摘要:
An electric compressor includes a built-in electric motor for driving the compressor and a connection section between an external terminal for power supply to the electric motor and the end of a wire from a stator of the electric motor and is stored in a compressor housing. The connection section is constructed from a housing side coupler engaged with the compressor housing, a power supply-external terminal side coupler engaged with the housing side coupler, and a stator side coupler for holding the end of the wire from the stator, fitted to the power supply-external terminal side coupler, and engaged with the housing side coupler. Vibration resistance of a terminal connection section for the motor is improved and breakage and momentary electrical interruption at the terminal connection section may be prevented, with productivity of the compressor maintained at a good level.
摘要:
An electric compressor having a built-in electric motor for driving the compressor and in which a connection section between an external terminal for power supply to the electric motor and the end of a wire from a stator of the electric motor is stored in a compressor housing. The electric compressor is characterized in that the connection section is constructed from a housing side coupler engaged with the compressor housing, a power supply-external terminal side coupler engaged with the housing side coupler, and a stator side coupler for holding the end of the wire from the stator, fitted to the power supply-external terminal side coupler, and engaged with the housing side coupler. In this electric compressor, vibration resistance of a terminal connection section for the motor is improved and breakage and momentary electrical interruption at the terminal connection section can be prevented, with productivity of the compressor maintained at a good level.
摘要:
A semiconductor device comprises a memory cell array and a source line driver. Each of the memory cells in the memory cell array has a floating gate cell transistor which stores data by accumulating charge in the floating gate and a select gate transistor whose drain is connected to the source of the cell transistor and whose source is connected to a source line. The source line driver is configured so as to drive the source line in a write operation at a potential between the substrate bias potential of the cell transistor and select gate transistor and the ground potential.
摘要:
A semiconductor memory device includes a plurality of memory cells, a plurality of local bit lines, a global bit line, a first switch element, and a holding circuit. The memory cell includes first and second MOS transistors. The first MOS transistor has a charge accumulation layer and a control gate. The second MOS transistor has one end of its current path connected to one end of a current path of the first MOS transistor. The local bit line connects other end of the current paths of the first MOS transistors. The first switch element makes a connection between the local bit lines and the global bit line. The holding circuit is connected to the global bit line and holds data to be written into the memory cells.
摘要:
A semiconductor device comprises a memory cell array and a source line driver. Each of the memory cells in the memory cell array has a floating gate cell transistor which stores data by accumulating charge in the floating gate and a select gate transistor whose drain is connected to the source of the cell transistor and whose source is connected to a source line. The source line driver is configured so as to drive the source line in a write operation at a potential between the substrate bias potential of the cell transistor and select gate transistor and the ground potential.
摘要:
A terminal connection structure of a motor incorporated within a compressor for connecting feed terminals for a stator of a motor to the compressor includes a lid, which is attached to a compressor body portion for securing external feed terminals with a hermetic seal. The terminal connection structure is provided with a resin chamber on an inner surface of the lid, through which the external feed terminals extend, and a resin housing containing wire-side terminals, which are provided at ends of wires connected to the stator and which are connected to the external feed terminals. In the structure, superior insulation properties may be obtained even if the compressor size is reduced, and the productivity and assembling performance of the compressor may be improved.
摘要:
A semiconductor memory device includes a plurality of memory cells, a memory cell array, bit lines, word lines, select gate lines, a column decoder, a first row decoder, a second row decoder, and first metal wiring. The memory cell includes a first MOS transistor with a charge accumulation layer and a control gate and a second MOS transistor connected to the first MOS transistor. The memory cell array has the memory cells arranged in a matrix. The word line connects commonly the control gates in the same row. The select gate line connects commonly the gates of the second MOS transistors in the same row. The first metal wiring layers are provided for every select gate lines, and pass through almost the central part of the memory cells. The first metal wiring layer is connected electrically to one of the select gate lines.
摘要:
A semiconductor memory system comprises a nonvolatile memory and a controller configured to control the nonvolatile memory. The controller causes management data for page data to be inputted to a redundant area of the nonvolatile memory before the execution of a program and, when moving the page data in the nonvolatile memory to one other page, controls the reading of the page data to check the page data for errors during a program period for the one other page.
摘要:
A semiconductor chip includes a logic circuit unit, at least one memory macro unit having a redundant memory cell which recovers a defect cell, electrode pad rows being arranged around the outside of the logic circuit unit and the memory macro unit, and the least one fuse unit group storing addresses of the defect cell and being arranged in a region along any edge of the semiconductor chip, and on the outside of the logic circuit unit, the memory macro unit and the electrode pad rows. Here, the logic circuit unit, the memory macro unit, the electrode pad rows and the fuse unit group are positioned on a semiconductor chip surface.
摘要:
A fuse circuit 1 comprises an electrically programmable fuse 10 and a data latch circuit 11 to hold programmed fuse data. In the data latch circuit 11, prior to programming, a node FUADD is precharged to “H” by a precharge circuit 14 and preset at “H” as the result of the logical product of a fail address FAADD and a latch signal LATCHp by a preset circuit 12 when the fuse 10 needs to be programmed. A programming selecting circuit 13 monitors the node FUADD to select whether to perform or not to performance the programming of the fuse 10. Accordingly, efficient electric programming control becomes possible without using a dedicated register to hold a fuse address to be programmed.