 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K2201/066 ,  Y10T29/49146

摘要： An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side.

摘要翻译： 公开了一种电子部件封装及其制造方法。 电子部件封装制造方法，其包括将电子部件安装在第一绝缘层的一个表面中; 将散热器与对应于电子部件的第一绝缘层的一个表面接合以覆盖电子部件，散热器形成有空腔; 用粘合剂填充空腔; 并且在第一绝缘层的另一个表面上形成电路图案，可以防止在粘合剂中产生空隙，使得处理稳定并且通过使形成有空腔的散热器覆盖电子元件的尺寸变小， 图案积聚并通过腔的一侧供应粘合剂，同时通过另一侧提供负压。

公开(公告)号：US20080212288A1

公开(公告)日：2008-09-04

申请号：US12010321

申请日：2008-01-23

申请人： Joon-Seok Kang ,  Sung Yi ,  Jae-Cheon Doh ,  Do-Jae Yoo ,  Sun-Kyong Kim ,  Jong-Hwan Baek

发明人： Joon-Seok Kang ,  Sung Yi ,  Jae-Cheon Doh ,  Do-Jae Yoo ,  Sun-Kyong Kim ,  Jong-Hwan Baek

IPC分类号： H05K7/20 ,  H05K3/10

CPC分类号： H05K1/0203 ,  H01L21/50 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K2201/066 ,  Y10T29/49146

摘要： An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side.

摘要翻译： 公开了一种电子部件封装及其制造方法。 电子部件封装制造方法，其包括将电子部件安装在第一绝缘层的一个表面中; 将散热器与对应于电子部件的第一绝缘层的一个表面接合以覆盖电子部件，散热器形成有空腔; 用粘合剂填充空腔; 并且在第一绝缘层的另一个表面上形成电路图案，可以防止在粘合剂中产生空隙，使得处理稳定并且通过使形成有空腔的散热器覆盖电子元件的尺寸变小， 图案积聚并通过腔的一侧供应粘合剂，同时通过另一侧提供负压。