公开(公告)号：US08400048B2

公开(公告)日：2013-03-19

申请号：US12740556

申请日：2009-09-18

申请人： Takashi Shirai ,  Yoshinobu Sakamoto ,  Syunsuke Satoh ,  Tomo Fujii ,  Masato Itoh ,  Yoshinari Morimoto

发明人： Takashi Shirai ,  Yoshinobu Sakamoto ,  Syunsuke Satoh ,  Tomo Fujii ,  Masato Itoh ,  Yoshinari Morimoto

IPC分类号： H03H9/19

CPC分类号： H03H9/215 ,  H03H9/0519 ,  H03H9/0595 ,  H03H9/1021 ,  H03H9/21

摘要： A tuning-fork type piezoelectric resonator plate includes: at least a plurality of leg portions serving as vibrating portions; a bonding portion bonded to the outside, and a base portion from which the leg portions and the bonding portion protrude. The plurality of leg portions protrude from a first end face of the base portion and are provided side-by-side on the first end face. The bonding portion protrude from a second end face located opposite the first end face of the base portion at a position located opposite a center position of the plurality of leg portions in a width direction of the first end face of the base portion. And, at least a base end portion of the bonding portion is used as a bond region that is bonded to the outside.

摘要翻译： 音叉式压电谐振器板包括：至少多个腿部作为振动部分; 接合到外部的接合部分和脚部和接合部分从该基部突出。 多个腿部从基部的第一端面突出并且在第一端面上并排设置。 接合部在与基部的第一端面相对的第二端面的基部的第一端面的宽度方向上与多个腿部的中心位置相对的位置突出。 而且，接合部的至少一个基端部被用作结合到外部的接合区域。

公开(公告)号：US20120187805A1

公开(公告)日：2012-07-26

申请号：US13203287

申请日：2010-09-15

申请人： Naoki Kohda ,  Syunsuke Satoh ,  Hiroki Yoshioka

发明人： Naoki Kohda ,  Syunsuke Satoh ,  Hiroki Yoshioka

IPC分类号： H01L41/047 ,  H01L41/16 ,  H01L41/22

CPC分类号： H03H9/19 ,  H03H9/1021

摘要： In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

摘要翻译： 在压电谐振器板中，具有形成为矩形形状的主面的基板设置有彼此一体化的振动部和接合部，该振动部包括通过形成一对激励电极而构成的振动区域， 并且所述接合部分中形成有一对连接到外部的端子电极。 一对中的端子电极具有形成在其中的导电凸块并且分别电连接到成对的激励电极。 此外，基板包括在形成有一对端子电极的位置处凸出地形成的柱部。

公开(公告)号：US08174172B2

公开(公告)日：2012-05-08

申请号：US13085588

申请日：2011-04-13

申请人： Syunsuke Satoh ,  Shinichi Koyama

发明人： Syunsuke Satoh ,  Shinichi Koyama

IPC分类号： H01L41/09 ,  H03H9/21

CPC分类号： H03H9/1021 ,  H03H9/17 ,  H03H9/21 ,  Y10T29/42

摘要： A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves.

摘要翻译： 一种压电谐振器装置，包括压电谐振器板，用于保持压电谐振器板的基座，用于气密地封闭保持在基座上的压电谐振器板的盖子和由用于减小压电谐振器的外部应力的脆性材料制成的支撑构件 盘子。 压电谐振器板通过支撑构件保持在基座上。 在这种情况下，通过使用超声波的FCB，使用基极接合部件和压电谐振器板接合部件（连接凸起），基体，压电谐振器板和支撑部件彼此接合。 该基座通过使用超声波的支撑构件的多个区域中的基底接合构件与支撑构件电气机械地接合。 此外，压电谐振器板通过使用超声波的压电谐振器板的区域中的压电谐振器板接合部件与支撑部件电气机械地接合。

公开(公告)号：US08004157B2

公开(公告)日：2011-08-23

申请号：US11885260

申请日：2006-03-02

申请人： Minoru Iizuka ,  Tatsuya Murakami ,  Syunsuke Satoh ,  Takashi Shirai ,  Hiroyuki Ishihara ,  Tomo Fujii

发明人： Minoru Iizuka ,  Tatsuya Murakami ,  Syunsuke Satoh ,  Takashi Shirai ,  Hiroyuki Ishihara ,  Tomo Fujii

IPC分类号： H01L41/08

CPC分类号： H03H9/1021 ,  H03H9/215

摘要： An electrode forming region for providing lead electrodes (65a, 65b) is provided on a crystal resonator plate (2). Opposed side surfaces (67a, 67b) of a substrate (6) are formed and inclined in the same direction with respect to a front major surface (63). Also, an adhesion reinforcing portion (7) for reinforcing adhesion to a conductive adhesive (5) is provided in the electrode forming region for the lead electrodes (65a, 65b). For example, the adhesion reinforcing portion (7) is a notch portion which is cut and formed in the opposed side surfaces (67a, 67b). Thereby, an adhesion strength of the crystal resonator plate (2) and the conductive adhesive (5) is increased.

摘要翻译： 在晶体谐振器板（2）上设置用于提供引线电极（65a，65b）的电极形成区域。 形成基板（6）的相对的侧面（67a，67b）并相对于前主表面（63）沿相同的方向倾斜。 此外，在用于引线电极（65a，65b）的电极形成区域中设置有用于增强与导电粘合剂（5）的粘附的粘合增强部分（7）。 例如，粘合强化部（7）是在相对的侧面（67a，67b）上切断并形成的切口部。 由此，增加了晶体谐振器板（2）和导电粘合剂（5）的粘附强度。

公开(公告)号：US20110187236A1

公开(公告)日：2011-08-04

申请号：US13085588

申请日：2011-04-13

申请人： Syunsuke SATOH ,  Shinichi KOYAMA

发明人： Syunsuke SATOH ,  Shinichi KOYAMA

IPC分类号： H01L41/053

CPC分类号： H03H9/1021 ,  H03H9/17 ,  H03H9/21 ,  Y10T29/42

摘要： A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves.

摘要翻译： 一种压电谐振器装置，包括压电谐振器板，用于保持压电谐振器板的基座，用于气密地封闭保持在基座上的压电谐振器板的盖子和由用于减小压电谐振器的外部应力的脆性材料制成的支撑构件 盘子。 压电谐振器板通过支撑构件保持在基座上。 在这种情况下，通过使用超声波的FCB，使用基极接合部件和压电谐振器板接合部件（连接凸起），基体，压电谐振器板和支撑部件彼此接合。 该基座通过使用超声波的支撑构件的多个区域中的基底接合构件与支撑构件电气机械地接合。 此外，压电谐振器板通过使用超声波的压电谐振器板的区域中的压电谐振器板接合部件与支撑部件电气机械地接合。

公开(公告)号：US07948156B2

公开(公告)日：2011-05-24

申请号：US12092127

申请日：2006-11-30

申请人： Syunsuke Satoh ,  Shinichi Koyama

发明人： Syunsuke Satoh ,  Shinichi Koyama

IPC分类号： H01L41/047

CPC分类号： H03H9/1021 ,  H03H9/17 ,  H03H9/21 ,  Y10T29/42

摘要： A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves.

摘要翻译： 一种压电谐振器装置，包括压电谐振器板，用于保持压电谐振器板的基座，用于气密地封闭保持在基座上的压电谐振器板的盖子和由用于减小压电谐振器的外部应力的脆性材料制成的支撑构件 盘子。 压电谐振器板通过支撑构件保持在基座上。 在这种情况下，通过使用超声波的FCB，使用基极接合部件和压电谐振器板接合部件（连接凸起），基体，压电谐振器板和支撑部件彼此接合。 该基座通过使用超声波的支撑构件的多个区域中的基底接合构件与支撑构件电气机械地接合。 此外，压电谐振器板通过使用超声波的压电谐振器板的区域中的压电谐振器板接合部件与支撑部件电气机械地接合。

公开(公告)号：US20080265717A1

公开(公告)日：2008-10-30

申请号：US11885260

申请日：2006-03-02

申请人： Minoru Iizuka ,  Tatsuya Murakami ,  Syunsuke Satoh ,  Takashi Shirai ,  Hiroyuki Ishihara ,  Tomo Fujii

发明人： Minoru Iizuka ,  Tatsuya Murakami ,  Syunsuke Satoh ,  Takashi Shirai ,  Hiroyuki Ishihara ,  Tomo Fujii

IPC分类号： H03H9/10

CPC分类号： H03H9/1021 ,  H03H9/215

摘要： An electrode forming region for providing lead electrodes (65a, 65b) is provided on a crystal resonator plate (2). Opposed side surfaces (67a, 67b) of a substrate (6) are formed and inclined in the same direction with respect to a front major surface (63). Also, an adhesion reinforcing portion (7) for reinforcing adhesion to a conductive adhesive (5) is provided in the electrode forming region for the lead electrodes (65a, 65b). For example, the adhesion reinforcing portion (7) is a notch portion which is cut and formed in the opposed side surfaces (67a, 67b). Thereby, an adhesion strength of the crystal resonator plate (2) and the conductive adhesive (5) is increased.

摘要翻译： 在晶体谐振器板（2）上设置用于提供引线电极（65a，65b）的电极形成区域。 形成基板（6）的相对的侧面（67a，67b）并相对于前主表面（63）沿相同的方向倾斜。 此外，在用于引线电极（65a，65b）的电极形成区域中设置用于增强与导电粘合剂（5）的粘附的粘附强化部分（7）。 例如，粘合强化部（7）是在相对的侧面（67a，67b）中被切割并形成的切口部。 由此，增加了晶体谐振器板（2）和导电粘合剂（5）的粘附强度。

公开(公告)号：US20120012356A1

公开(公告)日：2012-01-19

申请号：US13203037

申请日：2010-04-02

申请人： Syunsuke Satoh ,  Naoki Kohda ,  Hiroki Yoshioka

发明人： Syunsuke Satoh ,  Naoki Kohda ,  Hiroki Yoshioka

IPC分类号： H05K5/06 ,  H05K13/00 ,  H01L41/22

CPC分类号： H03H9/1035 ,  H01L21/4846 ,  H01L23/49805 ,  H01L24/97 ,  H01L41/311 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15788 ,  H03H3/02 ,  H03H9/0595 ,  H03H9/1014 ,  Y10T29/42 ,  Y10T29/49002 ,  H01L2924/00

摘要： [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

摘要翻译： [解决方案]在封装构件组件中，多个封装构件一体形成。 封装构件组件包括设置在由玻璃制成的晶片的前主面和后主面上的多个有底孔，以及连接到安装在后主体上的有孔孔的内壁面上的侧面导体的外部端子 面对。

公开(公告)号：US20110043079A1

公开(公告)日：2011-02-24

申请号：US12740556

申请日：2009-09-18

申请人： Takashi Shirai ,  Yoshinobu Sakamoto ,  Syunsuke Satoh ,  Tomo Fujii ,  Masato Itoh ,  Yoshinari Morimoto

发明人： Takashi Shirai ,  Yoshinobu Sakamoto ,  Syunsuke Satoh ,  Tomo Fujii ,  Masato Itoh ,  Yoshinari Morimoto

IPC分类号： H01L41/047

CPC分类号： H03H9/215 ,  H03H9/0519 ,  H03H9/0595 ,  H03H9/1021 ,  H03H9/21

摘要： A tuning-fork type piezoelectric resonator plate includes: at least a plurality of leg portions serving as vibrating portions; a bonding portion bonded to the outside, and a base portion from which the leg portions and the bonding portion protrude. The plurality of leg portions protrude from a first end face of the base portion and are provided side-by-side on the first end face. The bonding portion protrude from a second end face located opposite the first end face of the base portion at a position located opposite a center position of the plurality of leg portions in a width direction of the first end face of the base portion. And, at least a base end portion of the bonding portion is used as a bond region that is bonded to the outside.

摘要翻译： 音叉式压电谐振器板包括：至少多个腿部作为振动部分; 接合到外部的接合部分和脚部和接合部分从该基部突出。 多个腿部从基部的第一端面突出并且在第一端面上并排设置。 接合部在与基部的第一端面相对的第二端面的基部的第一端面的宽度方向上与多个腿部的中心位置相对的位置突出。 而且，接合部的至少一个基端部被用作结合到外部的接合区域。

公开(公告)号：US20100270891A1

公开(公告)日：2010-10-28

申请号：US12680921

申请日：2009-08-04

申请人： Naoki Kohda ,  Hiroki Yoshioka ,  Syunsuke Satoh

发明人： Naoki Kohda ,  Hiroki Yoshioka ,  Syunsuke Satoh

IPC分类号： H01L41/053 ,  H01L41/22

CPC分类号： H03H9/1021 ,  H03H9/1035 ,  Y10T29/42

摘要： A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member.

摘要翻译： 压电谐振器装置的密封构件被构造成气密地密封形成在压电谐振器板上的驱动电极。 在密封构件中，形成通孔，使得形成在基板的两个主表面上的电极图案导通; 并且导电构件填充在通孔中。 通孔在密封构件的主表面处的基板内部的直径比在其两端部处的直径小。 导电构件的两个端面相对于密封构件的基板的主表面具有凹形。