公开(公告)号：US20130279119A1

公开(公告)日：2013-10-24

申请号：US13481181

申请日：2012-05-25

申请人： Vicentiu GROSU ,  Mark D. KORICH ,  Terence G. WARD ,  Gregory S. SMITH

发明人： Vicentiu GROSU ,  Mark D. KORICH ,  Terence G. WARD ,  Gregory S. SMITH

IPC分类号： H05K7/20 ,  B21D53/02

CPC分类号： H01L23/36 ,  H01L23/3735 ,  H01L23/4985 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  Y10T29/4935 ,  H01L2924/00

摘要： Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.

摘要翻译： 本文提供电子组件和制造电子组件的方法。 电子组件包括散热器，金属层和电绝缘体层。 金属层限定电路的至少一部分。 电绝缘体层设置在散热器和金属层之间，并且直接结合到散热器。

公开(公告)号：US08354816B2

公开(公告)日：2013-01-15

申请号：US12891316

申请日：2010-09-27

申请人： Terence G. Ward ,  Edward P. Yankoski

发明人： Terence G. Ward ,  Edward P. Yankoski

IPC分类号： H02M1/00 ,  H02M7/537

CPC分类号： H02M7/003 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/00

摘要： An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component.

摘要翻译： 提供汽车功率转换器。 所述汽车功率转换器包括衬底，所述衬底上的第一和第二电子器件，耦合到所述衬底的至少一个导电构件，并且具有电耦合到所述第一电子器件的第一器件部分和电耦合到所述第二电子器件的第二器件部分 装置，以及电耦合到所述至少一个导电构件的第一和第二端子。 当电源耦合到第一和第二端子时，电流基本上在第一方向上从第一端子流到第一器件部分，并且从第二端子到第二器件部分基本上沿第二方向流动。 第一方向具有第一分量，第二方向具有与第一分量相对的第二分量。

公开(公告)号：US08188601B2

公开(公告)日：2012-05-29

申请号：US11758859

申请日：2007-06-06

申请人： Terence G. Ward ,  Edward P. Yankoski

发明人： Terence G. Ward ,  Edward P. Yankoski

IPC分类号： H01L29/40

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L25/072 ,  H01L2224/37011 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00

摘要： A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer.

摘要翻译： 提供了一种用于大功率，交流电动机应用的逆变器电路的开关模块中的半导体子组件。 半导体子组件包括具有第一和第二相对的金属化面的晶片; 电耦合到所述晶片的所述第一金属化面并且具有至少一个电极区域的半导体开关器件; 以及连接到半导体开关器件的互连。 互连包括结合到半导体开关器件的至少一个电极区域的第一金属层，接合到第一金属层的陶瓷层，限定用于接触第一金属层的通孔的陶瓷层，接合到第一金属层的第二金属层 陶瓷层和设置在陶瓷层的通孔中的导电物质，以将第一金属层电耦合到第二金属层。

公开(公告)号：US08169779B2

公开(公告)日：2012-05-01

申请号：US12638683

申请日：2009-12-15

申请人： Khiet Le ,  Terence G. Ward ,  Brooks S. Mann ,  Edward P. Yankoski ,  Gregory S. Smith

发明人： Khiet Le ,  Terence G. Ward ,  Brooks S. Mann ,  Edward P. Yankoski ,  Gregory S. Smith

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L25/072 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

摘要： Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

摘要翻译： 为适用于直接基板冷却的电力电子基板提供系统和装置。 电力电子基板包括被配置为具有设置在其上的电路的第一表面，第二表面和第二表面上的多个物理特征。 物理特征被配置为促进撞击在第二表面上的冷却剂中的湍流边界层。

公开(公告)号：US08053920B2

公开(公告)日：2011-11-08

申请号：US12178897

申请日：2008-07-24

申请人： Terence G. Ward ,  George John ,  Edward P. Yankoski ,  Gregory S. Smith ,  James M. Nagashima

发明人： Terence G. Ward ,  George John ,  Edward P. Yankoski ,  Gregory S. Smith ,  James M. Nagashima

IPC分类号： B60L1/00

CPC分类号： H02M7/003 ,  H01L2224/49111

摘要： A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.

摘要翻译： 提供了一种用于功率转换器的端子组件。 端子组件包括第一和第二导电部件和电流传感器。 第一导电组件具有第一和第二可释放的附接结构。 第二导电部件具有相应的第一和第二宽度的第一和第二部分。 第一宽度小于第二宽度。 第一部分通过第二可释放的连接结构可释放地附接到第一导电部件。 电流传感器具有穿过其的开口并且位于第一导电部件和第二导电部件的第二部分之间，使得第一导电部件的第一部分延伸穿过开口。 电流传感器响应于流过第二导电部件的第一部分的电流。

公开(公告)号：US20110180855A1

公开(公告)日：2011-07-28

申请号：US12695409

申请日：2010-01-28

申请人： GEORGE R. WOODY ,  TERENCE G. WARD ,  KARIM BOUTROS ,  BRIAN HUGHES

发明人： GEORGE R. WOODY ,  TERENCE G. WARD ,  KARIM BOUTROS ,  BRIAN HUGHES

IPC分类号： H01L27/06

CPC分类号： H01L25/072 ,  H01L23/36 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Non-direct bond copper isolated lateral wide band gap semiconductor devices are provided. One semiconductor device includes a heat sink, a buffer layer directly overlying the heat sink, and an epitaxial layer formed of a group-III nitride overlying the buffer layer. Another semiconductor device includes a heat sink, a substrate directly overlying the heat sink, a buffer layer directly overlying the substrate, and an epitaxial layer formed of a group-III nitride overlying the buffer layer. Being formed of a group-III nitride enables the various epitaxial layers to be electrically isolated from their respective heat sinks.

摘要翻译： 提供非直接键铜隔离横向宽带隙半导体器件。 一个半导体器件包括散热器，直接覆盖散热器的缓冲层，以及由覆盖缓冲层的III-III族氮化物形成的外延层。 另一个半导体器件包括散热器，直接覆盖散热器的衬底，直接覆盖衬底的缓冲层，以及由覆盖缓冲层的III-III族氮化物形成的外延层。 由III族氮化物形成能够使各种外延层与它们各自的散热器电隔离。

公开(公告)号：US20110095163A1

公开(公告)日：2011-04-28

申请号：US12607727

申请日：2009-10-28

申请人： DUC Q. PHAN ,  KHIET LE ,  TERENCE G. WARD ,  YUNQI ZHENG ,  GABRIEL GALLEGOS-LOPEZ ,  DANG DINH DANG

发明人： DUC Q. PHAN ,  KHIET LE ,  TERENCE G. WARD ,  YUNQI ZHENG ,  GABRIEL GALLEGOS-LOPEZ ,  DANG DINH DANG

IPC分类号： F16M13/00

CPC分类号： H02K5/15 ,  F16C19/06 ,  F16C27/04 ,  F16C2380/26 ,  H02K5/24

摘要： Damping mechanisms and motor assemblies are provided. In an embodiment, by way of example only, a damping mechanism includes an end cap, a bearing retainer plate, a bearing damper ring, a bearing assembly, and first and second lateral dampers. The bearing damper ring is disposed in an annular cavity inwardly from an inner diameter surface of the end cap and has a radially inwardly-extending flange. The bearing assembly is disposed in the annular cavity radially inwardly relative to the bearing damper ring. The first lateral damper is disposed between a radially inwardly-extending wall of the end cap and the bearing damper ring. The second lateral damper is disposed between the bearing damper ring and the bearing retainer plate.

摘要翻译： 提供阻尼机构和电机组件。 在一个实施例中，仅作为示例，阻尼机构包括端盖，轴承保持板，轴承阻尼环，轴承组件以及第一和第二横向阻尼器。 轴承阻尼环从端盖的内径表面向内设置在环形空腔中并且具有径向向内延伸的凸缘。 轴承组件相对于轴承阻尼环径向向内设置在环形腔中。 第一横向阻尼器设置在端盖的径向向内延伸的壁和轴承阻尼环之间。 第二横向阻尼器设置在轴承阻尼环和轴承保持板之间。

公开(公告)号：US20100199489A1

公开(公告)日：2010-08-12

申请号：US12763494

申请日：2010-04-20

申请人： TERENCE G. WARD ,  KHWAJA M. RAHMAN

发明人： TERENCE G. WARD ,  KHWAJA M. RAHMAN

IPC分类号： H02K15/02

CPC分类号： H02K15/03 ,  H01F1/083 ,  H01F1/113 ,  H01F41/0273

摘要： Methods are provided for forming/inserting a magnet in a rotor. One method includes coating a plurality of magnetizable particles with a non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles. Another method includes inserting a plurality of magnetizable particles into a rotor, submersing the rotor in motor varnish or another viscous, non-metallic material to coat the particles, and magnetizing the particles. Yet another method includes inserting a plurality of magnetizable particles in a rotor, inserting a non-metallic material into the rotor, mixing the particles and non-metallic material to form a mixture, curing the mixture to coat each particle with non-metallic material, and magnetizing the particles. Still another method includes mixing a plurality of magnetizable particles with a non-metallic material, curing the non-metallic material to coat each particle with non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles.

摘要翻译： 提供了用于在转子中形成/插入磁体的方法。 一种方法包括用非金属材料涂覆多个可磁化颗粒，将涂覆的颗粒插入转子中，并使涂覆的颗粒磁化。 另一种方法包括将多个可磁化颗粒插入转子中，将转子浸入马达清漆或另一粘性非金属材料中以涂覆颗粒，并使颗粒磁化。 另一种方法包括将多个可磁化颗粒插入转子中，将非金属材料插入转子中，将颗粒和非金属材料混合以形成混合物，固化混合物以用非金属材料涂覆每个颗粒， 并使颗粒磁化。 另一种方法包括将多个可磁化颗粒与非金属材料混合，固化非金属材料以用非金属材料涂覆每个颗粒，将涂覆的颗粒插入转子中，并使涂覆的颗粒磁化。

公开(公告)号：US20100053889A1

公开(公告)日：2010-03-04

申请号：US12198723

申请日：2008-08-26

申请人： DAVID HAROLD MILLER ,  MARK D. KORICH ,  TERENCE G. WARD ,  BROOKS S. MANN

发明人： DAVID HAROLD MILLER ,  MARK D. KORICH ,  TERENCE G. WARD ,  BROOKS S. MANN

IPC分类号： H05K7/20 ,  B23P15/26

CPC分类号： H01L23/4735 ,  H01L23/3735 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  Y10T29/53122 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

摘要翻译： 为具有分布式支持直接衬底冷却的逆变器功率模块提供系统和/或方法。 逆变器模块包括电力电子基板。 第一支撑框架适于容纳电力电子基板，并且具有适于允许电力电子基板的直接冷却的第一区域。 在电力电子基板和第一支撑框架之间插入垫圈。 垫圈构造成在第一区域和电力电子基板之间提供密封。 第二支撑框架适于容纳电力电子基板并且连接到第一支撑框架以形成密封件。

公开(公告)号：US07518066B2

公开(公告)日：2009-04-14

申请号：US11218053

申请日：2005-09-01

申请人： Alex Thompson ,  Terence G. Ward

发明人： Alex Thompson ,  Terence G. Ward

IPC分类号： H05K1/16

CPC分类号： H01R13/2407 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： An interface device for coupling an electrical device to a metal junction includes a conformable conductor plate having a first side and a second side. The interface device also includes a plurality of first channels that intersect with a plurality of second channels formed on at least one of the first side and the second side. The formation of the first channels and the second channels weaken the conductor plate. A plurality of protrusions is formed by the intersection of the first channels and the second channels. The protrusions are deformable by coupling the conformable plate between the electrical device and the metal junction. An elongated slot formed throughout at least a portion of the interface device.

摘要翻译： 用于将电子装置耦合到金属结的接口装置包括具有第一侧和第二侧的一致的导体板。 接口装置还包括与形成在第一侧和第二侧中的至少一个上的多个第二通道相交的多个第一通道。 第一通道和第二通道的形成削弱了导体板。 多个突起由第一通道和第二通道的相交形成。 通过将电气装置和金属结之间的适形板联接可以使凸起变形。 在接口装置的至少一部分上形成的细长槽。