Microphone package
    1.
    发明授权

    公开(公告)号:US09813790B1

    公开(公告)日:2017-11-07

    申请号:US15416101

    申请日:2017-01-26

    Inventor: Rui Zhang Ting Kang

    Abstract: A microphone package includes a housing; a control circuit chip accommodated in the housing; a micro-electromechanical chip accommodated in the housing; and a circuit board forming an accommodation space with the housing. The circuit board includes a substrate, a rigid conductive layer disposed on the substrate and a plurality of conductive pads on the substrate for connecting to the control circuit chip. The micro-electromechanical chip and the control circuit chip are mounted on the rigid conductive layer, and the rigid conductive layer is provided with a number of isolation holes for receiving the conductive pads.

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