公开(公告)号：US20130005089A1

公开(公告)日：2013-01-03

申请号：US13607393

申请日：2012-09-07

Applicant: Joon Seok KANG ,  Sung YI ,  Young Do KWEON

Inventor： Joon Seok KANG ,  Sung YI ,  Young Do KWEON

IPC: H01L21/78

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/4334 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01073 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Disclosed herein are a wafer level package for heat dissipation and a method of manufacturing the same. The wafer level package includes a heat dissipation plate including a cavity and a hole, a die including a pad disposed in the cavity of the heat dissipation plate in a face-up manner, a thermal conductive adhesive disposed between the die and an inner wall of the cavity and disposed in the hole, and a redistribution layer connected at one end to the pad and at the other end extended. The wafer level package protects the die from external environments and enables the die to be easily flush with the heat dissipation plate.

Abstract translation: 这里公开了用于散热的晶片级封装及其制造方法。 晶片级封装包括包括空腔和孔的散热板，包括以面朝上的方式设置在散热板的空腔中的焊盘的模具，设置在模具和内壁之间的导热粘合剂 空腔并设置在孔中，并且再分配层在一端连接到垫并且在另一端延伸。 晶圆级封装保护模具免受外部环境的影响，使模具能够轻松地与散热板齐平。

公开(公告)号：US20120042513A1

公开(公告)日：2012-02-23

申请号：US13317730

申请日：2011-10-27

Applicant: Woon Chun KIM ,  Soon Gyu YIM ,  Joon Seok KANG

Inventor： Woon Chun KIM ,  Soon Gyu YIM ,  Joon Seok KANG

IPC: H05K3/30

CPC classification number: H05K1/0203 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/284 ,  H05K2201/1056 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component embedded printed circuit board including: mounting an electronic component on an insulating layer in a fluidal condition so that a part of the electronic component is inserted into the insulating layer and another part of the electronic component is protruded out of a top surface of the insulating layer by pressing the electronic component onto the insulating layer; fixing the electronic component by curing the insulating layer; forming a metallic seed layer on a top surface of the insulating layer including an exposed surface of the electronic component; forming a plating layer on the metallic seed layer; forming via-holes at positions on the insulating layer, which correspond to pads of the electronic component and forming circuit patterns electrically conducted with the pads; and forming a solder resist layer including the via-holes electrically connected to the circuit patterns.

Abstract translation: 一种电子部件嵌入式印刷电路板的制造方法，包括：将电子部件安装在绝缘层上的流体状态，使得电子部件的一部分插入到绝缘层中，另一部分电子部件突出于 绝缘层的顶表面，通过将电子部件压在绝缘层上; 通过固化绝缘层固定电子部件; 在包括电子部件的暴露表面的绝缘层的顶表面上形成金属种子层; 在所述金属种子层上形成镀层; 在绝缘层上形成与电子部件的焊盘对应的通孔和与焊盘电连接的形成电路图形的通孔; 以及形成包括电连接到电路图案的通孔的阻焊层。

公开(公告)号：US20100133680A1

公开(公告)日：2010-06-03

申请号：US12318752

申请日：2009-01-07

Applicant: Joon Seok KANG ,  Sung YI ,  Young Do KWEON

Inventor： Joon Seok KANG ,  Sung YI ,  Young Do KWEON

IPC: H01L23/498 ,  H01L21/78

CPC classification number: H01L23/3114 ,  H01L21/56 ,  H01L21/568 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

Abstract: The present invention relates to a wafer level package and a method of manufacturing the same and a method of reusing a chip and provides a wafer level package including a chip; a removable resin layer formed to surround side surfaces and a lower surface of the chip; a molding material formed on the lower surface of the removable resin layer; a dielectric layer formed over the removable resin layer including the chip and having via holes to expose portions of the chip; redistribution lines formed on the dielectric layer including insides of the via holes to be connected to the chip; and a solder resist layer formed on the dielectric layer to expose portions of the redistribution lines. Also, the present invention provides a method of manufacturing a wafer level package and a method of reusing a chip.

Abstract translation: 本发明涉及一种晶片级封装及其制造方法以及重新使用芯片的方法，并提供了包括芯片的晶片级封装; 形成为围绕所述芯片的侧表面和下表面的可移除树脂层; 形成在可移除树脂层的下表面上的成型材料; 形成在包括所述芯片的所述可移除树脂层上的电介质层，并且具有露出芯片部分的通孔; 在包括要连接到芯片的通孔的内部的电介质层上形成的再分配线; 以及形成在所述电介质层上以暴露所述再分布线的部分的阻焊层。 另外，本发明提供一种晶片级封装的制造方法和芯片的再利用方法。

公开(公告)号：US20090321118A1

公开(公告)日：2009-12-31

申请号：US12230874

申请日：2008-09-05

Applicant: Woon Chun Kim ,  Soon Gyu Yim ,  Joon Seok Kang

Inventor： Woon Chun Kim ,  Soon Gyu Yim ,  Joon Seok Kang

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/0203 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/284 ,  H05K2201/1056 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00

Abstract: An electronic component embedded printed circuit board and a manufacturing method thereof. The electronic component embedded printed circuit board includes an insulating layer forming a core layer; an electronic component inserted to project a part thereof on an upper part of the insulating layer; a metallic seed layer formed on the insulating layer including a projected surface of the electronic component; a plating layer formed on the metallic seed layer; circuit patterns electrically connected to pads of the electronic component through via-holes formed on the insulating layer; and a solder resist layer which is formed on the insulating layer and has solder balls attached onto the via-holes electrically connected to the circuit patterns. In the electronic component embedded printed circuit board, a heat radiation characteristic can be maximized and a thickness of the printed circuit board can be minimized. In case that the insulating is made of a thermoplastic resin, the electronic component can be reutilized, thereby saving product cost.

Abstract translation: 一种电子部件嵌入式印刷电路板及其制造方法。 电子部件嵌入式印刷电路板包括形成芯层的绝缘层; 被插入以将其部分投影在绝缘层的上部上的电子部件; 形成在绝缘层上的金属种子层，包括电子部件的投影表面; 形成在所述金属种子层上的镀层; 电路图案通过形成在绝缘层上的通孔电连接到电子部件的焊盘; 以及阻焊层，其形成在绝缘层上并且具有附着到电连接到电路图案的通孔上的焊球。 在电子部件嵌入式印刷电路板中，可以使热辐射特性最大化，并且可以使印刷电路板的厚度最小化。 在绝热材料由热塑性树脂制成的情况下，电子部件可以再利用，从而节省产品成本。

公开(公告)号：US07632709B2

公开(公告)日：2009-12-15

申请号：US12149106

申请日：2008-04-25

Applicant: Hyung-Jin Jeon ,  Sung Yi ,  Young-Do Kweon ,  Jong-Yun Lee ,  Joon-Seok Kang ,  Seung-Wook Park

Inventor： Hyung-Jin Jeon ,  Sung Yi ,  Young-Do Kweon ,  Jong-Yun Lee ,  Joon-Seok Kang ,  Seung-Wook Park

IPC: H01L21/00

CPC classification number: H01L23/3114 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/24 ,  H01L24/27 ,  H01L24/82 ,  H01L2221/68372 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517

Abstract: A method of manufacturing a wafer level package is disclosed. The method may include stacking an insulation layer over a wafer substrate; processing a via hole in the insulation layer; forming a seed layer over the insulation layer; forming a plating resist, which is in a corresponding relationship with a redistribution pattern, over the seed layer; forming the redistribution pattern, which includes a terminal for external contact, by electroplating; and coupling a conductive ball to the terminal. As multiple redistribution layers can be formed using inexpensive PCB processes, the manufacturing costs can be reduced, and the stability and efficiency of the process can be increased.

公开(公告)号：US07113689B2

公开(公告)日：2006-09-26

申请号：US10606348

申请日：2003-06-26

Applicant: Yoon Shik Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee ,  Suk Kee Hong ,  Joon Seok Kang ,  Jung Hyun Lee

Inventor： Yoon Shik Hong ,  Young Gyu Lee ,  Sung Cheon Jung ,  Sang Kee Yoon ,  Hyun Kee Lee ,  Suk Kee Hong ,  Joon Seok Kang ,  Jung Hyun Lee

IPC: G02B6/00

CPC classification number: G02B6/353 ,  G02B6/266 ,  G02B6/35 ,  G02B6/3552 ,  G02B6/356 ,  G02B6/357 ,  G02B6/358 ,  G02B6/3582 ,  G02B6/3592 ,  G02B6/3594

Abstract: An MEMS variable optical attenuator includes a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of coaxially aligned optical waveguides having a receiving end and a transmitting end, respectively, and an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven by the micro-electric actuator. A surface layer is formed on the optical shutter, has reflectivity less than 80% so as to allow incident light beams to partially transmit thereinto, and further has a sufficient light extinction ratio, thereby extinguishing the partially transmitted light beams therein.

Abstract translation: MEMS可变光衰减器包括具有平面表面的基板，布置在基板的平面表面上的微电致动器，分别具有接收端和发射端的一对同轴对准的光波导，以及可移动的光闸 到光波导的接收端和发送端之间的预定位置，并由微电动致动器驱动。 表面层形成在光学快门上，具有小于80％的反射率，以便使入射光束部分地透射，并且还具有足够的消光比，由此熄灭其中部分透射的光束。

公开(公告)号：US06552839B1

公开(公告)日：2003-04-22

申请号：US10104692

申请日：2002-03-21

Applicant: Yoon Shik Hong ,  Joon Seok Kang ,  Sang Kee Yoon ,  Sung Cheon Jung ,  Jung Hyun Lee ,  Hyun Kee Lee

Inventor： Yoon Shik Hong ,  Joon Seok Kang ,  Sang Kee Yoon ,  Sung Cheon Jung ,  Jung Hyun Lee ,  Hyun Kee Lee

IPC: G02B2600

CPC classification number: G02B6/358 ,  B81B3/0054 ,  B81B2201/045 ,  B81B2203/053 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/357 ,  G02B6/3584 ,  G02B26/0841 ,  H02N1/006

Abstract: Disclosed herein is an optical switch. The optical switch includes an electrostatic actuator and a substrate. The electrostatic actuator includes an electrostatic actuator, the electrostatic actuator comprising, a reciprocating mass located in the center of the electrostatic actuator, first rotating axes located symmetrically at the left and right sides of the reciprocating mass, first rotating masses rotatably connected to the first rotating axes, first rotating springs for supporting the first rotating masses, linear springs connected to the first rotating masses, second rotating masses connected to the linear springs, second rotating springs for supporting the second rotating masses, second rotating axes connected to the second rotating masses, structural anchors at the side ends of the actuator, drive electrodes, and a micro mirror movable by the same displacement as the reciprocating mass.

Abstract translation: 这里公开了一种光开关。 光开关包括静电致动器和基板。 所述静电致动器包括静电致动器，所述静电致动器包括位于所述静电致动器的中心的往复运动物质，位于所述往复运动质量块的左右两侧的第一旋转轴，所述第一旋转体可旋转地连接到所述第一旋转 轴，用于支撑第一旋转块的第一旋转弹簧，连接到第一旋转块的线性弹簧，连接到线性弹簧的第二旋转块，用于支撑第二旋转块的第二旋转弹簧，连接到第二旋转块的第二旋转轴， 在致动器的侧端处的结构锚固件，驱动电极和可与往复运动块相同位移的微反射镜。

公开(公告)号：US20130319734A1

公开(公告)日：2013-12-05

申请号：US13595900

申请日：2012-08-27

Applicant: Sang Hyun Shin ,  Kwang Jik Lee ,  Hye Sook Shin ,  Joon Seok Kang

Inventor： Sang Hyun Shin ,  Kwang Jik Lee ,  Hye Sook Shin ,  Joon Seok Kang

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H01L21/486 ,  H01L23/142 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/424 ,  H05K3/427 ,  H05K3/445 ,  H05K2201/0959 ,  H05K2203/0716 ,  H05K2203/1423 ,  H01L2924/00

Abstract: Disclosed herein is a package substrate including: a base substrate; insulation layers formed on upper and lower portions of the base substrate; a first metal layer formed on an upper portion of the insulation layer; a first through-via penetrating through the base substrate, the insulation layer, and the first metal layer and being made of an insulating material; a seed layer formed on upper and lower portions and an inner wall of the first through-via; a second metal layer formed on upper portions of the first metal layer and the seed layer; and a second through-via formed in the seed layer formed at the inner wall of the first through-via and the second metal layer.

Abstract translation: 本文公开了一种封装衬底，包括：基底; 形成在基底基板的上部和下部的绝缘层; 形成在所述绝缘层的上部的第一金属层; 穿过基底基板，绝缘层和第一金属层并由绝缘材料制成的第一通孔; 形成在第一通孔的上部和下部以及内壁上的种子层; 形成在第一金属层和种子层的上部的第二金属层; 以及形成在形成在第一通孔和第二金属层的内壁处的种子层中的第二通孔。

公开(公告)号：US08283768B2

公开(公告)日：2012-10-09

申请号：US12424514

申请日：2009-04-15

Applicant: Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

Inventor： Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/4334 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01073 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Disclosed herein are a wafer level package for heat dissipation and a method of manufacturing the same. The wafer level package includes a heat dissipation plate including a cavity and a hole, a die including a pad disposed in the cavity of the heat dissipation plate in a face-up manner, a thermal conductive adhesive disposed between the die and an inner wall of the cavity and disposed in the hole, and a redistribution layer connected at one end to the pad and at the other end extended. The wafer level package protects the die from external environments and enables the die to be easily flush with the heat dissipation plate.

Abstract translation: 这里公开了用于散热的晶片级封装及其制造方法。 晶片级封装包括包括空腔和孔的散热板，包括以面朝上的方式设置在散热板的空腔中的焊盘的模具，设置在模具和内壁之间的导热粘合剂 空腔并设置在孔中，并且再分配层在一端连接到垫并且在另一端延伸。 晶圆级封装保护模具免受外部环境的影响，使模具能够轻松地与散热板齐平。

公开(公告)号：US08026590B2

公开(公告)日：2011-09-27

申请号：US12581131

申请日：2009-10-17

Applicant: Joon Seok Kang ,  Young Ho Kim ,  Young Do Kweon ,  Jin Gu Kim ,  Sung Yi

Inventor： Joon Seok Kang ,  Young Ho Kim ,  Young Do Kweon ,  Jin Gu Kim ,  Sung Yi

IPC: H01L23/488 ,  H01L21/58

CPC classification number: H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2924/00

Abstract: Disclosed herein are a die package and a method of manufacturing the die package. A solder layer is formed on a lower surface of a die. The die is self-aligned and attached to a support plate using surface tension between the solder layer and a metal layer of the support plate, thus reducing attachment lead time of the die.

Abstract translation: 这里公开了一种管芯封装和制造该封装的方法。 在模具的下表面上形成焊料层。 使用焊料层和支撑板的金属层之间的表面张力将模具自对准并附接到支撑板，从而减少模具的附着时间。