公开(公告)号：US20120187805A1

公开(公告)日：2012-07-26

申请号：US13203287

申请日：2010-09-15

申请人： Naoki Kohda ,  Syunsuke Satoh ,  Hiroki Yoshioka

发明人： Naoki Kohda ,  Syunsuke Satoh ,  Hiroki Yoshioka

IPC分类号： H01L41/047 ,  H01L41/16 ,  H01L41/22

CPC分类号： H03H9/19 ,  H03H9/1021

摘要： In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

摘要翻译： 在压电谐振器板中，具有形成为矩形形状的主面的基板设置有彼此一体化的振动部和接合部，该振动部包括通过形成一对激励电极而构成的振动区域， 并且所述接合部分中形成有一对连接到外部的端子电极。 一对中的端子电极具有形成在其中的导电凸块并且分别电连接到成对的激励电极。 此外，基板包括在形成有一对端子电极的位置处凸出地形成的柱部。

公开(公告)号：US09035449B2

公开(公告)日：2015-05-19

申请号：US13203037

申请日：2010-04-02

申请人： Syunsuke Satoh ,  Naoki Kohda ,  Hiroki Yoshioka

发明人： Syunsuke Satoh ,  Naoki Kohda ,  Hiroki Yoshioka

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L41/22 ,  H03H9/10 ,  H01L41/311 ,  H03H3/02 ,  H03H9/05

CPC分类号： H03H9/1035 ,  H01L21/4846 ,  H01L23/49805 ,  H01L24/97 ,  H01L41/311 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15788 ,  H03H3/02 ,  H03H9/0595 ,  H03H9/1014 ,  Y10T29/42 ,  Y10T29/49002 ,  H01L2924/00

摘要： [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

摘要翻译： [解决方案]在封装构件组件中，多个封装构件一体形成。 封装构件组件包括设置在由玻璃制成的晶片的前主面和后主面上的多个有底孔，以及连接到安装在后主体上的有孔孔的内壁面上的侧面导体的外部端子 面对。

公开(公告)号：US08618722B2

公开(公告)日：2013-12-31

申请号：US13203287

申请日：2010-09-15

申请人： Naoki Kohda ,  Syunsuke Satoh ,  Hiroki Yoshioka

发明人： Naoki Kohda ,  Syunsuke Satoh ,  Hiroki Yoshioka

IPC分类号： H01L41/08

CPC分类号： H03H9/19 ,  H03H9/1021

摘要： In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

摘要翻译： 在压电谐振器板中，具有形成为矩形形状的主面的基板设置有彼此一体化的振动部和接合部，该振动部包括通过形成一对激励电极而构成的振动区域， 并且所述接合部分中形成有一对连接到外部的端子电极。 一对中的端子电极具有形成在其中的导电凸块并且分别电连接到成对的激励电极。 此外，基板包括在形成有一对端子电极的位置处凸出地形成的柱部。

公开(公告)号：US20120012356A1

公开(公告)日：2012-01-19

申请号：US13203037

申请日：2010-04-02

申请人： Syunsuke Satoh ,  Naoki Kohda ,  Hiroki Yoshioka

发明人： Syunsuke Satoh ,  Naoki Kohda ,  Hiroki Yoshioka

IPC分类号： H05K5/06 ,  H05K13/00 ,  H01L41/22

CPC分类号： H03H9/1035 ,  H01L21/4846 ,  H01L23/49805 ,  H01L24/97 ,  H01L41/311 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15788 ,  H03H3/02 ,  H03H9/0595 ,  H03H9/1014 ,  Y10T29/42 ,  Y10T29/49002 ,  H01L2924/00

摘要： [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

摘要翻译： [解决方案]在封装构件组件中，多个封装构件一体形成。 封装构件组件包括设置在由玻璃制成的晶片的前主面和后主面上的多个有底孔，以及连接到安装在后主体上的有孔孔的内壁面上的侧面导体的外部端子 面对。

公开(公告)号：US20100270891A1

公开(公告)日：2010-10-28

申请号：US12680921

申请日：2009-08-04

申请人： Naoki Kohda ,  Hiroki Yoshioka ,  Syunsuke Satoh

发明人： Naoki Kohda ,  Hiroki Yoshioka ,  Syunsuke Satoh

IPC分类号： H01L41/053 ,  H01L41/22

CPC分类号： H03H9/1021 ,  H03H9/1035 ,  Y10T29/42

摘要： A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member.

摘要翻译： 压电谐振器装置的密封构件被构造成气密地密封形成在压电谐振器板上的驱动电极。 在密封构件中，形成通孔，使得形成在基板的两个主表面上的电极图案导通; 并且导电构件填充在通孔中。 通孔在密封构件的主表面处的基板内部的直径比在其两端部处的直径小。 导电构件的两个端面相对于密封构件的基板的主表面具有凹形。

公开(公告)号：US08129888B2

公开(公告)日：2012-03-06

申请号：US12680921

申请日：2009-08-04

申请人： Naoki Kohda ,  Hiroki Yoshioka ,  Syunsuke Satoh

发明人： Naoki Kohda ,  Hiroki Yoshioka ,  Syunsuke Satoh

IPC分类号： H01L41/08

CPC分类号： H03H9/1021 ,  H03H9/1035 ,  Y10T29/42

摘要： A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member.

摘要翻译： 压电谐振器装置的密封构件被构造成气密地密封形成在压电谐振器板上的驱动电极。 在密封构件中，形成通孔，使得形成在基板的两个主表面上的电极图案导通; 并且导电构件填充在通孔中。 通孔在密封构件的主表面处的基板内部的直径比在其两端部处的直径小。 导电构件的两个端面相对于密封构件的基板的主表面具有凹形。

公开(公告)号：US20110265298A1

公开(公告)日：2011-11-03

申请号：US13142877

申请日：2010-01-07

申请人： Syunsuke Satoh ,  Naoki Kohda

发明人： Syunsuke Satoh ,  Naoki Kohda

IPC分类号： H01L41/22

CPC分类号： H03H9/1035 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908

摘要： A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

摘要翻译： 根据本发明的制造压电谐振器的方法包括以下步骤：制备与多个下盖构件3一体形成的厚壁晶片30的晶片形成步骤; 通过接合材料5将晶体谐振器板2接合到晶片30的一个主表面31并通过接合材料5将上盖构件4接合在晶体谐振器板上的接合步骤; 从晶片的另一个主表面37使薄片30变薄的薄化步骤; 外部端子形成步骤，在所述薄晶片的另一个主表面上形成外部端子; 以及在每个相邻的一对晶体谐振器之间切割晶片以便获得多个晶体谐振器的分割步骤。

公开(公告)号：US08991022B2

公开(公告)日：2015-03-31

申请号：US13142877

申请日：2010-01-07

申请人： Syunsuke Satoh ,  Naoki Kohda

发明人： Syunsuke Satoh ,  Naoki Kohda

IPC分类号： H04R17/00 ,  H03H9/10

CPC分类号： H03H9/1035 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908

摘要： A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

摘要翻译： 根据本发明的制造压电谐振器的方法包括以下步骤：制备与多个下盖构件3一体形成的厚壁晶片30的晶片形成步骤; 通过接合材料5将晶体谐振器板2接合到晶片30的一个主表面31并通过接合材料5将上盖构件4接合在晶体谐振器板上的接合步骤; 从晶片的另一个主表面37使薄片30变薄的薄化步骤; 外部端子形成步骤，在所述薄晶片的另一个主表面上形成外部端子; 以及在每个相邻的一对晶体谐振器之间切割晶片以便获得多个晶体谐振器的分割步骤。

公开(公告)号：US08975517B2

公开(公告)日：2015-03-10

申请号：US13635024

申请日：2012-03-16

申请人： Naoki Kohda ,  Hiroki Yoshioka

发明人： Naoki Kohda ,  Hiroki Yoshioka

IPC分类号： H01J5/00 ,  H01J15/00 ,  H01J3/08 ,  H05K5/00 ,  H05K5/06 ,  H03H9/21 ,  H01L23/055 ,  H01L23/10 ,  H05K13/00 ,  H03H9/10

CPC分类号： H05K5/066 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/16315 ,  H03H9/1021 ,  H03H9/21 ,  H05K13/00 ,  H01L2924/00

摘要： An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.

摘要翻译： 电子部件封装具有安装有电子元件的第一密封构件主表面和第二密封构件。 第二密封构件的外周部分模制成锥形，在外周的至少一部分中提供锥形区域。 与第二密封构件的表面的外周部的内侧的平坦部的至少一部分设置有与锥形区域相邻的平坦区域。 相对于锥形区域的第一区域和对应于平坦区域的第二区域在具有安装的电子元件的第一密封构件的第一主表面上彼此相邻地设置。 第二区域的宽度W2为平坦区域的宽度W4的0.66〜1.2倍。 通过加热形成第一和第二接合层并彼此接合。

公开(公告)号：US20110215678A1

公开(公告)日：2011-09-08

申请号：US13129182

申请日：2009-12-24

申请人： Naoki Kohda ,  Hiroki Yoshioka

发明人： Naoki Kohda ,  Hiroki Yoshioka

IPC分类号： H01L41/053 ,  H01L41/22 ,  C23F1/04

CPC分类号： H01L41/332 ,  B01D2325/02 ,  C23C8/40 ,  C23C12/00 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3733 ,  H01L31/18 ,  H01L31/1804 ,  H01L41/23 ,  H01L41/25 ,  H01L41/29 ,  H01L41/33 ,  H01L2924/0002 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/0552 ,  H03H9/1035 ,  H03H9/19 ,  H03H2003/045 ,  H03H2003/0457 ,  Y10T29/42 ,  H01L2924/00

摘要： A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface.

摘要翻译： 压电振动装置包括形成有激励电极的压电振动板以及气密密封激励电极的上盖部件和下盖部件，压电振动板具有上盖部件接合的区域和区域 所述下盖构件在前后主表面上接合的上盖构件，所述上盖构件在压电振动板的一个主表面上具有区域，并且所述下盖构件在一个主表面上具有压电振动 板块加入。 压电振动板的接合区域的基板，上盖部件的接合区域的基板和下盖部件的接合区域的基板中的至少一个具有粗糙面。