公开(公告)号：US20120182695A1

公开(公告)日：2012-07-19

申请号：US13428584

申请日：2012-03-23

申请人： Shogo MORI ,  Shinobu TAMURA ,  Shinobu YAMAUCHI ,  Taizo KURIBAYASHI

发明人： Shogo MORI ,  Shinobu TAMURA ,  Shinobu YAMAUCHI ,  Taizo KURIBAYASHI

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20518 ,  H01L2924/00

摘要： A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

摘要翻译： 公开了一种半导体器件，其包括绝缘基板，金属布线层，半导体元件，散热器和位于绝缘基板和散热片之间的应力松弛元件。 散热器具有沿一个方向延伸并且间隔地布置的多个分隔壁。 应力缓和构件包括通过延伸穿过应力松弛构件的整个厚度的通孔形成的应力吸收部分。 每个孔形成为使得其沿着分隔壁的纵向的尺寸大于沿着分隔壁的排列方向的尺寸。

公开(公告)号：US20100051234A1

公开(公告)日：2010-03-04

申请号：US12546149

申请日：2009-08-24

申请人： Shogo MORI ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

发明人： Shogo MORI ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

IPC分类号： F28D15/00

CPC分类号： H01L23/473 ,  F28F3/025 ,  F28F3/12 ,  F28F2265/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet. A fin for forming flow channels is disposed within the casing between the inlet and the outlet. A portion of the interior of the casing located rearward of the fin is an inlet header section, and a portion of the interior of the casing located frontward of the fin is an outlet header section. A rear side surface within the inlet header section is skewed toward the fin in a direction from the right side toward the left side. A positioning vertical surface extending straight along the left-right direction and positioning a rear end portion of the fin is provided on a lower portion of a left end portion of the rear side surface within the inlet header section. The rear end portion of the fin is in contact with the positioning vertical surface.

摘要翻译： 液冷式冷却装置包括具有冷却液入口和冷却液出口的壳体。 用于形成流动通道的翅片设置在壳体内的入口和出口之间。 位于翅片后方的壳体内部的一部分是入口集管部分，并且位于翅片前方的壳体内部的一部分是出口集管部分。 入口集管部分内的后侧表面在从右侧向左侧的方向上朝翅片倾斜。 在入口集管部分中的后侧表面的左端部的下部设置有沿着左右方向直线延伸并且定位翅片的后端部的定位垂直表面。 翅片的后端部与定位垂直面接触。

公开(公告)号：US08472193B2

公开(公告)日：2013-06-25

申请号：US12496391

申请日：2009-07-01

申请人： Shogo Mori ,  Shinobu Tamura ,  Shinobu Yamauchi ,  Taizo Kuribayashi

发明人： Shogo Mori ,  Shinobu Tamura ,  Shinobu Yamauchi ,  Taizo Kuribayashi

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20518 ,  H01L2924/00

摘要： A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

公开(公告)号：US20100051235A1

公开(公告)日：2010-03-04

申请号：US12546423

申请日：2009-08-24

申请人： Shogo MORI ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

发明人： Shogo MORI ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

IPC分类号： F28D15/00 ,  F28F7/00 ,  H01L23/473

CPC分类号： H01L23/473 ,  F28F3/025 ,  F28F3/12 ,  F28F2265/32 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.

摘要翻译： 液冷式冷却装置包括壳体，其具有形成在壳体的后端部的冷却液入口和形成在壳体的前端部的冷却液出口。 用于形成冷却液从后侧朝向前侧流过的多个流路的波纹状散热片设置在壳体内，位于冷却液入口与冷却液出口之间。 发热体安装区域设置在壳体顶壁的外表面上。 与波纹状散热片的前端部和后端部接触以使波纹状散热片沿前后方向定位的突出部设置在壳体的底壁的内表面上，在左右方向 从对应于发热体安装区域的内表面区域。

公开(公告)号：US20100002399A1

公开(公告)日：2010-01-07

申请号：US12496391

申请日：2009-07-01

申请人： Shogo Mori ,  Shinobu Tamura ,  Shinobu Yamauchi ,  Taizo Kuribayashi

发明人： Shogo Mori ,  Shinobu Tamura ,  Shinobu Yamauchi ,  Taizo Kuribayashi

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20518 ,  H01L2924/00

摘要： A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

摘要翻译： 公开了一种半导体器件，其包括绝缘基板，金属布线层，半导体元件，散热器和位于绝缘基板和散热片之间的应力松弛元件。 散热器具有沿一个方向延伸并且间隔地布置的多个分隔壁。 应力缓和构件包括通过延伸穿过应力松弛构件的整个厚度的通孔形成的应力吸收部分。 每个孔形成为使得其沿着分隔壁的纵向的尺寸大于沿着分隔壁的排列方向的尺寸。

公开(公告)号：US09406585B2

公开(公告)日：2016-08-02

申请号：US12546423

申请日：2009-08-24

申请人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

发明人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

IPC分类号： F28F3/12 ,  H01L23/473 ,  H01L21/48 ,  F28F3/02

CPC分类号： H01L23/473 ,  F28F3/025 ,  F28F3/12 ,  F28F2265/32 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.

摘要翻译： 液冷式冷却装置包括壳体，其具有形成在壳体的后端部的冷却液入口和形成在壳体的前端部的冷却液出口。 用于形成冷却液从后侧朝向前侧流过的多个流路的波纹状散热片设置在壳体内，位于冷却液入口与冷却液出口之间。 发热体安装区域设置在壳体顶壁的外表面上。 与波纹状散热片的前端部和后端部接触，从而将波纹状散热片朝前后方向定位的突出部设置在壳体的底壁的内表面上，在左右方向 从对应于发热体安装区域的内表面区域。

公开(公告)号：US09159645B2

公开(公告)日：2015-10-13

申请号：US12546149

申请日：2009-08-24

申请人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

发明人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

IPC分类号： F28F7/00 ,  H01L23/473 ,  F28F3/02 ,  F28F3/12

CPC分类号： H01L23/473 ,  F28F3/025 ,  F28F3/12 ,  F28F2265/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet. A fin for forming flow channels is disposed within the casing between the inlet and the outlet. A portion of the interior of the casing located rearward of the fin is an inlet header section, and a portion of the interior of the casing located frontward of the fin is an outlet header section. A rear side surface within the inlet header section is skewed toward the fin in a direction from the right side toward the left side. A positioning vertical surface extending straight along the left-right direction and positioning a rear end portion of the fin is provided on a lower portion of a left end portion of the rear side surface within the inlet header section. The rear end portion of the fin is in contact with the positioning vertical surface.

摘要翻译： 液冷式冷却装置包括具有冷却液入口和冷却液出口的壳体。 用于形成流动通道的翅片设置在壳体内的入口和出口之间。 位于翅片后方的壳体内部的一部分是入口集管部分，并且位于翅片前方的壳体内部的一部分是出口集管部分。 入口集管部分内的后侧表面在从右侧向左侧的方向上朝翅片倾斜。 在入口集管部分中的后侧表面的左端部的下部设置有沿着左右方向直线延伸并且定位翅片的后端部的定位垂直表面。 翅片的后端部与定位垂直面接触。

公开(公告)号：US20110094722A1

公开(公告)日：2011-04-28

申请号：US12911357

申请日：2010-10-25

申请人： Shogo MORI ,  Satoshi Ito ,  Seiji Matsushima ,  Taizo Kuribayashi

发明人： Shogo MORI ,  Satoshi Ito ,  Seiji Matsushima ,  Taizo Kuribayashi

IPC分类号： F28F1/10

CPC分类号： H01L23/473 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled-type cooling device includes a casing having a cooling-liquid flow channel. Fins are provided on an inner surface of a top wall of the casing. Each fin has a wavy shape on a horizontal plane perpendicular to a fin height direction. In a left fin of two adjacent fins, lines of intersection between the horizontal plane and right side surfaces of two slant portions connecting two adjacent wave crest portions and a wave trough portion therebetween intersect each other at a first point located on a first straight line. In a right fin, lines of intersection between the horizontal plane and left side surfaces of two slant portions connecting two adjacent wave trough portions and a wave crest portion therebetween intersect each other at a second point located on a second straight line. The first straight line is located on the right fin side of the second straight line.

摘要翻译： 液冷式冷却装置包括具有冷却液流路的壳体。 翅片设置在壳体顶壁的内表面上。 每个翅片在垂直于翅片高度方向的水平面上具有波浪形状。 在两个相邻翅片的左翅片中，连接两个相邻波峰部分的两个倾斜部分的水平面和右侧表面之间的相交线与其间的波谷部分在位于第一直线上的第一点处彼此相交。 在右翅片中，连接两个相邻波谷部分的两个倾斜部分的水平面和左侧表面之间的交叉线和其上的波峰部分在位于第二直线上的第二点处彼此相交。 第一条直线位于第二条直线的右侧翼边。

公开(公告)号：US09190344B2

公开(公告)日：2015-11-17

申请号：US12740024

申请日：2008-11-25

申请人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

发明人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

IPC分类号： F28F7/00 ,  F28D15/00 ,  F28F3/12 ,  H01L23/473

CPC分类号： H01L23/473 ,  B60L1/003 ,  B60L3/003 ,  B60L2240/36 ,  B60L2240/525 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

摘要： A casing of a liquid-cooled-type cooling device has a peripheral wall including mutually facing right and left side walls. A cooling-liquid inlet is formed at one end of the right side wall, and a cooling-liquid outlet is formed at an end of the left side wall corresponding to the other end of the right side wall. A parallel-flow-channel section is provided within the casing to be located between the left and right side walls and between the cooling-liquid inlet and outlet and includes flow channels through which cooling liquid flows. Internal regions of the casing located upstream and downstream of the parallel-flow-channel section serve as inlet and outlet header sections, respectively. The cross-sectional area of the inlet header section reduces from the cooling-liquid inlet toward the left side wall. The outlet and inlet header sections are asymmetric in shape with respect to the width direction of the parallel-flow-channel section.

摘要翻译： 液冷式冷却装置的壳体具有包括相互面对的左右侧壁的周壁。 在右侧壁的一端形成有冷却液入口，在左侧壁的与右侧壁的另一端对应的端部形成冷却液出口。 壳体内设有平行流道部分，位于左右侧壁之间和冷却液入口与出口之间，并包括冷却液流过的流动通道。 位于平行流道部分上游和下游的壳体的内部区域分别用作入口和出口集管部分。 入口集管部分的横截面积从冷却液入口朝向左侧壁减小。 出口和入口集管部分相对于平行流道部分的宽度方向的形状是不对称的。

公开(公告)号：US08958208B2

公开(公告)日：2015-02-17

申请号：US13428542

申请日：2012-03-23

申请人： Shogo Mori ,  Shinobu Tamura ,  Shinobu Yamauchi ,  Taizo Kuribayashi

发明人： Shogo Mori ,  Shinobu Tamura ,  Shinobu Yamauchi ,  Taizo Kuribayashi

IPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/473

CPC分类号： H01L23/367 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20518 ,  H01L2924/00

摘要： A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

摘要翻译： 公开了一种半导体器件，其包括绝缘基板，金属布线层，半导体元件，散热器和位于绝缘基板和散热片之间的应力松弛元件。 散热器具有沿一个方向延伸并且间隔地布置的多个分隔壁。 应力缓和构件包括通过延伸穿过应力松弛构件的整个厚度的通孔形成的应力吸收部分。 每个孔形成为使得其沿着分隔壁的纵向的尺寸大于沿着分隔壁的排列方向的尺寸。