Detection of a wafer edge using collimated light
    1.
    发明申请
    Detection of a wafer edge using collimated light 失效
    使用准直光检测晶圆边缘

    公开(公告)号:US20050024632A1

    公开(公告)日:2005-02-03

    申请号:US10891835

    申请日:2004-07-15

    CPC classification number: G01N21/9503

    Abstract: A system and method of inspecting a semiconductor wafer that may be employed to detect and to characterize defects occurring on an edge of the wafer. The wafer inspection system includes an optical module for providing a light source to scan the wafer edge, a light channel detector for detecting light reflected from the wafer edge, and a processor and memory for converting detected signals to digital form, and for filtering and processing the digital data. The module includes a wafer edge scanning mechanism for projecting a collimated laser beam toward the wafer edge at a predetermined angle of incidence to scan the wafer edge for defects. The light channel detector detects light reflected from the wafer edge to obtain wafer edge data, which are applied to thresholds to determine the location of defects in the wafer edge.

    Abstract translation: 检查半导体晶片的系统和方法,该半导体晶片可用于检测和表征在晶片边缘上发生的缺陷。 晶片检查系统包括用于提供扫描晶片边缘的光源的光学模块,用于检测从晶片边缘反射的光的光通道检测器,以及用于将检测到的信号转换为数字形式的处理器和存储器,以及用于滤波和处理 数字数据。 该模块包括晶片边缘扫描机构,用于以预定的入射角将准直激光束投射到晶片边缘以扫描晶片边缘以获得缺陷。 光通道检测器检测从晶片边缘反射的光以获得晶片边缘数据,其被应用于阈值以确定晶片边缘中的缺陷的位置。

    Threshold determination in an inspection system
    3.
    发明授权
    Threshold determination in an inspection system 有权
    检查系统中的阈值确定

    公开(公告)号:US08260035B2

    公开(公告)日:2012-09-04

    申请号:US11525527

    申请日:2006-09-22

    Abstract: A method and system for inspecting a surface of a semiconductor workpiece comprises providing a surface inspection system and using the surface inspection apparatus to cause laser light to impinge upon a test location on the workpiece surface and thereby cause the laser light to emerge from the surface as returned light comprising at least one of reflected light and scatter light; collecting the returned light and generating a signal from the returned and collected light, the signal comprising a signal value representative of a characteristic of the workpiece surface at the test location; providing a plurality of threshold candidates and causing the surface inspection system to select a threshold from among the plurality of threshold candidates; comparing the threshold to the signal value to obtain a difference value; using the difference value to assess the characteristic of the workpiece surface at the test location; and using the surface inspection system to automatically cause the method to be repeated for a plurality of test locations on the workpiece surface.

    Abstract translation: 用于检查半导体工件的表面的方法和系统包括提供表面检查系统并使用表面检查装置使激光照射到工件表面上的测试位置,从而使激光从表面出射为 返回的光包括反射光和散射光中的至少一种; 收集所返回的光并从返回和收集的光产生信号,所述信号包括代表在测试位置处的工件表面的特性的信号值; 提供多个阈值候选,并使所述表面检查系统从所述多个阈值候选中选择阈值; 将阈值与信号值进行比较以获得差值; 使用差值来评估测试位置处工件表面的特性; 并且使用表面检查系统自动地对工件表面上的多个测试位置重复该方法。

    System and method for defect detection threshold determination in an workpiece surface inspection system
    4.
    发明申请
    System and method for defect detection threshold determination in an workpiece surface inspection system 有权
    工件表面检测系统中缺陷检测阈值的系统和方法

    公开(公告)号:US20080075353A1

    公开(公告)日:2008-03-27

    申请号:US11525527

    申请日:2006-09-22

    Abstract: A method and system for inspecting a surface of a semiconductor workpiece comprises providing a surface inspection system and using the surface inspection apparatus to cause laser light to impinge upon a test location on the workpiece surface and thereby cause the laser light to emerge from the surface as returned light comprising at least one of reflected light and scatter light; collecting the returned light and generating a signal from the returned and collected light, the signal comprising a signal value representative of a characteristic of the workpiece surface at the test location; providing a plurality of threshold candidates and causing the surface inspection system to select a threshold from among the plurality of threshold candidates; comparing the threshold to the signal value to obtain a difference value; using the difference value to assess the characteristic of the workpiece surface at the test location; and using the surface inspection system to automatically cause the method to be repeated for a plurality of test locations on the workpiece surface.

    Abstract translation: 用于检查半导体工件的表面的方法和系统包括提供表面检查系统并使用表面检查装置使激光照射到工件表面上的测试位置,从而使激光从表面出射为 返回的光包括反射光和散射光中的至少一种; 收集所返回的光并从返回和收集的光产生信号,所述信号包括代表在测试位置处的工件表面的特性的信号值; 提供多个阈值候选,并使所述表面检查系统从所述多个阈值候选中选择阈值; 将阈值与信号值进行比较以获得差值; 使用差值来评估测试位置处工件表面的特性; 并且使用表面检查系统自动地对工件表面上的多个测试位置重复该方法。

    System and method for detecting surface features on a semiconductor workpiece surface
    6.
    发明申请
    System and method for detecting surface features on a semiconductor workpiece surface 审中-公开
    用于检测半导体工件表面上的表面特征的系统和方法

    公开(公告)号:US20090073440A1

    公开(公告)日:2009-03-19

    申请号:US11541493

    申请日:2006-09-30

    Inventor: Timothy Tiemeyer

    CPC classification number: G01N21/9501

    Abstract: A method and system for inspecting a surface of a semiconductor workpiece comprises providing a surface inspection system and using the surface inspection apparatus to cause laser light to impinge upon a test location on the workpiece surface and thereby cause the laser light to emerge from the surface as returned light comprising at least one of reflected light and scatter light; collecting the returned light and generating a signal from the returned and collected light, the signal comprising a signal value representative of a characteristic of the workpiece surface at the test location; providing a plurality of threshold candidates and causing the surface inspection system to select a threshold from among the plurality of threshold candidates; comparing the threshold to the signal value to obtain a difference value; using the difference value to assess the characteristic of the workpiece surface at the test location; and using the surface inspection system to automatically cause the method to be repeated for a plurality of test locations on the workpiece surface.

    Abstract translation: 用于检查半导体工件的表面的方法和系统包括提供表面检查系统并使用表面检查装置使激光照射到工件表面上的测试位置,从而使激光从表面出射为 返回的光包括反射光和散射光中的至少一种; 收集所返回的光并从返回和收集的光产生信号,所述信号包括代表在测试位置处的工件表面的特性的信号值; 提供多个阈值候选,并使所述表面检查系统从所述多个阈值候选中选择阈值; 将阈值与信号值进行比较以获得差值; 使用差值来评估测试位置处工件表面的特性; 并且使用表面检查系统自动地对工件表面上的多个测试位置重复该方法。

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