METHOD FOR AUTOMATICALLY CHECKING SEQUENCE OF LOADING BOATS AND BATCHES FOR SEMICONDUCTOR MANUFACTURING PROCESS
    7.
    发明申请
    METHOD FOR AUTOMATICALLY CHECKING SEQUENCE OF LOADING BOATS AND BATCHES FOR SEMICONDUCTOR MANUFACTURING PROCESS 有权
    用于自动检查加载船的序列和半导体制造过程的批量的方法

    公开(公告)号:US20080306623A1

    公开(公告)日:2008-12-11

    申请号:US11759628

    申请日:2007-06-07

    Inventor: Chien-Ting Kang

    CPC classification number: G05B19/41875 G05B2219/45031 Y02P90/22

    Abstract: A method for automatically checking a sequence of loading boats and batches for a semiconductor manufacturing process is provided. According to a developed logic, a loading sequence is automatically calculated by a system. By comparing the actual loading sequence with the calculated sequence when the boats are entering, it is ensured that no errors occur when loading the boats in the batches. When loading the boats in the batches, operators can truly load the boats in the batches according to the entering sequence together with the current confirmation mechanism, so as to ensure the boat positions for the loaded materials to be correct. The method for automatically checking the sequence of loading boats and batches is further capable of calculating the loading sequence through the developed logic by automatically determining runnable boat positions for the material after recording a parameter for detecting a previous boat by the system.

    Abstract translation: 提供了一种用于自动检查用于半导体制造过程的装载船和批次的顺序的方法。 根据开发的逻辑,系统自动计算加载序列。 通过将实际装载顺序与船舶进入时的计算顺序进行比较,确保在批量装载船只时不会发生错误。 当批量装载船只时,操作人员可以根据输入顺序真实地将批量的船舶与当前的确认机构一起装载,以确保装载的物料的船只位置正确。 用于自动检查装载船和批次的顺序的方法还能够通过在记录由系统检测先前船的参数之后自动确定材料的运行船位置来计算开发逻辑的加载顺序。

    Microphone package
    10.
    发明授权

    公开(公告)号:US09813790B1

    公开(公告)日:2017-11-07

    申请号:US15416101

    申请日:2017-01-26

    Inventor: Rui Zhang Ting Kang

    Abstract: A microphone package includes a housing; a control circuit chip accommodated in the housing; a micro-electromechanical chip accommodated in the housing; and a circuit board forming an accommodation space with the housing. The circuit board includes a substrate, a rigid conductive layer disposed on the substrate and a plurality of conductive pads on the substrate for connecting to the control circuit chip. The micro-electromechanical chip and the control circuit chip are mounted on the rigid conductive layer, and the rigid conductive layer is provided with a number of isolation holes for receiving the conductive pads.

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