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    Detection of a wafer edge using collimated light
    2.
    发明授权
    Detection of a wafer edge using collimated light 失效
    使用准直光检测晶圆边缘

    公开(公告)号：US07280200B2

    公开(公告)日：2007-10-09

    申请号：US10891835

    申请日：2004-07-15

    申请人： Mark P. Plemmons ,  Timothy R. Tiemeyer

    发明人： Mark P. Plemmons ,  Timothy R. Tiemeyer

    IPC分类号： G01N21/00 ,  G01N21/95 ,  G01B11/24 ,  G01B11/30

    CPC分类号： G01N21/9503

    摘要： A system and method of inspecting a semiconductor wafer that may be employed to detect and to characterize defects occurring on an edge of the wafer. The wafer inspection system includes an optical module for providing a light source to scan the wafer edge, a light channel detector for detecting light reflected from the wafer edge, and a processor and memory for converting detected signals to digital form, and for filtering and processing the digital data. The module includes a wafer edge scanning mechanism for projecting a collimated laser beam toward the wafer edge at a predetermined angle of incidence to scan the wafer edge for defects. The light channel detector detects light reflected from the wafer edge to obtain wafer edge data, which are applied to thresholds to determine the location of defects in the wafer edge.

    摘要翻译： 检查半导体晶片的系统和方法，该半导体晶片可用于检测和表征在晶片边缘上发生的缺陷。 晶片检查系统包括用于提供扫描晶片边缘的光源的光学模块，用于检测从晶片边缘反射的光的光通道检测器，以及用于将检测到的信号转换为数字形式的处理器和存储器，以及用于滤波和处理 数字数据。 该模块包括晶片边缘扫描机构，用于以预定的入射角将准直激光束投射到晶片边缘以扫描晶片边缘以获得缺陷。 光通道检测器检测从晶片边缘反射的光以获得晶片边缘数据，其被应用于阈值以确定晶片边缘中的缺陷的位置。