公开(公告)号：US20140264821A1

公开(公告)日：2014-09-18

申请号：US13836407

申请日：2013-03-15

申请人： Zhizhong Tang ,  Syadwad Jain ,  Paul R. Start

发明人： Zhizhong Tang ,  Syadwad Jain ,  Paul R. Start

IPC分类号： H01L23/367 ,  F28F3/00 ,  B29C39/10

CPC分类号： H01L23/367 ,  B29C39/10 ,  H01L21/4882 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311

摘要： Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例描述了用于模制散热器的技术和配置。 在一些实施例中，散热器包括具有第一面和第一侧的第一插入件，第一面被定位成形成第一腔体的底面，第二插入件具有第二面和第二面，第二面 定位成形成第二腔的底表面。 第二腔可以具有与第一腔的深度不同的深度。 散热器还可以包括设置在第一和第二插入件之间并与第一侧和第二侧耦合的成型材料，模制材料形成第一空腔的侧壁的至少一部分和至少一部分 第二腔的侧壁。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20180005917A1

公开(公告)日：2018-01-04

申请号：US15197440

申请日：2016-06-29

申请人： Zhizhong Tang ,  Syadwad Jain ,  Wei Hu ,  Michael A. Schroeder ,  Rajen S. Sidhu ,  Carl L. Deppisch ,  Patrick Nardi ,  Kelly P. Lofgreen

发明人： Zhizhong Tang ,  Syadwad Jain ,  Wei Hu ,  Michael A. Schroeder ,  Rajen S. Sidhu ,  Carl L. Deppisch ,  Patrick Nardi ,  Kelly P. Lofgreen

IPC分类号： H01L23/373 ,  F28F21/08 ,  F28F21/02 ,  F28F21/04 ,  F28D15/02 ,  H01L23/498 ,  F28F13/00 ,  F28D21/00

CPC分类号： H01L23/3736 ,  F28D2021/0029 ,  F28F13/003 ,  F28F21/02 ,  F28F21/04 ,  F28F21/08 ,  F28F2013/001 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/49811 ,  H01L24/00 ,  H01L2224/73204 ,  H01L2224/73253

摘要： Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

公开(公告)号：US20140264820A1

公开(公告)日：2014-09-18

申请号：US13801882

申请日：2013-03-13

申请人： Wei Hu ,  Zhizhong Tang ,  Syadwad Jain ,  Rajen S. Sidhu

发明人： Wei Hu ,  Zhizhong Tang ,  Syadwad Jain ,  Rajen S. Sidhu

IPC分类号： H01L23/373

CPC分类号： H01L23/3736 ,  H01L23/42 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/01322 ,  H01L2924/16251 ,  H01L2924/00

摘要： Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例描述了用于糊状热界面材料（TIM）的技术和配置及其在集成电路（IC）封装中的应用。 在一些实施例中，IC封装包括设置在管芯和散热器之间的IC部件，散热器和粘合剂TIM。 糊料TIM可以包括通过基质材料分布的金属材料的颗粒，并且在固化后可以具有在约20微米和约100微米之间的粘合线厚度。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20140264818A1

公开(公告)日：2014-09-18

申请号：US13844243

申请日：2013-03-15

申请人： Randall D. Lowe, JR. ,  Syadwad Jain ,  James C. Matayabas

发明人： Randall D. Lowe, JR. ,  Syadwad Jain ,  James C. Matayabas

IPC分类号： H01L23/373 ,  H01L23/34

CPC分类号： H01L23/3737 ,  B32B5/16 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C08L83/04 ,  C09C3/12 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  C08K3/28 ,  C08K3/10

摘要： A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

摘要翻译： 描述了具有增强的导热性的聚合物热界面材料。 在一个实例中，将乙烯基封端的硅油与硅氧烷扩链剂和包含至少85重量％的材料的导热填料组合，并且包含具有一定形状和尺寸的表面润湿颗粒。 该材料可以用于例如将微电子封装内部的部件粘接。