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公开(公告)号：US09698114B2
公开(公告)日：2017-07-04
申请号：US13071841
申请日：2011-03-25
申请人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
发明人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/11 , H01L24/14 , H01L24/29 , H01L2224/0401 , H01L2224/05147 , H01L2224/05599 , H01L2224/11464 , H01L2224/13 , H01L2224/13017 , H01L2224/13084 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13564 , H01L2224/13611 , H01L2224/13639 , H01L2224/13647 , H01L2224/29147 , H01L2224/29155 , H01L2924/00014 , H01L2924/01005 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/35 , H05K3/244 , H01L2924/00
摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
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公开(公告)号：US08399264B2
公开(公告)日：2013-03-19
申请号：US12957169
申请日：2010-11-30
申请人： Zhihua Zou , Liang Zhang , Sheng Li , Tamil Selvamuniandy
发明人： Zhihua Zou , Liang Zhang , Sheng Li , Tamil Selvamuniandy
CPC分类号： H01L22/12 , G06T7/0004 , G06T7/66 , G06T2207/30141 , H05K1/0269 , H05K3/3452 , H05K2203/161
摘要： The present disclosure relates to the field of microelectronic substrate fabrication and, more particularly, to alignment inspection for vias formed in the microelectronic substrates. The alignment inspection may be achieved by determining the relative positions of fluorescing and non-fluorescing elements in a microelectronic substrate.
摘要翻译： 本公开涉及微电子衬底制造的领域，更具体地，涉及在微电子衬底中形成的通孔的对准检查。 可以通过确定微电子衬底中荧光和非荧光元件的相对位置来实现对准检查。
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公开(公告)号：US07915060B2
公开(公告)日：2011-03-29
申请号：US12714310
申请日：2010-02-26
申请人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
发明人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/11 , H01L24/14 , H01L24/29 , H01L2224/0401 , H01L2224/05147 , H01L2224/05599 , H01L2224/11464 , H01L2224/13 , H01L2224/13017 , H01L2224/13084 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13564 , H01L2224/13611 , H01L2224/13639 , H01L2224/13647 , H01L2224/29147 , H01L2224/29155 , H01L2924/00014 , H01L2924/01005 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/35 , H05K3/244 , H01L2924/00
摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
摘要翻译： 提供了一种用于输入/输出连接的方法和装置。 用于连接结构的装置和方法显示出具有改善的机械性能，例如硬度和耐磨性。 提供了由于诸如金的材料成本的降低而制造成本较低的土地格栅阵列结构。 球栅阵列结构在制造过程中具有改善的耐腐蚀性。 球栅阵列结构还具有改善的机械性能，从而提高了冲击测试结果。
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公开(公告)号：US07670951B2
公开(公告)日：2010-03-02
申请号：US11167922
申请日：2005-06-27
申请人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
发明人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
IPC分类号： H01L21/44
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/11 , H01L24/14 , H01L24/29 , H01L2224/0401 , H01L2224/05147 , H01L2224/05599 , H01L2224/11464 , H01L2224/13 , H01L2224/13017 , H01L2224/13084 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13564 , H01L2224/13611 , H01L2224/13639 , H01L2224/13647 , H01L2224/29147 , H01L2224/29155 , H01L2924/00014 , H01L2924/01005 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/35 , H05K3/244 , H01L2924/00
摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
摘要翻译： 提供了一种用于输入/输出连接的方法和装置。 用于连接结构的装置和方法显示出具有改善的机械性能，例如硬度和耐磨性。 提供了由于诸如金的材料成本的降低而制造成本较低的土地格栅阵列结构。 球栅阵列结构在制造过程中具有改善的耐腐蚀性。 球栅阵列结构还具有改善的机械性能，从而提高了冲击测试结果。
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公开(公告)号：US20110169167A1
公开(公告)日：2011-07-14
申请号：US13071841
申请日：2011-03-25
申请人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
发明人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/11 , H01L24/14 , H01L24/29 , H01L2224/0401 , H01L2224/05147 , H01L2224/05599 , H01L2224/11464 , H01L2224/13 , H01L2224/13017 , H01L2224/13084 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13564 , H01L2224/13611 , H01L2224/13639 , H01L2224/13647 , H01L2224/29147 , H01L2224/29155 , H01L2924/00014 , H01L2924/01005 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/35 , H05K3/244 , H01L2924/00
摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
摘要翻译： 提供了一种用于输入/输出连接的方法和装置。 用于连接结构的装置和方法显示出具有改善的机械性能，例如硬度和耐磨性。 提供了由于诸如金的材料成本的降低而制造成本较低的土地格栅阵列结构。 球栅阵列结构在制造过程中具有改善的耐腐蚀性。 球栅阵列结构还具有改善的机械性能，从而提高了冲击测试结果。
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公开(公告)号：US20100148365A1
公开(公告)日：2010-06-17
申请号：US12714310
申请日：2010-02-26
申请人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
发明人： Munehiro Toyama , Siew Fong Tai , Kian Sin Sim , Charan K. Gurumurthy , Selvy Tamil Selvamuniandy
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/11 , H01L24/14 , H01L24/29 , H01L2224/0401 , H01L2224/05147 , H01L2224/05599 , H01L2224/11464 , H01L2224/13 , H01L2224/13017 , H01L2224/13084 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13564 , H01L2224/13611 , H01L2224/13639 , H01L2224/13647 , H01L2224/29147 , H01L2224/29155 , H01L2924/00014 , H01L2924/01005 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/35 , H05K3/244 , H01L2924/00
摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
摘要翻译： 提供了一种用于输入/输出连接的方法和装置。 用于连接结构的装置和方法显示出具有改善的机械性能，例如硬度和耐磨性。 提供了由于诸如金的材料成本的降低而制造成本较低的土地格栅阵列结构。 球栅阵列结构在制造过程中具有改善的耐腐蚀性。 球栅阵列结构还具有改善的机械性能，从而提高了冲击测试结果。
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